CN100404206C - Method for dismounting-mounting semiconductor vacuum-pumping equipment - Google Patents
Method for dismounting-mounting semiconductor vacuum-pumping equipment Download PDFInfo
- Publication number
- CN100404206C CN100404206C CNB2005101263912A CN200510126391A CN100404206C CN 100404206 C CN100404206 C CN 100404206C CN B2005101263912 A CNB2005101263912 A CN B2005101263912A CN 200510126391 A CN200510126391 A CN 200510126391A CN 100404206 C CN100404206 C CN 100404206C
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- China
- Prior art keywords
- equipment
- dismounting
- sliding support
- support parts
- pumping
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000005086 pumping Methods 0.000 title claims description 35
- 241001544580 Rumex dentatus Species 0.000 claims 1
- 238000009434 installation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000000153 supplemental effect Effects 0.000 description 2
- IYLGZMTXKJYONK-ACLXAEORSA-N (12s,15r)-15-hydroxy-11,16-dioxo-15,20-dihydrosenecionan-12-yl acetate Chemical compound O1C(=O)[C@](CC)(O)C[C@@H](C)[C@](C)(OC(C)=O)C(=O)OCC2=CCN3[C@H]2[C@H]1CC3 IYLGZMTXKJYONK-ACLXAEORSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- IYLGZMTXKJYONK-UHFFFAOYSA-N ruwenine Natural products O1C(=O)C(CC)(O)CC(C)C(C)(OC(C)=O)C(=O)OCC2=CCN3C2C1CC3 IYLGZMTXKJYONK-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention relates to an evacuation equipment for disassembling and assembling semiconductor. Said evacuation equipment includes the following several portions: supporting frame, upper beam, slide supporting component, evacuation cavity, swinging valve, reaction cavity, molecular pump and assembling and disassembling carriage. Besides, said invention also provides its concrete operation method for disassembling and assembling semiconductor.
Description
Technical field
The present invention relates to the method for disassemblerassembler, particularly the method for dismounting-mounting semiconductor vacuum-pumping equipment.
Background technology
When the physical chemistry deposit of film, etching and other semiconductor processes, all need silicon chip is placed in the clean vacuum chamber and carry out microelectronic technique.And to obtain the chamber of a cleaning, before feeding process gas, use vaccum-pumping equipment (as pendulum valve, molecular pump etc.) that chamber is extracted into high vacuum state usually.Existing some semiconductor processing equipment (PM) adopts structure as depicted in figs. 1 and 2, and chamber is by the dolly stent support, and vaccum-pumping equipment is fixed on the chamber, the electric control box that distributes closely on every side, power supply, water, electricity and gas pipeline etc.Silicon chip is sent to PM by the manipulator of delivery platform (TM).Be generally and raise the efficiency, several PM of installation of a last divergent shape of TM as shown in Figure 3.Therefore, the space between each PM will be very narrow and small, and when safeguarding vaccum-pumping equipment (weight is more than 30kg usually), dismounting, installation be difficulty very.
Structure needs to place aid and supports below molecular pump during dismounting as depicted in figs. 1 and 2, disconnects vaccum-pumping equipment and connects with the fastening of cavity, takes out vaccum-pumping equipment then from the side.
Because the space of placing the supplemental support instrument will be reserved in vaccum-pumping equipment below, causes the waste in space, and disassembly process all finishes in minimum space, PM side, and is very inconvenient.
Summary of the invention
The technical problem that solves
Of the present inventionly provide a kind of method that need not reserve the dismounting-mounting semiconductor vacuum-pumping equipment in the space of placing the supplemental support instrument.
Technical scheme
The technical solution used in the present invention is as follows:
A kind of method of dismounting-mounting semiconductor vacuum-pumping equipment comprises:
At the support upper beam sliding support parts are installed;
Slide unit is installed on pumping chamber;
Crossbeam with equipment supporter upper beam equal height is installed on the dismounting dolly, and on fixing and equipment on the crossbeam sliding support parts of same model;
The sliding support parts of butt joint dismounting dolly and the sliding support parts on the equipment;
With auxiliary fixing member fixedly the sliding support parts of dismounting dolly and the sliding support parts on the equipment;
Disconnect the fastening connection of pumping chamber and reaction chamber;
Drive pumping chamber, pendulum valve, molecular pump slide into the dismounting dolly from the sliding support parts of equipment sliding support parts with slide unit.
Pumping chamber on the dismounting dolly, pendulum valve, molecular pump just may carry out maintenance and repair very easily, can install back easily by following method after finishing.
