CN100403865C - Circuit board for wireless communication device and its manufacturing method - Google Patents
Circuit board for wireless communication device and its manufacturing method Download PDFInfo
- Publication number
- CN100403865C CN100403865C CNB2004100156285A CN200410015628A CN100403865C CN 100403865 C CN100403865 C CN 100403865C CN B2004100156285 A CNB2004100156285 A CN B2004100156285A CN 200410015628 A CN200410015628 A CN 200410015628A CN 100403865 C CN100403865 C CN 100403865C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- block
- hard wired
- wired logic
- radio frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004891 communication Methods 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000000034 method Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 13
- 229910052758 niobium Inorganic materials 0.000 claims description 13
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 13
- 239000010955 niobium Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 10
- 231100000252 nontoxic Toxicity 0.000 claims description 9
- 230000003000 nontoxic effect Effects 0.000 claims description 9
- 238000013461 design Methods 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 5
- 238000007514 turning Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 abstract 3
- 239000002344 surface layer Substances 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 description 17
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 17
- 230000006378 damage Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 10
- 238000009826 distribution Methods 0.000 description 5
- 239000004568 cement Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000009335 monocropping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Abstract
The present invention relates to a circuit board used in a wireless communication device which generally comprises an antenna, a keyboard and the circuit board. Herein, the circuit board comprises a radio frequency module section, a medium frequency module section, a base frequency module section and a key engagement section, wherein the radio frequency module section comprises a plurality of radio frequency modules; the medium frequency module section comprises a plurality of medium frequency modules; the low frequency module section comprises a plurality of low frequency modules. The radio frequency module section, the medium frequency module section and the low frequency module section are separately independent at different positions of the circuit board for performing independent electromagnetic wave shielding. The key engagement section comprises a surface layer and an inner wiring layer, wherein the surface layer is used for engaging with keys and used for the electromagnetic wave shielding of the inner wiring layer through a grounding process; the inner wiring layer is used for generating corresponding information according to pressing positions when a user presses the keys. Therefore, an electromagnet wave absorption ratio (SAR) generated by the wireless communication device can be effectively reduced.
Description
Technical field
The present invention is about a kind of circuit board and manufacture method thereof that is applied in the unlimited communication device, particularly about a kind of using environment-friendly material and effectively reduce the circuit board of electromagenetic wave radiation.
Background technology
Along with the fast development of electronics technology, wireless communication apparatus (as mobile phone etc.) becomes very universal people's livelihood articles for use.Therefore, along with the increase of number of users, wireless communication apparatus also just more and more comes into one's own for the negative effect that environment or human body caused, and wherein receives publicity most with electromagenetic wave radiation especially.
For this reason, be engaged in the scientist of association area development at present, have the research and development of input to meet every environmental requirement and electromagenetic wave radiation can be reduced to minimum wireless communication apparatus more.Solving wireless communication apparatus must consider from two aspects the harm of environment or human body: 1. the selection of electronic component; 2. the distribution logical AND arrangement of components of circuit board.
Aspect the selection of electronic component, in the design of known wireless communication apparatus, there is part huge harm to be arranged, as tantalum electric capacity etc. for environment.Tantalum electric capacity is a kind of to the sizable electronic component of environmental hazard, and as its name suggests, its main material is the metallic element tantalum.Tantalum is a kind of toxic heavy metal element, and is quite serious for contaminated water source, therefore in a single day discarded, but can cause very big influence in environment.In addition, when wireless communication apparatus in the process of using, if magnitude of voltage is higher than the predetermined voltage of tantalum electric capacity, be easy to produce blast and the harm that causes human body.
In order to solve the shortcoming of above-mentioned tantalum electric capacity, many at present to use ceramic condenser to replace tantalum electric capacity.But because ceramic condenser has higher induced impedance, and anlistatig effect is worse than tantalum electric capacity, therefore cause wireless communication apparatus to produce noise easily, reduce the service behaviour of wireless communication apparatus, therefore use the wireless communication apparatus of ceramic condenser fully, its communication quality and service behaviour all are inferior to the wireless communication apparatus that uses tantalum electric capacity.
In addition, mostly known wireless communication apparatus is there to be the lead sealing dress to make with the logic module in the encapsulation wireless communication apparatus, and plumbous well-known to the harm of human body and environment, ban use of leaded electronic product before also therefore each advanced government works out invariably that rules are bright and orders a time limit.Therefore how getting rid of lead in wireless communication apparatus, has been the emphasis that the designer must take in.In addition, because the printed circuit board (PCB) in the wireless communication apparatus, its main material is plastic cement and green lacquer, and these materials all have certain influence for environment, therefore, how to dwindle the volume of printed circuit board (PCB), also are important problems.Moreover each assembly in the known wireless communication apparatus is to utilize a plurality of pins being connected with printed circuit board (PCB), yet each pin can produce an inductance (the every increase of pin 1mm, inductance value can increase 1nH).And, also can form the electric capacity of an about 0.3pF at the end of pin.If from the electromagnetism angle, this will cause potential electromagnetic interference effect (EMI), and cause the increase of electromagenetic wave radiation.
