CN100402702C - Single-acid micro adding device and method - Google Patents
Single-acid micro adding device and method Download PDFInfo
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- CN100402702C CN100402702C CNB2004100277754A CN200410027775A CN100402702C CN 100402702 C CN100402702 C CN 100402702C CN B2004100277754 A CNB2004100277754 A CN B2004100277754A CN 200410027775 A CN200410027775 A CN 200410027775A CN 100402702 C CN100402702 C CN 100402702C
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- Prior art keywords
- acid
- sour
- list
- nitration mixture
- groove
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- 239000002253 acid Substances 0.000 title claims abstract description 152
- 238000000034 method Methods 0.000 title claims description 31
- 238000005530 etching Methods 0.000 claims abstract description 62
- 238000012544 monitoring process Methods 0.000 claims abstract description 31
- 239000000203 mixture Substances 0.000 claims description 85
- 238000006396 nitration reaction Methods 0.000 claims description 85
- 239000007795 chemical reaction product Substances 0.000 claims description 11
- 229910052738 indium Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- 230000036632 reaction speed Effects 0.000 claims description 9
- 238000004448 titration Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 239000013589 supplement Substances 0.000 abstract 3
- 239000007788 liquid Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
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- Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
Abstract
The present invention discloses a monoacid micro addition device which comprises an etching unit and an addition monitoring unit, wherein the etching unit comprises an etching chamber and an acid mixing tank; the addition monitoring unit comprises a monoacid test instrument, a monoacid supplement calculator and a monoacid addition tank; the monoacid test instrument and the acid mixing tank are connected; the monoacid supplement calculator, the monoacid test instrument and the monoacid addition tank are connected; the monoacid addition tank and the acid mixing tank are also connected; the acid mixing tank, the monoacid test instrument, the monoacid supplement calculator and the monoacid addition tank are connected end to end and form a close control loop of monoacid micro addition.
Description
[technical field]
The invention relates to a kind of wet etching equipment, particularly about the sour micro-adding device of the list in a kind of wet etching machine and single sour indium addition method.
[background technology]
Wet etching (Wet Etching) technology is low with its cost, productive rate is high, reliable, and to light shield and base material good selective, at Thin Film Transistor-LCD (Thin-Film Transistor Liquid Crystal Display, TFT-LCD) be used widely in the etching process of FEOL to metal, as to etching of molybdenum/aluminium/molybdenum layer etc.In the wet etch process, the etching solution (Etchant) of normal use is for containing the nitration mixture that the acid of certain proportion list mixes, yet, nitration mixture often causes the change in concentration of wherein a certain single acid with the increase of etch process time, thereby cause rate of etch to change, make etching inhomogeneous, need process even cause product rejection again.Therefore, make the concentration of nitration mixture keep stablizing for a long time particular importance, the assurance of changing sour opportunity of nitration mixture also becomes the key of etch process.
Way in the past, often change sour opportunity according to a certain amount of nitration mixture etching products number of packages or processing procedure decision working time, because this method of rule of thumb judging, can't monitor the change in concentration of single acid quantitatively, for the purpose of safe, it is all shorter that it changes the acid time, causes and change acid frequently, and production cost is higher.
Along with the generation of the survey of foundation titration or spectrophotometric principle acid instrument, the sour adding method of a kind of list is to utilize to survey sour instrument concentration of certain single acid in the nitration mixture is monitored, and each the single acid concentration that obtains according to monitoring changes the acid opportunity of changing of deciding.What the change in concentration of acid caused although this method can reduce product scraps, and growth acid changing period, but still need the passively change in concentration of tracking report acid, if the concentration range of single acid drops to below the lower limit that processing procedure requires concentration, then still need to change acid solution to keep processing procedure stable.
