CN100436371C - Method of lowering sinter temperature of (Zr0.8 Sn0.2) TiO4 ceramic - Google Patents

Method of lowering sinter temperature of (Zr0.8 Sn0.2) TiO4 ceramic Download PDF

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Publication number
CN100436371C
CN100436371C CNB2006100883715A CN200610088371A CN100436371C CN 100436371 C CN100436371 C CN 100436371C CN B2006100883715 A CNB2006100883715 A CN B2006100883715A CN 200610088371 A CN200610088371 A CN 200610088371A CN 100436371 C CN100436371 C CN 100436371C
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Prior art keywords
sintering temperature
tio
ceramic
nonex
frit
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CN1887792A (en
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汤乐群
李军
金玉成
黄新友
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ZHENJIANG LANBAOSHI ELECTRONIC INDUSTRY Co Ltd
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ZHENJIANG LANBAOSHI ELECTRONIC INDUSTRY Co Ltd
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Abstract

The method of lowering sinter temperature of (Zr0.8Sn0.2)TiO4 ceramic belongs to the field of microwave dielectric material producing technology. The ceramic material is prepared with (Zr0.8Sn0.2)TiO4 as main material, ZnO 0.5 wt%, MnCO3 0.3 wt% and CeO2 0.5 wt%, and through pre-sintering at 1180 deg.c for 4 hr, crushing, 200-mesh sieving and subsequent conventional ceramic preparing process. The present invention features that during the crushing and mixing, lead borate glass in 2-6 wt% and fused Bi2O3/Li2O block in 1-5 wt% are added to lower the sintering temperature to 1230-1300 deg.c, and when lead borate glass in 4 wt% and fused Bi2O3/Li2O block in 3 wt% are added and the sintering temperature is 1250 deg.c, best performance of the ceramic may be obtained.