Aspect the distribution logical AND arrangement of components of circuit board, along with electromagnetic radiation is more and more deep to human influence's research, it is also all the more harsh to human injury's international standard SAR value to make weighing apparatus decide electromagnetic radiation.At present commercially available wireless communication apparatus all must indicate its SAR value, and the international standard of SAR value is 2.0W/Kg, and some particular country is for the requirement of electromagnetic radiation even be higher than international standard.This shows that good wireless communication apparatus will be admitted by the market of a country, its design that is used for electromagnetic radiation resistant is just quite important.Known wireless communication apparatus is then many also to have increased cost simultaneously to install electromagnetic wave shielding device additional to shield the electromagnetic wave that known wireless communication apparatus produces but install electromagnetic wave shielding device additional, is a kind of temporary transient solution of taking stopgap measures but not effecting a permanent cure.In addition, in known technology, the circuit board in the wireless communication apparatus and use the mode of surface wiring usually by the position of keyed engagement, but surface wiring quite is easy to generate electromagnetic interference, even cause wireless communication apparatus to work as machine and can't use.In order to solve this problem, the practice that industry is generally taked is with a thin masking foil button to be coated.But this practice need drop into manpower and increase production cost, more causes production routine complicated.
Therefore, proposition of the present invention has been the problem that above-mentioned known wireless communication apparatus produces that solves.
Summary of the invention
An object of the present invention is to provide a kind of circuit board that is applied to wireless communication apparatus, to reduce when wireless communication apparatus is discarded, to the influence that environment caused.
Another object of the present invention is to be to provide a kind of wireless communication apparatus of using nontoxic electronic component, effectively reduces the harm that wireless communication apparatus causes human body.
Another object of the present invention is collocation method and the distribution logic that is to provide a kind of circuit board, with the SAR value of effective reduction wireless communication apparatus.
The present invention is a kind of method of manufacturing circuit board, and this board application is in a wireless communication apparatus.This wireless communication apparatus further comprises an antenna, a keyboard to be electrically connected with this circuit board.This antenna is in order to acknowledge(ment) signal and transfer to circuit board, and the voice signal or the letter signal that receive after circuit board is handled are also exported.This keyboard is imported a Word message in order to a user to be provided, this circuit board is in order to handling this antenna received signal, and handles a voice messaging of this user's desire output and this literal information and make it to become this voice signal or this literal signal to be transmitted via this antenna.This manufacture method comprises:
1. with a plurality of fundamental frequency assemblies that this circuit board comprised, a plurality of MFM medium frequency module and a plurality of radio frequency component, centralized configuration is in a fundamental frequency assembly block, a MFM medium frequency module block and a radio frequency component block respectively.
2. this fundamental frequency assembly block, this MFM medium frequency module block and this radio frequency component block being carried out an electromagnetic wave shielding respectively handles.
3. form a button and engage block, this button engages block and comprises wiring layer in a superficial layer and.This superficial layer in order to this by keyed engagement, and handle with as electromagnetic wave shielding that should interior wiring layer through a ground connection.Wiring layer produces information corresponding in order to when this button is pushed by this user according to pressing position in being somebody's turn to do.
4. each assembly carries out the circuit connection in the block so that this fundamental frequency assembly block, this MFM medium frequency module block, this radio frequency component block and this button are engaged to utilize a low electromagnetic interference hard wired logic.
5. carry out a unleaded logic array canned program to encapsulate all component in this circuit board.
In sum, the present invention is that the assembly that frequency is different concentrates on respectively in the different blocks, carrying out different electromagnetic wave shieldings individually, thereby effectively reduces Electromagnetic Interference.Then circuit board and position by keyed engagement are divided into two-layer layout, circuit is arranged in internal layer, superficial layer then carries out ground connection to be handled with the shielding as interior wiring layer, therefore can effectively strengthen anti-electromagnetic interference capability.By special hard wired logic, more can effectively reduce the electromagnetic interference between circuit.Encapsulated circuit board of the present invention with unleaded logic packaged type at last, therefore compared to known technology, reduced plumbous to human body and environment work the mischief may.
Can be further understood by the following detailed description and accompanying drawings about the advantages and spirit of the present invention.
Description of drawings
Fig. 1 is the schematic diagram of wireless communication apparatus of the present invention.