With slide unit drive pumping chamber, pendulum valve, molecular pump slide on the sliding support parts of equipment from the sliding support parts of dismounting dolly;
The fixedly fastening connection of pumping chamber and reaction chamber;
Separate the sliding support parts of dismounting dolly and the sliding support parts on the equipment.
Wherein, described sliding support parts can adopt line slide rail, can utilize also that other slides, the parts of rolling form such as linear bearing, roller, ball isoline motion parts.Described slide unit can adopt sliding shoe, also can cooperate the sliding support parts to use parts such as roller or ball.
Wherein, described crossbeam is two, and described line slide rail is two, and the line slide rail of dismounting dolly is installed in the inboard the right and left of crossbeam, the left and right sides in the rack-mount beam of the line slide rail on the equipment.
Beneficial effect
Assembly and disassembly methods provided by the invention is simple in structure, saving equipment and working space and dismounting are simple and convenient.
Description of drawings
Fig. 1 is the side view of existing semiconductor processing equipment (PM) structure;
Fig. 2 is the rearview of existing semiconductor processing equipment (PM) structure;
Fig. 3 is that delivery platform in the prior art (TM) is arranged schematic diagram with semiconductor processing equipment (PM);
The side view of the disassembly and assembly structure of Fig. 4 one embodiment of the invention;
The rearview of the disassembly and assembly structure of Fig. 5 one embodiment of the invention.
Among the figure: 1, dismounting dolly; 2, support; 3, line slide rail.
The specific embodiment
Following examples are used to illustrate the present invention; but be not used for limiting the scope of the invention; the those of ordinary skill in relevant technologies field; under the situation that does not break away from the spirit and scope of the present invention; can also make various variations and modification; therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be limited by every claim.
A kind of method of dismounting-mounting semiconductor vacuum-pumping equipment, it can make vaccum-pumping equipment take out from semiconductor processing equipment easily.Shown in rearview among Fig. 3, adorn a line slide rail 3 respectively at the right and left of the inboard that support 2 is put the beams in place, the guide rail of line slide rail 3 is fixed on the support, and the slide block of line slide rail 3 is installed on the pumping chamber.Electric control unit is distributed in the below and the side of vaccum-pumping equipment.
During dismounting, disconnect the fastening connection of pumping chamber and reaction chamber, at this moment, with dismounting dolly 1 and equipment interconnection, two crossbeams with equipment supporter upper beam equal height, span are housed on the dismounting dolly 1, the inboard the right and left of crossbeam fixing respectively with equipment on the line slide rail of line slide rail 3 same models; Dock and guarantee the line slide rail and 3 complete matchings of the line slide rail on the equipment of dismounting dolly, and fix with auxiliary fixing member.Slide block drive pumping chamber, pendulum valve, molecular pump from the line slide rail 3 of equipment to the line slide rail of dismounting dolly 1, just can keep in repair easily then.
During installation, slide block drive pumping chamber, pendulum valve, molecular pump from the line slide rail of dismounting dolly 1 to the line slide rail 3 of equipment, the fixedly fastening connection of pumping chamber and reaction chamber, the line slide rail and the line slide rail on the equipment 3 of disconnection dismounting dolly, the dismounting dolly can be removed.
Claims (5)
1. the method for a dismounting-mounting semiconductor vacuum-pumping equipment is characterized in that, comprises the steps:
A. put the beams in place at equipment supporter (2) sliding support parts (3) are installed;
B., slide unit is installed on pumping chamber;
C. at dismounting dolly (1) crossbeam with equipment supporter (2) upper beam equal height go up to be installed, and on fixing and equipment on the crossbeam sliding support parts of same model;
D. dock sliding support parts on the dismounting dolly (1) and the sliding support parts (3) on the equipment;
E. disconnect the fastening connection of pumping chamber and reaction chamber;
F. drive pumping chamber, pendulum valve, molecular pump slide into dismounting dolly (1) from the sliding support parts of equipment sliding support parts with slide unit.
2. the method for dismounting-mounting semiconductor vacuum-pumping equipment as claimed in claim 1 is characterized in that, also comprises:
G. drive step on pumping chamber, pendulum valve, molecular pump slide into equipment from the sliding support parts of dismounting dolly (1) the sliding support parts (3) with slide unit;
H. the fixing step of the fastening connection of pumping chamber and reaction chamber;
I. separate the sliding support parts of dismounting dolly (1) and the step of the sliding support parts (3) on the equipment.