Description

A kind of reduction (Zr 0.8Sn 0.2) TiO 4The method of ceramic sintering temperature
Technical field
The invention belongs to microwave dielectric material manufacturing technology field, particularly a kind of solid solution ceramic material of low sintering high quality factor is exactly a kind of reduction (Zr concretely 0.8Sn 0.2) TiO 4The method of ceramic sintering temperature.
Background technology
(Zr 1-xSn x) TiO 4The pottery source is wide, and the Q value is high, and temperature stability is good, is widely used in various dielectric resonators and the wave filter.(Zr 1-xSn x) TiO 4The principal crystalline phase of pottery is with iris ZrTiO 4(Zr, Sn) sosoloid for the basis has good microwave property.When x<0.3, formation be monocrystalline (Zr 1-xSn x) TiO 4, wherein especially with x=0.2, i.e. (Zr 0.8Sn 0.2) TiO 4(being abbreviated as ZST) material microwave performance is best.But the ZST firing temperature is up to 1380~1400 ℃, and how to deal with problems is urgent problem.People want that by doping vario-property when reducing sintering temperature, material keeps original superior dielectric properties.Shi Yong etc. are at " University Of Tianjin's journal " ZnO-MoO that the 2nd phase delivered in 2004 3Add (Zr 0.8Sn 0.2) TiO 4Dielectric properties one literary composition in mention, adds a small amount of ZnO separately and can reduce sintering temperature, but dielectric loss increases, Wu Jianqiang is in the 42nd the 3rd phase of volume of " Chinese pottery " March in 2006, doped-glass makes (Zr 0.8Sn 0.2) TiO 4Sintering temperature reduce, but the glass ingredient complexity, complicated process of preparation, and sintering temperature is still about 1320 ℃.Can find a kind of effective reduction (Zr 0.8Sn 0.2) TiO 4Can the method for ceramic sintering temperature just becomes make full use of (Zr 0.8Sn 0.2) TiO 4The key of pottery excellent dielectric properties.
Summary of the invention
The invention provides and a kind ofly can effectively reduce (Zr 0.8Sn 0.2) TiO 4The method of sintering temperature, and can keep original dielectric properties, sintering range is 1230 ℃~1300 ℃, method is simple.
A kind of reduction (Zr 0.8Sn 0.2) TiO 4The method of ceramic sintering temperature, major ingredient are (Zr 0.8Sn 0.2) TiO 4, ZnO, the 0.3wt%MnCO of the 0.5wt% of adding major ingredient weight 3, 0.5wt%CeO 2, synthetic in 1180 ℃ of insulations pre-burning in 4 hours, pulverize, cross 200 mesh sieves, stand-by, adopt common process to prepare stupalith then, it is characterized in that: in pulverizing mixing process, added the nonex of 2~6wt% of major ingredient weight and the Bi of 1~5wt% 2O 3/ Li 2O frit, sintering temperature are got 1230 ℃~1300 ℃, wherein get the Bi of 4wt% nonex and 3wt% 2O 3/ Li 2The O frit is at 1250 ℃ of sintering, and ceramic performance is best.
The nonex preparation process is as follows: with Pb 3O 4And B 2O 3With (4/3): 1 molar ratio mixed grinding mixing, compound be 1000 ℃ of fusions, and be incubated 50 minutes, pours into subsequently and carry out quenching in the cold water.Solidified glass drying is ground later on up to sieving 200 mesh sieve, stays with stand-by.
Bi 2O 3/ Li 2O frit preparation process is as follows: with Bi 2O 3And Li 2CO 3Grind mixing with 92: 11 mixed in molar ratio, compound is placed in the corundum crucible and forms Solid solution down at 830 ℃, is incubated 40 minutes, pours into subsequently and carries out quenching in the cold water, grinds up to sieving 200 mesh sieves after the drying, stays with standby.
It is low that the present invention has sintering temperature, and according to the difference of forming proportioning, sintering temperature does not reduce the dielectric properties of stupalith simultaneously at 1230 ℃~1300 ℃.The simple cost of preparation technology is low.
Description of drawings
Fig. 1 is for adopting the microstructure of the present invention's agglomerated material in the time of 1250 ℃
The process flow sheet of Fig. 2 specimen preparation
Embodiment
Embodiment The hotchpotch add-on Sintering temperature ℃ DIELECTRIC CONSTANT r Q(f=7GHZ)
Embodiment 1 The Bi of 2wt% nonex and 1wt% 2O 3/Li 2The O frit 1300 42 6600
Embodiment 2 The Bi of 2wt% nonex and 1wt% 2O 3/Li 2The O frit 1280 39 6350
Embodiment 3 The Bi of 4wt% nonex and 3wt% 2O 3/Li 2The O frit 1280 44 6930
Embodiment 4 The Bi of 4wt% nonex and 3wt% 2O 3/Li 2The O frit 1250 44 6900
Embodiment 5 The Bi of 4wt% nonex and 3wt% 2O 3/Li 2The O frit 1230 35 6250
Embodiment 6 The Bi of 6wt% nonex and 5wt% 2O 3/Li 2The O frit 1230 31 6100
Embodiment 7 The Bi of 6wt% nonex and 5wt% 2O 3/Li 2The O frit 1250 33 6250
Embodiment 8 The Bi of 2wt% nonex and 5wt% 2O 3/Li 2The O frit 1250 39 6500
Embodiment 9 The Bi of 2wt% nonex and 5wt% 2O 3/Li 2The O frit 1280 40 6550
Embodiment 10 The Bi of 6wt% nonex and 1wt% 2O 3/Li 2The O frit 1260 37 6300
Embodiment 11 The Bi of 6wt% nonex and 1wt% 2O 3/Li 2The O frit 1300 39 6370
The present invention adopts common process to prepare stupalith, detailed process such as Fig. 2, the Bi of doping 4wt% nonex and 3wt% in major ingredient as can be seen 2O 3/ Li 2The O frit, sintering temperature is in the time of 1250 ℃, the dielectric properties of pottery are best, Fig. 1 is for adopting the microstructure of the present invention's agglomerated material 1250 ℃ the time, the ceramic crystalline grain even compact, this is because the low melting point additive forms earlier the liquid phase acceleration of sintering in sintering process, goes into principal crystalline phase as last phase resorption and plays the doping vario-property effect and arrived the sintering later stage.This " double effect " of low melting point additive can make sintering temperature reduce, and property retention is constant or raising.