Fig. 2 is the schematic diagram of circuit board among Fig. 1.
Fig. 3 is the profile that button engages block among Fig. 2.
Fig. 4 is the power line of radio frequency component among Fig. 2 and the wiring schematic diagram of address wire.
Fig. 5 is the address wire of MFM medium frequency module among Fig. 2 and the wiring schematic diagram of data wire.
Fig. 6 a is the right-angled bend wiring skill schematic diagram of hard wired logic of the present invention.
Fig. 6 b is the miter angle turning wiring skill schematic diagram of hard wired logic of the present invention.
Fig. 7 is the flow chart of circuit board manufacturing method of the present invention.
Embodiment
See also Fig. 1, Fig. 1 is the schematic diagram of wireless communication apparatus 10 of the present invention.Wireless communication apparatus 10 of the present invention comprises a upper casing 12, a lower casing 14, a button 16, a display screen 18, a circuit board 20 and an antenna 22.
Please consult Fig. 2 and Fig. 1 simultaneously, Fig. 2 is the schematic diagram of circuit board 20 among Fig. 1.Circuit board 20 comprises a radio frequency component block 24, a MFM medium frequency module block 26, a fundamental frequency assembly block 28 and a button and engages block 30.No matter which kind of block in the circuit board 20 all must be used many capacity cells.Described in the prior art, known technology adopts the tantalum electric capacity that environment had harm mostly as preceding, or takes ceramic condenser for fear of the harm of tantalum electric capacity, but sacrifices usefulness and communication quality.For fear of the shortcoming of known technology, the present invention emphasizes to need to adopt the electric capacity of non-toxic material made, but because the usefulness of ceramic condenser is not good, so in the specific embodiment of the invention, adopt niobium electric capacity.Niobium and tantalum belong to the element of VB family (periodic table of elements comes fifth line from left number) on chemical periodic table, and both only differ one-period, and (the niobium atom amount is 41, the tantalum atom amount is 73), therefore both are quite approximate on voltinism, but niobium does not have toxicity, can not exert an influence to environment, meet environmental protection requirement fully.
In addition, in another specific embodiment of the present invention, consider the cost of wireless communication apparatus, therefore circuit board 20 is done a classification.If assembly can not have a significant impact for communication quality and usefulness, then classify as non-noise jamming district, capacity cell wherein adopts ceramic condenser.In like manner, the assembly that other can exert an influence for noise then classifies as the noise jamming district, and capacity cell wherein then uses niobium electric capacity.
As shown in Figure 2, radio frequency component block 24 comprises a plurality of radio frequency component 24i (i=1 ~ L), the function of each assembly is not quite similar, and only summarizes to be referred to as radio frequency component herein.The main function of radio frequency component block 24 is the signal of input is carried out a radiofrequency signal handling procedure, with the work that signal is carried out the conversion of frequency and removes noise.Therefore, because antenna 22 is to send and received signal with rf frequency, therefore, the signal that antenna 22 is received is removed the action of noise and inversion frequency with being delivered to radio frequency component block 24 earlier, handles for follow-up block.And voice signal or letter signal that the wireless communication apparatus desire sends must be that the rf frequency that antenna 22 is accepted can just can send from antenna 22 through frequency inverted then.
MFM medium frequency module block 26 comprises a plurality of MFM medium frequency module 26j, and (j=1～M), the function of each assembly is not quite similar, and only summarizes to be referred to as MFM medium frequency module herein.The main function of MFM medium frequency module block 26 is the signal of input is carried out an intermediate-freuqncy signal handling procedure, signal is carried out the conversion of frequency.Because antenna 22 is to send and received signal with rf frequency, and microprocessor in the wireless communication apparatus or numerical digit signal processor are the signals of handling fundamental frequency, it is very big that both frequencies differ, and need carry out frequency inverted, and the element in the MFM medium frequency module block is this effect.The signal that antenna receives is sent MFM medium frequency module block 26 earlier to and is converted to intermediate frequency after radio frequency component block 24 is handled, and handles for follow-up block.And voice signal or letter signal that the wireless communication apparatus desire sends must be just can send from antenna 22 after radio frequency component block 24 is converted to the rf frequency of antenna acceptance behind the intermediate frequency through frequency inverted then again.
