CN100432575C - Temperature control device - Google Patents
Temperature control device Download PDFInfo
- Publication number
- CN100432575C CN100432575C CNB200610061663XA CN200610061663A CN100432575C CN 100432575 C CN100432575 C CN 100432575C CN B200610061663X A CNB200610061663X A CN B200610061663XA CN 200610061663 A CN200610061663 A CN 200610061663A CN 100432575 C CN100432575 C CN 100432575C
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- heat
- heat exchange
- heat insulation
- semiconductor refrigerating
- exchange mass
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- 238000009413 insulation Methods 0.000 claims abstract description 55
- 239000004065 semiconductor Substances 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000003044 adaptive effect Effects 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000017105 transposition Effects 0.000 description 1
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Abstract
A temperature-sensing device includes the heat insulation hollow. The heat insulation hollow is connected with the external heat exchanger between which is installed with the semiconductor refrigerating mass which keeps the temperature of the heat insulation hollow by compensating the heat between the hollow and the external heat exchanger. The heat insulation hollow includes the constant temperature hollow, the first heat-exchanging mass, the second heat-exchanging mass and the thermal pipe. The first heat-exchanging mass is installed in the hollow and the second is installed in the open part of the hollow, the outside of which is contacted with the refrigerating mass; the duct heater is connected between the first and second heat exchanging mass. The constant temperature hollow includes the inner barn, the out barn and the insulating material. The inner barn is set in the out barn and the insulating material is filled between the inner and the out barn, so the invention has improved the temperature adaptability of the electronic device in the vehicles.
Description
Technical field
The present invention relates to control, relate in particular to a kind of attemperating unit.
Background technology
At the various vehicles, be example with the automobile, (no matter be refrigeration or heat) required power and energy is huge because air-conditioning, so only when sustainer runs well, just might provide the air-conditioning service.
The open defect of this adjusting is as follows:
1, in summer, after killing engine, with automobile parking in the sun, door and window closes, after the dozens of minutes, the temperature in the car will be increased to the insupportable stage of human body.
2, when winter, when automobile parking is spent the night in that high latitude area is outdoor, as no special measure, sustainer can't turn round in the morning usually.
The harsh like this fact, test to auto electronic equipment is more severe, its temperature range that must bear is almost equally matched with space flight or military use, make the available spare and accessory parts of existing auto electronic equipment not only far fewer than consumption electronic product, and price is high, lacks enough strong temperature adaptive capacity.
Summary of the invention
The object of the present invention is to provide a kind of attemperating unit, to improve the temperature adaptive capacity of auto electronic equipment.
Attemperating unit of the present invention, comprise heat insulation warehouse, it is characterized in that: described heat insulation warehouse is connected with the external heat permutoid and carries out heat exchange, between described heat insulation warehouse and the external heat permutoid semiconductor refrigerating piece is set, described semiconductor refrigerating piece to the heat exchange of carrying out corresponding compensation between heat insulation warehouse and the external heat permutoid to keep the constant temperature of heat insulation warehouse; Described heat insulation warehouse comprises thermostatical storehouse, first heat exchange mass, second heat exchange mass and heat pipe, wherein,
Described first heat exchange mass is placed in thermostatical storehouse inside;
Described second heat exchange mass is placed in thermostatical storehouse side mouth place, and paste mutually with the semiconductor refrigerating piece in this second heat exchange mass outside;
Be connected heat pipe between described first heat exchange mass and second heat exchange mass.
Described thermostatical storehouse comprises Nei Cang, outer storehouse and heat-barrier material, and described interior storehouse is sheathed among the outer storehouse, clogs heat-barrier material between Nei Cang and the outer storehouse.
Be connected bracing piece between described Nei Cang and the outer storehouse.
Described semiconductor refrigerating piece edge is placed among the heat insulation, and described heat insulation is arranged in the thermostatical storehouse side mouth.