Claims (4)

1, a kind of reduction (Zr 0.8Sn 0.2) TiO 4The method of ceramic sintering temperature, major ingredient are (Zr 0.8Sn 0.2) TiO 4, ZnO, the 0.3wt%MnCO of the 0.5wt% of adding major ingredient weight 3, 0.5wt%CeO 2, synthetic in 1180 ℃ of insulations pre-burning in 4 hours, pulverize, cross 200 mesh sieves, stand-by, adopt common process to prepare stupalith then, it is characterized in that: in pulverizing mixing process, added the nonex of 2~6wt% of major ingredient weight and the Bi of 1~5wt% 2O 3/ Li 2O frit, sintering temperature are got 1230 ℃~1300 ℃.
2, a kind of reduction (Zr according to claim 1 0.8Sn 0.2) TiO 4The method of ceramic sintering temperature is characterized in that: the Bi that gets major ingredient weight 4wt% nonex and 3wt% 2O 3/ Li 2The O frit is at 1250 ℃ of sintering.
3, a kind of reduction (Zr according to claim 1 0.8Sn 0.2) TiO 4The method of ceramic sintering temperature is characterized in that: the nonex preparation process is as follows: with Pb 3O 4And B 2O 3With (4/3): 1 molar ratio mixed grinding mixing, compound be 1000 ℃ of fusions, and be incubated 50 minutes, pours into subsequently and carry out quenching in the cold water, and solidified glass drying is ground later on up to sieving 200 mesh sieve.
4, a kind of reduction (Zr according to claim 1 0.8Sn 0.2) TiO 4The method of ceramic sintering temperature is characterized in that: Bi 2O 3/ Li 2The preparation process of O frit is as follows: with Bi 2O 3And Li 2CO 3Grind mixing with 92: 11 mixed in molar ratio, compound forms Solid solution down at 830 ℃, is incubated 40 minutes, pours into subsequently and carries out quenching in the cold water, grinds up to sieving 200 mesh sieves after the drying.
CNB2006100883715A 2006-07-14 2006-07-14 Method of lowering sinter temperature of (Zr0.8 Sn0.2) TiO4 ceramic Expired - Fee Related CN100436371C (en)

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CN101805170B (en) * 2010-04-15 2012-09-26 桂林理工大学 Low temperature sintering lithium-based microwave dielectric ceramics and preparation method thereof
CN102070337B (en) * 2010-10-29 2012-12-05 景德镇陶瓷学院 Low-temperature sintered potassium sodium niobate lead-free piezoelectric ceramic and preparation method thereof
CN113354411A (en) * 2021-06-01 2021-09-07 摩比天线技术(深圳)有限公司 Medium high thermal shock resistance microwave dielectric ceramic material and preparation method thereof

Citations (2)

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Publication number Priority date Publication date Assignee Title
CN1308034A (en) * 2000-02-09 2001-08-15 株式会社村田制作所 Dielectric ceramic composite
CN1778765A (en) * 2005-10-17 2006-05-31 郴州高斯贝尔数码科技有限公司 Microwave medium ceramic for C-wave band and production thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1308034A (en) * 2000-02-09 2001-08-15 株式会社村田制作所 Dielectric ceramic composite
CN1778765A (en) * 2005-10-17 2006-05-31 郴州高斯贝尔数码科技有限公司 Microwave medium ceramic for C-wave band and production thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ZnO2-MoO3添加(Zr0. 8Sn0. 2)TiO4 微波陶瓷的介电性能. 石勇,靳正国,程志捷,靳春颖.天津大学学报,第37卷第2期. 2004 *
复合添加剂对(Zr0.8Sn0.2)TiO_4介质材料介电性能的影响. 吴坚强,李亚萍,黄正初,陈志雪.中国陶瓷,第42卷第3期. 2006 *

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