Fundamental frequency assembly block 28 comprises a plurality of fundamental frequency assembly 28k, and (k=1～N), the function of each assembly is not advanced identical, only summarizes to be referred to as the fundamental frequency assembly herein.The main function of fundamental frequency assembly block 28 is the signal of input is carried out a fundamental frequency signal handling procedure, with the work that signal is carried out the conversion of frequency and removes noise.As previously mentioned, wireless communication apparatus is to handle the signal that is positioned at fundamental frequency, therefore, and voice messaging that the user imported or Word message, to be processed into earlier the voice signal or the letter signal of fundamental frequency, carry out subsequent treatment being sent to intermediate frequency group time zone piece via fundamental frequency assembly block 28.And the signal that is received from antenna 22, after passing through radio frequency and intermediate frequency process again, transfer to behind the fundamental frequency for assembly wherein is processed into voice messaging or Word message via fundamental frequency assembly block again and show the user, listen to by external or built-in loud speaker or read by display screen 18 for the user.
Because known technology is usually by the distribution layout, the assembly of same frequency is placed on different parts, make the different assembly of frequency mix mutually, hardly realize that this measure will cause assembly electromagnetic interference to each other.What the present invention emphasized focuses on, and therefore the diverse location that radio frequency component block 24, MFM medium frequency module block 26 and fundamental frequency assembly block 28 is independent of circuit board 20 respectively can effectively reduce electromagnetic interference to carry out an independently electromagnetic wave shielding separately.
Please consult Fig. 3 and Fig. 2 simultaneously, Fig. 3 is the profile that button engages block 30 among Fig. 2.Button engages block 30 and comprises wiring layer 34 in a superficial layer 32 and.Superficial layer 32 is in order to engaging with button 16, and handles with as electromagnetic wave shielding that should interior wiring layer 34 through a ground connection.Interior wiring layer 34 produces information corresponding in order to when button 16 is pushed by the user according to pressing position.And known art, because the present invention adopts internal layer wiring, and the top layer is because therefore ground connection be equivalent to carry out the electromagnetic wave shielding processing, therefore the ability of anti-electromagnetic interference strengthens many.
As shown in Figure 2, after all block arrangement were finished, must connect up linked with the assembly that relevant continuous cropping is used.The specific embodiment of the invention is to adopt a low electromagnetic interference hard wired logic, the electromagnetism height that will be caused connecting up disturb reduce to minimum.The hard wired logic of the specific embodiment of the invention will be in follow-up detailed introduction.
See also Fig. 4, Fig. 4 is the power line 36 of radio frequency component 24i among Fig. 2 and the wiring schematic diagram of address wire 38.The hard wired logic of the power line and the ground wire of each element at first is discussed, is only done an example with radio-frequency (RF) component 24i at this, hard wired logic of the present invention can be applicable to all elements in the circuit board:
1, power line 36 and ground wire 38 are adopted and are arranged in parallel, so that circuit board obtains best capacitive character.
2, the width of 38 of power line 36 and ground wires is not less than a Breadth Maximum, an i.e. predetermined value (the notion that predetermined value is hereinafter also arranged, for having any different, be defined as first predetermined value herein), the mode that this first predetermined value will be widened as far as possible according to the distance between power line and ground wire is determined.Therefore, first predetermined value (Breadth Maximum) can be with the circuit designers design and different, and the purpose of this measure is to reduce the impedance of circuit board.
3,38 of power line 36 and ground wires are when needing to add a decoupling capacitor 40 when removing both couplings, distance between this decoupling capacitor and radio frequency component 24i is not more than a minimum widith, i.e. one second predetermined value, this second predetermined value must be tried one's best according to decoupling capacitor 40 and be determined near the mode of radio frequency component 24i, to reach the purpose of removing noise.
5, after wiring is finished, carry out an earth connection in a plurality of gaps of circuit board and arrange, this measure can reach ring protection and reduce interference between unlike signal.
See also Fig. 5, Fig. 5 is the address wire 42 of MFM medium frequency module 26j among Fig. 2 and the wiring schematic diagram of data wire 44.Next the address wire of each element and the hard wired logic of data wire are discussed, are only done an example with intermediate frequency element 26j at this, hard wired logic of the present invention can be applicable to all elements in the circuit board:
1, the length of a plurality of data wires 42 and a plurality of address wire 44 is all identical and be not more than a minimum length, i.e. one the 3rd predetermined value, and the 3rd predetermined value should isometric and short as far as possible mode be determined according to data wire 42 and address wire 44, to possess synchronism preferably.
2, a plurality of data wires 42 and a plurality of address wire 44 are arranged in the surface of circuit board 20 and do not design perforate and pass for data wire 42 and address wire 44.Because, during by perforate, can produce the inductance of 1～4nH and the electric capacity of 0.3～0.8pF at high speed signal, these all can influence the propagation of signal.As not being able to, necessarily need the design via hole, then data wire 42 cross number of perforations with address wire 44 should be consistent, with the maintenance synchronism.
See also Fig. 6, Fig. 6 is the wiring skill schematic diagram of hard wired logic of the present invention.At last, the hard wired logic of the specific embodiment of the invention has also been considered the skill of cabling, and is as described below:
1, when wiring need be carried out right-angled bend, replaced with two miter angles turnings, shown in Fig. 6 a.