Described external heat permutoid comprises the 3rd heat exchange mass and fan, and described the 3rd heat exchange mass is pasted mutually with the semiconductor refrigerating piece.
Described external heat permutoid is arranged among the containment vessel, and described containment vessel has both ends open.
Be provided with temperature sensor in the described heat insulation warehouse, described device is provided with corresponding main control module, and described main control module is according to the temperature signal that temperature sensor transmitted, the break-make between control power supply and the semiconductor refrigerating piece and be communicated with polarity.
Be connected switch module between described semiconductor refrigerating piece and the power supply, switch module is accepted the control signal of main control module, switches doing corresponding conducting between semiconductor cold-making block and the power supply.
Also be connected pulse width modulation module between described semiconductor refrigerating piece and the power supply, main control module also sends pulse-width signal to pulse width modulation module, to regulate electric current output.
Beneficial effect of the present invention is: in the present invention, heat insulation warehouse is connected with the external heat permutoid and carries out heat exchange, between heat insulation warehouse and the external heat permutoid semiconductor refrigerating piece is set, by the semiconductor refrigerating piece to the heat exchange of carrying out corresponding compensation between heat insulation warehouse and the external heat permutoid to keep the constant temperature of heat insulation warehouse, in heat insulation warehouse, insert electronic equipment, just can strengthen the adaptive capacity of electronic equipment for electronic equipment provides an isoperibol to vehicle interior temperature.
In the present invention, in the heat insulation warehouse temperature sensor is set, main control module is according to temperature signal that temperature sensor transmitted, break-make between control power supply and the semiconductor refrigerating piece and be communicated with polarity, like this, just can effectively control the temperature in the heat insulation warehouse, make heat insulation warehouse remain constant or (operating temperature interval) constant relatively state, on the other hand, the present invention can be relatively independent of the running status of motor vehicle to the temperature control of heat insulation warehouse, in other words, the present invention has built an isoperibol that has nothing to do with the motor vehicle running status for electronic equipment, with respect in the prior art in the extreme temperature difference that summer and winter produced, in fact the present invention makes electronic equipment avoid this extreme temperature difference, can remain the good operation temperature environment, with respect to prior art, the present invention strengthens the temperature adaptive capacity widely.
Description of drawings
Fig. 1 is the embodiment of the invention 1 a plan structure schematic diagram;
Fig. 2 is that the embodiment of the invention 1 is along A-A vertical section structural representation;
Fig. 3 is a heat-exchanging part decomposing schematic representation of the present invention;
Fig. 4 is a semiconductor refrigerating piece principle schematic of the present invention;
Fig. 5 is a semiconductor refrigerating piece principle schematic of the present invention;
Fig. 6 is a semiconductor refrigerating piece principle of stacking schematic diagram of the present invention;
Fig. 7 is the embodiment of the invention 1 block diagram;
Fig. 8 is the embodiment of the invention 2 plan structure schematic diagrames;
Fig. 9 is that the embodiment of the invention 2 is along B-B vertical section structural representation;
Figure 10 is the embodiment of the invention 3 vertical section structural representations;
Figure 11 is the embodiment of the invention 3 block diagrams;
Figure 12 is the embodiment of the invention 4 block diagrams;
Figure 13 is the embodiment of the invention 5 block diagrams.
The specific embodiment
With embodiment the present invention is described in further detail with reference to the accompanying drawings below:
Embodiment 1:
According to Fig. 1, Fig. 2 and Fig. 3, the present invention includes heat insulation warehouse 1, external heat permutoid 2 and semiconductor refrigerating piece 3, heat insulation warehouse 1 is connected with external heat permutoid 2 and carries out heat exchange, between heat insulation warehouse 1 and the external heat permutoid 2 semiconductor refrigerating piece 3 is set, carries out the heat exchange of corresponding compensation to keep the constant temperature of heat insulation warehouse 1 between 3 pairs of heat insulation warehouses 1 of semiconductor refrigerating piece and the external heat permutoid 2.