3. the method for dismounting-mounting semiconductor vacuum-pumping equipment as claimed in claim 1 or 2 is characterized in that, described sliding support parts (3) are line slide rail, linear bearing, roller or ball, and described slide unit is sliding shoe, roller or ball.
4. the method for dismounting-mounting semiconductor vacuum-pumping equipment as claimed in claim 3, it is characterized in that described crossbeam is two, described line slide rail is two, wherein the line slide rail of dismounting dolly is installed in the inboard the right and left of crossbeam, the left and right sides in the rack-mount beam of the line slide rail on the equipment.
5. the method for dismounting-mounting semiconductor vacuum-pumping equipment as claimed in claim 1 or 2 is characterized in that, described step D also comprises auxiliary fixing member fixedly the sliding support parts of dismounting dolly and sliding support parts (3) step on the equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101263912A CN100404206C (en) | 2005-12-08 | 2005-12-08 | Method for dismounting-mounting semiconductor vacuum-pumping equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101263912A CN100404206C (en) | 2005-12-08 | 2005-12-08 | Method for dismounting-mounting semiconductor vacuum-pumping equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1935467A CN1935467A (en) | 2007-03-28 |
| CN100404206C true CN100404206C (en) | 2008-07-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101263912A Expired - Fee Related CN100404206C (en) | 2005-12-08 | 2005-12-08 | Method for dismounting-mounting semiconductor vacuum-pumping equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100404206C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111105977B (en) * | 2020-01-09 | 2022-11-25 | 北京北方华创微电子装备有限公司 | Electric trolley system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053511A (en) * | 1990-01-10 | 1991-07-31 | 南京大学 | A kind of method and apparatus that obtains heterojunction semiconductor and super crystal lattice material |
| EP0490028A1 (en) * | 1990-12-10 | 1992-06-17 | Leybold Aktiengesellschaft | Coatingsystem on the surface of a material and process for its fabrication |
| US5698039A (en) * | 1995-02-04 | 1997-12-16 | Leybold Ag | Process for cleaning a substrate using a barrier discharge |
| CN1215764A (en) * | 1997-10-29 | 1999-05-05 | 三星电子株式会社 | Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method |
| US6357386B1 (en) * | 1998-12-24 | 2002-03-19 | Sulzer Metco Ag | Assembly for controlling the gas flow in a plasma spraying apparatus |
| CN1438692A (en) * | 2001-12-17 | 2003-08-27 | 新明和工业株式会社 | Semiconductor wiring formation method and apparatus, device making method and apparatus and wafer |
-
2005
- 2005-12-08 CN CNB2005101263912A patent/CN100404206C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1053511A (en) * | 1990-01-10 | 1991-07-31 | 南京大学 | A kind of method and apparatus that obtains heterojunction semiconductor and super crystal lattice material |
| EP0490028A1 (en) * | 1990-12-10 | 1992-06-17 | Leybold Aktiengesellschaft | Coatingsystem on the surface of a material and process for its fabrication |
| US5698039A (en) * | 1995-02-04 | 1997-12-16 | Leybold Ag | Process for cleaning a substrate using a barrier discharge |
| CN1215764A (en) * | 1997-10-29 | 1999-05-05 | 三星电子株式会社 | Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method |
| US6357386B1 (en) * | 1998-12-24 | 2002-03-19 | Sulzer Metco Ag | Assembly for controlling the gas flow in a plasma spraying apparatus |
| CN1438692A (en) * | 2001-12-17 | 2003-08-27 | 新明和工业株式会社 | Semiconductor wiring formation method and apparatus, device making method and apparatus and wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1935467A (en) | 2007-03-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Bright Solar Energy Co., Ltd. Assignor: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing Contract record no.: 2010990000583 Denomination of invention: Method for dismounting-mounting semiconductor vacuum-pumping equipment Granted publication date: 20080723 License type: Exclusive License Open date: 20070328 Record date: 20100803 |
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| ASS | Succession or assignment of patent right |
Owner name: SICHUAN ANHENG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: BEIFANG MICROELECTRONIC BASE EQUIPMENT PROCES RESEARCH CENTER CO., LTD., BEIJING Effective date: 20140526 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 100016 CHAOYANG, BEIJING TO: 610041 CHENGDU, SICHUAN PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20140526 Address after: 610041, No. two, No. 11, Wu Xing Road, Chengdu, Sichuan, Wuhou District Patentee after: Sichuan Zhong Heng Technology Co., Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080723 Termination date: 20191208 |
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| CF01 | Termination of patent right due to non-payment of annual fee |