2, avoid forming branch line, promptly turning with miter angle connects a fulcrum, connects this fulcrum to replace with a branch line, shown in Fig. 6 b.This measure can effectively reduce the radiated interference between radio frequency component 24i.
3, same wiring, line footpath width should remain unchanged.Do not wait as width, can produce bottleneck at the thinnest place and cause the impedance inequality, and then cause electromagnetic interference.
The arrangements of components of having finished the specific embodiment of the invention is introduced with wiring, and the present invention is that the method with a unleaded logic encapsulation is encapsulated the circuit board in the wireless communication apparatus at last, and adopts the high logic method for packing of number of contacts.Therefore in specific embodiments of the invention, be to adopt unleaded spherical array package (lead free BGA).Adopt the high unleaded logic method for packing of number of contacts, not only removed the plumbous harm that environment and human body are caused, and, therefore improved the feasibility that element is integrated because the number of contacts of element increases.Therefore simultaneously a plurality of elements can be integrated in the element, significantly dwindle the area of circuit board, also reduce the quantity that circuit board uses green lacquer and plastic cement, reduce the harm of environment.
Be applied to find that specific embodiments of the invention and known art can effectively reduce the SAR value and reach 50% behind the actual wireless communication apparatus.Next describe the manufacture method of circuit board 20 of the present invention, see also Fig. 7, Fig. 7 is the flow chart of circuit board manufacturing method of the present invention.Comprehensive the above, can circuit board manufacturing method arrangement of the present invention is as follows:
Step 48: beginning.
Step 50: with a plurality of fundamental frequency assembly 28k, a plurality of MFM medium frequency module 26j and a plurality of radio frequency component 24i that circuit board 20 is comprised, centralized configuration is in a fundamental frequency assembly block 28, a MFM medium frequency module block 26 and a radio frequency component block 24 respectively.
Step 52: fundamental frequency assembly block 28, MFM medium frequency module block 26 and radio frequency component block 24 are carried out electromagnetic wave shielding respectively handle.
Step 54: form a button and engage block 30, button engages block 30 and comprises wiring layer 34 in a superficial layer 32 and.
Step 56: each assembly carries out the circuit connection in the block 30 so that fundamental frequency assembly block 28, MFM medium frequency module block 26, radio frequency component block 24 and button are engaged to utilize a low electromagnetic interference hard wired logic.
Step 58: carry out a unleaded logic array canned program with all component in the dimensional packaged circuit board 20.
Step 60: finish.
Comprehensive the above, can advantage arrangement of the present invention is as follows:
I. known technology mostly adopts the tantalum electric capacity that environment had harm, or takes ceramic condenser for fear of the harm of tantalum electric capacity, but sacrifices usefulness and communication quality.For fear of the shortcoming of known technology, the present invention emphasizes to need to adopt the electric capacity of non-toxic material made, but because the usefulness of ceramic condenser is not good, the present invention adopts niobium electric capacity.Niobium and tantalum belong to the element of VB family (periodic table of elements comes fifth line from left number) on chemical periodic table, and both only differ one-period, and (the niobium atom amount is 41, the tantalum atom amount is 73), therefore both are quite approximate on voltinism, but niobium does not have toxicity, can not exert an influence to environment, meet environmental protection requirement fully.
II. known technology is usually by the distribution layout, and the assembly of same frequency is placed on different parts, makes the different assembly of frequency mix mutually, hardly realizes that this measure will cause assembly electromagnetic interference to each other.What the present invention emphasized focuses on, and therefore the diverse location that radio frequency component block 24, MFM medium frequency module block 26 and fundamental frequency assembly block 28 is independent of circuit board 20 respectively can effectively reduce electromagnetic interference to carry out an independently electromagnetic wave shielding separately.
III. the present invention adopts internal layer wiring, and the top layer is because therefore ground connection be equivalent to carry out the electromagnetic wave shielding processing, and therefore the ability of anti-electromagnetic interference strengthens many.
IV. the present invention adopts a low electromagnetic interference hard wired logic, and the electromagnetic interference that is caused is reduced to minimum connecting up.
V. the present invention adopts unleaded spherical array package (lead free BGA).Adopt the high unleaded logic method for packing of number of contacts, not only removed the plumbous harm that environment and human body are caused, and, therefore improved the feasibility that element is integrated because the number of contacts of element increases.Therefore simultaneously a plurality of elements can be integrated in the element, significantly dwindle the area of circuit board, also reduce the quantity that circuit board uses green lacquer and plastic cement, reduce the harm of environment.