As shown in Figure 2, be provided with temperature sensor 101 in the heat insulation warehouse 1, as shown in Figure 7, corresponding main control module 4 is set among the present invention, the temperature signal that main control module 4 is transmitted according to temperature sensor 101, the break-make between control power supply 5 and the semiconductor refrigerating piece 3 and be communicated with polarity is connected switch module 6 between semiconductor refrigerating piece 3 and power supply 5, switch module 6 is accepted the control signal of main control module 4, switches doing corresponding conducting between semiconductor cold-making block 3 and the power supply 5.
Particularly, as depicted in figs. 1 and 2, heat insulation warehouse 1 comprises thermostatical storehouse 11, first heat exchange mass 12, second heat exchange mass 13 and heat pipe 14, first heat exchange mass 12 is placed in thermostatical storehouse 11 inside, as depicted in figs. 1 and 2, thermostatical storehouse 11 comprises interior storehouse 111, outer storehouse 112 and heat-barrier material 113, interior storehouse 111 is sheathed among the outer storehouse 112, filling heat-barrier material 113 between interior storehouse 111 and the outer storehouse 112 in order to strengthen integral rigidity of the present invention, is connected bracing piece 114 between interior storehouse 111 and the outer storehouse 112, in interior storehouse 111, lay circuit board 115 on the underframe 117, be close to 12 of collective's circuit 116, the first heat exchange mass on the circuit board 115 and directly paste mutually with collective circuit 116.
As depicted in figs. 1 and 2, second heat exchange mass 13 is placed in thermostatical storehouse 11 side mouth (interior storehouse 111 and outer storehouse 112 sidepieces all have corresponding opening) and locates, paste mutually with semiconductor refrigerating piece 3 in these second heat exchange mass, 13 outsides, is connected heat pipe 14 between first heat exchange mass 12 and second heat exchange mass 13.
As depicted in figs. 1 and 2, in the present embodiment, semiconductor refrigerating piece 3 edges are placed among the heat insulation 31, semiconductor refrigerating piece 3 one sides and second heat exchange mass 13, opposite side is connected to external heat permutoid 2, that is, semiconductor refrigerating piece 3 opposite sides paste mutually with the 3rd heat exchange mass 21, this semiconductor refrigerating piece 3 is sandwiched between second heat exchange mass 13 and the 3rd heat exchange mass 21 as sandwich.The main purpose of heat insulation 31 is to prevent between second heat exchange mass 13 and the 3rd heat exchange mass 21 because of temperature difference caused reverse (direction that is promoted in contrast to semiconductor refrigerating piece 3) heat conduction.
The operation principle of semiconductor refrigerating piece 3 is to make according to the principle that Pai Tier Peltier is found.As shown in Figure 4, at present embodiment, if when positive electrode received n type material, when electric current then forms a cold surface in the 3rd heat exchange mass 21 sides when n type material flows to P-type material; As shown in Figure 5, electric current then forms a hot surface in the 3rd heat exchange mass 21 sides when the P type flows to the N type.
Be arranged in as enough P types and n type material and just form a semiconductor refrigerating piece on the plane.The temperature difference maximum of cold and hot surface can reach 40 ℃ in the general semiconductor refrigerating piece 3, also has else can reach the scope of bigger (about 60 ℃).
To same block semiconductor cold-making block 3,, just can make cold and hot surperficial transposition if change the polarity of power supply.Like this, same cold-making block just can be selected as the cooling or the adjusting pump of heating according to situation.
If in actual use, the temperature difference of a cold-making block is not enough to satisfy operating condition for 40 ℃, then can be with two or superpose more, to obtain the bigger temperature difference, as shown in Figure 6, after two semiconductor refrigerating pieces 3 were superimposed, the temperature difference on cold and hot surface, two ends is multiplicable in theory reached 80 ℃.
As shown in Figure 3, hot switching path of the present invention is as follows:
The first heat exchange mass 12----heat pipe 14----, the second heat exchange mass 13-
Semiconductor cold-making block 3----the 3rd heat exchange mass 21.
In use, as shown in Figure 7, temperature sensor 101 transmits temperature signal to main control module 4, the temperature signal that main control module 4 is transmitted according to temperature sensor 101 with in the temperature threshold values established compare, the temperature threshold values comprises upper limit threshold values and lower limit threshold values, when temperature is higher than upper limit threshold values or is lower than the lower limit threshold values, then main control module 4 sends control signal to switch module 6, doing corresponding conducting between 6 pairs of semiconductor cold-making blocks 3 of switch module and power supply 5 interfaces switches, switch module 6 can adopt by relay or equivalent switch circuit such as FET to be formed, by main control module 4 triggering and conducting correspondingly; Switch module 6 also can adopt special-purpose multi-channel switch chip, makes respective pin set in the multi-channel switch chip by main control module 4, and the respective channel conducting is got final product; Switch module 6 can also adopt decoding circuit to carry out gating etc., to those skilled in the art, can not need to pay creative work and can implement the mode that the conducting of various control respective channel is switched, and repeats no more herein.
Like this, when the temperature of heat insulation warehouse 1 is too high, can make the positive pole of P type termination dc source 5 interfaces of semiconductor refrigerating piece 3, form cold surface, can make the temperature of heat insulation warehouse 1 reduce in second heat exchange mass, 13 sides.
Otherwise, cross when low when the temperature of heat insulation warehouse 1, can make the positive pole of N type termination dc source 5 interfaces of semiconductor refrigerating piece 3, form hot surface in second heat exchange mass, 13 sides, can make the temperature of heat insulation warehouse 1 raise.This is just by carrying out the heat exchange of corresponding compensation between 3 pairs of heat insulation warehouses 1 of semiconductor refrigerating piece and the external heat permutoid 2, make heat insulation warehouse 1 be kept constant temperature or be in the operating temperature threshold values interval of setting all the time.
Embodiment 2:
According to Fig. 8 and Fig. 9; the difference of present embodiment and embodiment 1 is: in the present embodiment; external heat permutoid 2 comprises the 3rd heat exchange mass 21 and fan 22; the 3rd heat exchange mass 21 is pasted mutually with semiconductor refrigerating piece 3; and the 3rd heat exchange mass 21 and fan 22 place among the containment vessel 23, and described containment vessel 23 has both ends open.
Described same or similar as for other parts structure, principle, method and embodiment 1, repeat no more herein.
Embodiment 3:
According to Figure 10 and Figure 11, the difference of present embodiment and embodiment 2 be following some:
1) as shown in figure 11, in the present embodiment, also be connected pulse width modulation module 7 between semiconductor refrigerating piece 3 and power supply 5 interfaces, main control module 4 sends pulse-width signal to pulse width modulation module 7, to regulate electric current output.
2) as shown in figure 10, in the present embodiment, the key position in heat insulation warehouse 1 and external heat permutoid 2 all is provided with temperature sensor, specifically is provided with as follows:
In heat insulation warehouse 1: 111 tops, interior storehouse are provided with temperature sensor 101; On first heat exchange mass 12 temperature sensor 102 is set; (first heat exchange mass, 12 bottoms) are provided with temperature sensor 103 on collective's circuit 116.
Externally in the heat exchanger 2: on the 3rd heat exchange mass 21 temperature sensor 104 is set; Containment vessel 23 tops are provided with temperature sensor 105.
In the present embodiment course of work, temperature sensor 101,102,103,104,105 constantly transmits temperature signal to main control module 4 respectively, in the circuit working control, main control module 4 can judge it is by which concrete temperature signal that temperature sensor sent according to receiving port, can add corresponding label, be convenient to built-in function.Can in main control module 4 or by external memory, preserve the pairing temperature upper limit in each position (temperature sensor 101,102,103,104 and 105)/lower limit threshold values value of setting, the value of setting can be stored in the relevant register, also can embody with form, main control module 4 is made corresponding operating (starting or stoping 3 work of semiconductor refrigerating piece) etc. by searching the value of setting.