VI. be applied to find that specific embodiments of the invention and known art can effectively reduce the SAR value and reach 50% behind the actual wireless communication apparatus.
By the above detailed description of preferred embodiments, be to wish to know more to describe feature of the present invention and spirit, and be not to come category of the present invention is limited with the above-mentioned preferred embodiment that is disclosed.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (30)
1. circuit board that is applied in the wireless communication apparatus, this wireless communication apparatus comprises an antenna, a keyboard and this circuit board, this antenna is in order to acknowledge(ment) signal and transfer to this circuit board, and the voice signal or the letter signal that receive after this circuit board is handled are also exported; This keyboard is imported a Word message in order to a user to be provided; And this circuit board is in order to handling this antenna received signal, and handles a voice messaging of this user's desire output and this literal information and make it to become this voice signal or this literal signal to be transmitted via this antenna; This circuit board comprises a radio frequency component block, one MFM medium frequency module block, an one fundamental frequency assembly block and a button engage block, this radio frequency component block comprises a plurality of radio frequency components, this MFM medium frequency module block comprises a plurality of MFM medium frequency modules, this fundamental frequency assembly block comprises a plurality of fundamental frequency assemblies, this radio frequency, intermediate frequency and fundamental frequency assembly block are independent of the diverse location of this circuit board respectively to carry out an independently electromagnetic wave shielding separately, and be in order to this voice messaging or this literal information in proper order via a fundamental frequency handling procedure, an one intermediate frequency process program and a radio frequency processing program transfer this voice signal or this literal signal that can transmit via this antenna to, and in order to the signal that will receive through this antenna through this radio frequency processing program, this intermediate frequency process program and this fundamental frequency handling procedure are converted to can be by this user's reading or the information of listening to; And this button joint block comprises wiring layer in a superficial layer and, this superficial layer is in order to press keyed engagement with this, and handle with as electromagnetic wave shielding that should interior wiring layer through a ground connection, wiring layer produces information corresponding in order to when this button is pushed by this user according to pressing position in being somebody's turn to do.
2. circuit board as claimed in claim 1 is characterized in that each block all comprises a plurality of capacity cells, and these capacity cells are to be made by a non-toxic material.
3. circuit board as claimed in claim 2 is characterized in that, this non-toxic material is a ceramic material.
4. circuit board as claimed in claim 2 is characterized in that, this non-toxic material is a metallic element niobium.
5. circuit board as claimed in claim 1, it is characterized in that, these blocks can further be divided into a noise jamming district and a non-noise jamming district, and this noise jamming district is to use a plurality of niobium capacity cells, and this non-noise jamming district is to use a plurality of ceramic condenser elements.
6. circuit board as claimed in claim 1 is characterized in that, further adopts unleaded logic encapsulation, is encapsulated each assembly in each block.
7. circuit board as claimed in claim 6 is characterized in that, this unleaded logic encapsulation is unleaded spherical array package.
8. circuit board as claimed in claim 1 is characterized in that, further adopts a hard wired logic.
9. circuit board as claimed in claim 8 is characterized in that, this hard wired logic is that a power line and the ground wire employing of each element is arranged in parallel.
10. circuit board as claimed in claim 8 is characterized in that, this hard wired logic is that a power line and the width between a ground wire of each element is not less than one first predetermined value.
11. circuit board as claimed in claim 8, it is characterized in that, this hard wired logic be between a power line of each element and a ground wire when needing to add a decoupling capacitor when removing both couplings, this decoupling capacitor is not more than one second predetermined value with this interelement distance.
12. circuit board as claimed in claim 8 is characterized in that, this hard wired logic is to carry out an earth connection to arrange in a plurality of gaps of this circuit board.
13. circuit board as claimed in claim 8 is characterized in that, this hard wired logic is that the length of a plurality of data wires of each element and a plurality of address wires is all identical and be not more than one the 3rd predetermined value.
14. circuit board as claimed in claim 8 is characterized in that, this hard wired logic is that a plurality of data wires of each element and a plurality of address wire place the surface of this circuit board and do not design perforate and pass for these data wires and these address wires.
15. circuit board as claimed in claim 8 is characterized in that, this hard wired logic is when wiring need be carried out right-angled bend, and turning with two miter angles is replaced.
16. circuit board as claimed in claim 8 is characterized in that, this hard wired logic is to turn with miter angle to connect a fulcrum, connects this fulcrum to replace with a branch line.