In the present embodiment, main control module 4 can also be by receiving the external equipment work state information, by the modulated output signal of control pulse width modulation module 7, to regulate electric current output.For example, if the present invention and motor vehicle common source (battery) 5 o'clock,, just can export and 3 operating times of semiconductor refrigerating piece be done suitable adjustment respectively and control, with the charge capacity of safeguarding power supply (battery) 5 etc. electric current at starting motor-driven vehicle with when out of service.
As for the relevant value of setting, can in main control module 4, solidify, also can in main control module 4, expand the external data input interface, connect external input device by input interface, as keyboard, by the value of keyboard to main control module 4 input settings, can import the pairing temperature upper limit in each position/lower limit threshold values successively with default order, also can adopt the data format of agreement to import the pairing temperature upper limit in each position/lower limit threshold values, the data format of agreement can embody the position of the value of setting and correspondence etc.
The present invention even can insert display device, the temperature that the reflection temperature sensor is surveyed, the duty of semiconductor refrigerating piece 3 etc.
Described same or similar as for other parts structure, principle, method and embodiment 1 or embodiment 2, repeat no more herein.
Embodiment 4:
According to Figure 12, the difference of present embodiment and embodiment 1 is: in the present embodiment, main control module 4 and switch module 6 place within the heat insulation warehouse 1,5 of power supplys (battery) place on heat insulation warehouse 1 outer wall, for example, can on heat insulation warehouse 1 outer wall, a battery case be set and be used to lay power supply (battery) 5, like this, main control module 4 and switch module 6 become the pyrotoxin in the heat insulation warehouse 1 too, heat transfer considerations energy between 3 pairs of heat insulation warehouses 1 of semiconductor refrigerating piece and the external heat permutoid 2 can with respect among the embodiment 1 more greatly, to keep same constant temperature or to be in the operating temperature threshold values interval of setting all the time.
Described same or similar as for other parts structure, principle, method and embodiment 1, repeat no more herein.
Embodiment 5:
According to Figure 13; the main distinction of present embodiment and embodiment 3 also is: in the present embodiment; as shown in figure 13; main control module 4 and switch module 6 place within the heat insulation warehouse 1; 5 of power supplys (battery) place on heat insulation warehouse 1 outer wall, in fact, and in actual applications; main control module 4 and switch module 6 also can place the inside of containment vessel 23, and power supply (battery) 5 is placed the inside of containment vessel 23 or outside or the like.
Described same or similar as for other parts structure, principle, method and embodiment 3 or embodiment 4, repeat no more herein.
In sum, although structure of the present invention, principle, method are specifically set forth by the various embodiments described above, under the prerequisite that does not break away from main idea of the present invention, according to above-described inspiration, those of ordinary skills can not need to pay creative work can implement conversion/alternative form or combination, repeats no more herein.
Claims (9)
1. attemperating unit, comprise heat insulation warehouse, it is characterized in that: described heat insulation warehouse is connected with the external heat permutoid and carries out heat exchange, between described heat insulation warehouse and the external heat permutoid semiconductor refrigerating piece is set, described semiconductor refrigerating piece to the heat exchange of carrying out corresponding compensation between heat insulation warehouse and the external heat permutoid to keep the constant temperature of heat insulation warehouse; Described heat insulation warehouse comprises thermostatical storehouse, first heat exchange mass, second heat exchange mass and heat pipe, wherein,
Described first heat exchange mass is placed in thermostatical storehouse inside;
Described second heat exchange mass is placed in thermostatical storehouse side mouth place, and paste mutually with the semiconductor refrigerating piece in this second heat exchange mass outside;
Be connected with heat pipe between described first heat exchange mass and second heat exchange mass.
2. attemperating unit according to claim 1 is characterized in that: described thermostatical storehouse comprises Nei Cang, outer storehouse and heat-barrier material, and described interior storehouse is sheathed among the outer storehouse, clogs heat-barrier material between Nei Cang and the outer storehouse.
3. attemperating unit according to claim 2 is characterized in that: be connected bracing piece between described Nei Cang and the outer storehouse.
4. attemperating unit according to claim 1 is characterized in that: described semiconductor refrigerating piece edge is placed among the heat insulation, and described heat insulation is arranged in the thermostatical storehouse side mouth.
5. attemperating unit according to claim 1 is characterized in that: described external heat permutoid comprises the 3rd heat exchange mass and fan, and described the 3rd heat exchange mass is pasted mutually with the semiconductor refrigerating piece.
6. attemperating unit according to claim 5 is characterized in that: described external heat permutoid is arranged among the containment vessel, and described containment vessel has both ends open.
7. according to any described attemperating unit among the claim 1-6, it is characterized in that: be provided with temperature sensor in the described heat insulation warehouse, described device is provided with corresponding main control module, described main control module is according to the temperature signal that temperature sensor transmitted, the break-make between control power supply and the semiconductor refrigerating piece and be communicated with polarity.
8. attemperating unit according to claim 7 is characterized in that: be connected switch module between described semiconductor refrigerating piece and the power supply, switch module is accepted the control signal of main control module, switches doing corresponding conducting between semiconductor cold-making block and the power supply.
9. attemperating unit according to claim 7 is characterized in that: also be connected pulse width modulation module between described semiconductor refrigerating piece and the power supply, main control module also sends pulse-width signal to pulse width modulation module, to regulate electric current output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610061663XA CN100432575C (en) | 2006-07-11 | 2006-07-11 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610061663XA CN100432575C (en) | 2006-07-11 | 2006-07-11 | Temperature control device |
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| CN1932415A CN1932415A (en) | 2007-03-21 |
| CN100432575C true CN100432575C (en) | 2008-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB200610061663XA Expired - Fee Related CN100432575C (en) | 2006-07-11 | 2006-07-11 | Temperature control device |
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| CN (1) | CN100432575C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104709599B (en) * | 2015-02-10 | 2017-11-10 | 福建工程学院 | A kind of fresh storage cabinet and its control method |
| CN110953783B (en) * | 2019-10-17 | 2023-12-01 | 惠州市蓝微电子有限公司 | Constant temperature control method of constant temperature box |
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| JP2001147054A (en) * | 1999-11-18 | 2001-05-29 | Honda Motor Co Ltd | Thermoelectric module type heat exchanger |
| US20020121095A1 (en) * | 2000-09-08 | 2002-09-05 | Adamski Joseph R. | Controlled temperature compartment apparatus |
| CN1584468A (en) * | 2004-05-25 | 2005-02-23 | 沈阳七彩科技工程有限公司 | Electronic refrigerating and temperature regulating apparatus |
| CN2767918Y (en) * | 2004-04-23 | 2006-03-29 | 沈阳七彩科技工程有限公司 | Low temperature incubator |
| CN200946942Y (en) * | 2006-07-11 | 2007-09-12 | 陈少鹏 | Temperature controller |
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2006
- 2006-07-11 CN CNB200610061663XA patent/CN100432575C/en not_active Expired - Fee Related
Patent Citations (8)
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|---|---|---|---|---|
| CN85205411U (en) * | 1985-12-18 | 1987-01-07 | 周宗正 | Miniature refrigerator in automobile |
| CN2227806Y (en) * | 1995-09-01 | 1996-05-22 | 李昌权 | Multipurpose cold and hot box |
| CN2233549Y (en) * | 1995-09-25 | 1996-08-21 | 朱军 | Semiconductor refrigerating storage device |
| JP2001147054A (en) * | 1999-11-18 | 2001-05-29 | Honda Motor Co Ltd | Thermoelectric module type heat exchanger |
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Non-Patent Citations (1)
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