17. method of manufacturing circuit board, this circuit board is to be applied in the unlimited communication device, this wireless communication apparatus further comprises an antenna, one keyboard is to be electrically connected with this circuit board, this antenna is in order to acknowledge(ment) signal and transfer to circuit board, and the voice signal or the letter signal that receive after circuit board is handled are also exported, this keyboard is imported a Word message in order to a user to be provided, this circuit board is in order to handle this antenna received signal, and handle that a voice messaging of this user's desire output and this literal information makes become this voice signal or this literal signal to be transmitted via this antenna, this manufacture method comprises:
With a plurality of fundamental frequency assemblies that this circuit board comprised, a plurality of MFM medium frequency module and a plurality of radio frequency component, centralized configuration is in a fundamental frequency assembly block, a MFM medium frequency module block and a radio frequency component block respectively;
This fundamental frequency assembly block, this MFM medium frequency module block and this radio frequency component block are carried out an electromagnetic wave shielding respectively to be handled;
Form a button and engage block, this button engages block and comprises wiring layer in a superficial layer and, this superficial layer is in order to press keyed engagement with this, and handle with as electromagnetic wave shielding that should interior wiring layer through a ground connection, wiring layer produces information corresponding in order to when this button is pushed by this user according to pressing position in being somebody's turn to do;
Each assembly carries out the circuit connection in the block so that this fundamental frequency assembly block, this MFM medium frequency module block, this radio frequency component block and this button are engaged to utilize a low electromagnetic interference hard wired logic;
Carry out a unleaded logic array canned program to encapsulate all component in this circuit board.
18. manufacture method as claimed in claim 17 is characterized in that, each block all comprises a plurality of capacity cells in this circuit board, and these capacity cells are to be made by a non-toxic material.
19. manufacture method as claimed in claim 18 is characterized in that, this non-toxic material is a ceramic material.
20. manufacture method as claimed in claim 18 is characterized in that, this non-toxic material is a metallic element niobium.
21. manufacture method as claimed in claim 17, it is characterized in that, this fundamental frequency assembly block, this MFM medium frequency module block and this radio frequency component block are in order to transferring this voice messaging or this literal information to can transmit via this antenna this voice signal or this literal signal via a low frequency handling procedure, an intermediate frequency process program and a radio frequency processing program in proper order, and be converted to the information that can be read or be listened to by this user through this radio frequency processing program, this intermediate frequency process program and this low frequency handling procedure in order to the signal that will receive through this antenna.
22. manufacture method as claimed in claim 17, it is characterized in that, these blocks can further be divided into a noise jamming district and a non-noise jamming district, and this noise jamming district uses a plurality of niobium capacity cells, and this non-noise jamming district uses a plurality of ceramic condenser elements.
23. manufacture method as claimed in claim 17 is characterized in that, a power line that this low electromagnetic interference hard wired logic is each element and a ground wire are adopted and are arranged in parallel.
24. manufacture method as claimed in claim 17 is characterized in that, this low electromagnetic interference hard wired logic is that a power line and the width between a ground wire of each element is not less than one first predetermined value.
25. manufacture method as claimed in claim 17, it is characterized in that, should low electromagnetic interference hard wired logic be between a power line of each element and a ground wire when needing to add a decoupling capacitor when removing both couplings, this decoupling capacitor and this interelement distance are not more than one second predetermined value.
26. manufacture method as claimed in claim 17 is characterized in that, this low electromagnetic interference hard wired logic is to carry out an earth connection to arrange in a plurality of gaps of this circuit board.
27. manufacture method as claimed in claim 17 is characterized in that, a plurality of data wires that this low electromagnetic interference hard wired logic is each element and the length of a plurality of address wires are all identical and be not more than one the 3rd predetermined value.
28. manufacture method as claimed in claim 17 is characterized in that, a plurality of data wires that this low electromagnetic interference hard wired logic is each element and a plurality of address wire place the surface of this circuit board and do not design perforate and pass for these data wires and these address wires.
29. manufacture method as claimed in claim 17 is characterized in that, this low electromagnetic interference hard wired logic is when wiring need be carried out right-angled bend, and turning with two miter angles is replaced.
30. manufacture method as claimed in claim 17 is characterized in that, this low electromagnetic interference hard wired logic is to turn with miter angle to connect a fulcrum, connects this fulcrum to replace with a branch line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100156285A CN100403865C (en) | 2004-01-05 | 2004-01-05 | Circuit board for wireless communication device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100156285A CN100403865C (en) | 2004-01-05 | 2004-01-05 | Circuit board for wireless communication device and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1642403A CN1642403A (en) | 2005-07-20 |
| CN100403865C true CN100403865C (en) | 2008-07-16 |
Family
ID=34868032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100156285A Expired - Lifetime CN100403865C (en) | 2004-01-05 | 2004-01-05 | Circuit board for wireless communication device and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100403865C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101801186B1 (en) * | 2011-02-25 | 2017-11-24 | 엘지전자 주식회사 | Mobile terminal |
| CN102447757B (en) * | 2011-08-29 | 2014-07-16 | 惠州硕贝德无线科技股份有限公司 | Method for reducing influence of keypad of qwerty mobile phone on radiation performance of antenna |
| CN102523731A (en) * | 2011-12-06 | 2012-06-27 | 惠州Tcl移动通信有限公司 | Mobile terminal |
| CN104602368B (en) * | 2014-12-18 | 2018-06-08 | 小米科技有限责任公司 | Mobile terminal |
| US10277275B2 (en) | 2015-09-08 | 2019-04-30 | Google Llc | Audio media streaming device |
| US9736531B2 (en) | 2015-09-08 | 2017-08-15 | Google Inc. | Video media streaming device |
| JP6959221B2 (en) * | 2016-03-29 | 2021-11-02 | シチズン時計株式会社 | Portable radio clock |
| CN110289495B (en) * | 2019-06-29 | 2021-11-12 | 上海创功通讯技术有限公司 | Antenna device and electronic apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307779A (en) * | 1994-05-13 | 1995-11-21 | Oki Electric Ind Co Ltd | Shield structure for portable telephone set |
| JPH11224992A (en) * | 1998-02-06 | 1999-08-17 | Sony Corp | Electronic equipment |
| CN1337761A (en) * | 2000-07-05 | 2002-02-27 | 索尼株式会社 | Antenna apparatus and portable communication device |
| JP2002353842A (en) * | 2001-05-29 | 2002-12-06 | Matsushita Electric Works Ltd | Wireless module for mobile terminal |
| CN2550994Y (en) * | 2002-06-21 | 2003-05-14 | 明基电通股份有限公司 | Mobile phone and its double printed circuit board |
-
2004
- 2004-01-05 CN CNB2004100156285A patent/CN100403865C/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307779A (en) * | 1994-05-13 | 1995-11-21 | Oki Electric Ind Co Ltd | Shield structure for portable telephone set |
| JPH11224992A (en) * | 1998-02-06 | 1999-08-17 | Sony Corp | Electronic equipment |
| CN1337761A (en) * | 2000-07-05 | 2002-02-27 | 索尼株式会社 | Antenna apparatus and portable communication device |
| JP2002353842A (en) * | 2001-05-29 | 2002-12-06 | Matsushita Electric Works Ltd | Wireless module for mobile terminal |
| CN2550994Y (en) * | 2002-06-21 | 2003-05-14 | 明基电通股份有限公司 | Mobile phone and its double printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1642403A (en) | 2005-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100403865C (en) | Circuit board for wireless communication device and its manufacturing method | |
| CN111697318B (en) | Wireless communication device | |
| Valkonen et al. | Inherently non‐resonant multi‐band mobile terminal antenna | |
| CN106972896A (en) | A kind of interference spectrum processing method and mobile terminal | |
| CN101222081A (en) | Antenna device with ground plane coupled to conductive portion of an electronic device | |
| CN204947063U (en) | Nfc antenna system and electronic equipment | |
| CN101699836A (en) | Method for debugging radio-frequency circuit through microstrip line | |
| TW595278B (en) | Circuit board in wireless communication apparatus and its manufacturing method | |
| TW200805783A (en) | Shield cavity integrated patch antenna structure | |
| CN108200755A (en) | A kind of double layer screen case | |
| CN201259891Y (en) | Multi-chip encapsulation module having electromagnetic construction | |
| CN1324523C (en) | IC card | |
| CN202362814U (en) | Double-frequency communication radio frequency SIM card | |
| CN113410610A (en) | Novel anti-interference module of antenna | |
| CN1937907A (en) | Shielding assembly and its electronic device | |
| CN205377951U (en) | Electronic equipment and shielding frame , shield cover thereof | |
| CN108321532B (en) | Electronic device | |
| CN204316493U (en) | Mobile terminal | |
| CN201127101Y (en) | Device for testing mobile phone | |
| CN207573838U (en) | For improving the device of 2G module by signal sensitivity under plate connector for substrate environment | |
| CN204014025U (en) | A kind of speaker circuit | |
| KR100524129B1 (en) | EMI Paint Distribution method for SAR Reduction in Mobile Handsets | |
| CN205812117U (en) | A kind of mobile phone based on GSM R | |
| Elias et al. | Optimization of Electromagnetic Interference Measurement by Convolutional Neural Network | |
| TW511453B (en) | EMI preventing device and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161212 Address after: 100085 Beijing city Haidian District Qinghe Street No. 68 Huarun colorful city shopping center two floor 9 room 01 Patentee after: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Address before: 200233 Shanghai City Guiqin Road No. 7 Patentee before: Inventec Appliances (Shanghai) Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080716 |