Seeing also Fig. 1, is the single sour Monitoring systems structural representation of a kind of prior art.The sour monitoring system 10 of this list comprises an etching chamber 111, a nitration mixture groove 112, a pump 1120 and the sour instrument 113 of a single acid survey.The mixed acid liquid of this nitration mixture groove 112 is injected into this etching chamber 111 from the top by coupled pump 1120; Nitration mixture is finished the etching step to metal in etching chamber 111; These etching chamber 111 bottoms are communicated with nitration mixture groove 112, make etching chamber 111 etchings enter nitration mixture groove 112 with the waste liquid of finishing, and pump 1120 constantly injects etching chamber 111 with the mixed acid liquid in the nitration mixture groove 112 and carries out metal etch continuously; Single acid is surveyed sour instrument 113 and is communicated with nitration mixture groove 112, it is to adopt the spectrophotometric principle that sour instrument 113 is surveyed in this list acid, by measuring the absorbancy of single sour A in a certain range of frequency of light in the nitration mixture groove 112, contrast standard solution absorbance typical curve, thereby try to achieve the concentration of the sour A of this list to be measured, monitor the change in concentration of single sour A in the nitration mixture groove 112; Require range of concentrations when surpassing processing procedure,, manually add the sour A of a certain amount of list to keep the concentration stabilize of single sour A in the nitration mixture groove 112 according to the change in concentration of this monitoring.
When showing the concentration of single sour A in the nitration mixture grooves 112, sour instrument 113 monitorings of the sour survey of this list require the lower of concentration to prescribe a time limit near processing procedure, need to suspend etching, by adding nitration mixture in single sour A or the emptying nitration mixture groove 112 toward nitration mixture groove 112, cause the sour A fluctuation of concentration of list in the nitration mixture big, the rate of etch instability of processing procedure, and acid changing period is short.
[summary of the invention]
, processing procedure rate of etch instability big for the fluctuation of the sour adding set list of the list acid concentration that overcomes prior art and the short problem of acid changing period the invention provides the sour micro-adding device of list that a kind of single acid concentration fluctuation is little, the processing procedure rate of etch stable and acid changing period is long.
The present invention also provides a kind of list sour micro-addition means.
The technical scheme that technical solution problem of the present invention adopts is: provide a kind of list sour micro-adding device, comprise an etching unit and a monitoring adding device, this etching unit comprises an etching chamber and a nitration mixture groove; This monitoring adding device comprises that sour instrument is surveyed in a single acid, a single acid replenishes exerciser and groove is added in a single acid; The sour instrument of this single acid survey links to each other with this nitration mixture groove, and this single sour exerciser that replenishes links to each other with this list acid sour instrument of survey and single sour groove that adds, and single sour groove that adds links to each other with the nitration mixture groove again; This nitration mixture groove, the sour instrument of list acid survey, the additional exerciser of list acid and single sour interpolation groove join end to end and consist of single sour indium addition closed control loop, the change in concentration of single acid in this nitration mixture groove of sour instrument monitoring and the concentration of etching reaction product are surveyed in this single acid, when the concentration of this etching reaction product does not reach when affecting etching reaction speed, this list acid replenishes exerciser and controls the single acid of this list acid interpolation groove interpolation to this nitration mixture groove, and the single acid concentration in this nitration mixture groove is maintained in the constant scope; When the concentration of this etching reaction product reaches when affecting etching reaction speed, this list acid replenishes exerciser and controls this list acid and add groove and add single acid and arrive this nitration mixture groove, makes the single acid concentration in this nitration mixture groove exceed this constant scope.
Another technical scheme that technical solution problem of the present invention adopts is: provide a kind of list sour indium addition method, the change in concentration of single acid changes into data signals with single sour change in concentration in the monitoring nitration mixture groove; The data signal is calculated, and send control instruction; Control instruction is sent to measuring pump, and single acid amount is added in control, when the concentration of this etching reaction product does not reach when affecting etching reaction speed, the single acid concentration in this nitration mixture groove is maintained in the constant scope; When the concentration of this etching reaction product reaches when affecting etching reaction speed, make the single acid concentration in this nitration mixture groove exceed this constant scope.
Compared to prior art, because the single sour micro-adding device of the present invention comprises that a single acid replenishes exerciser, groove and a central chemical supply unit are added in a single acid, in conjunction with the single acid concentration in the sour instrument monitoring nitration mixture groove of single acid survey, change in concentration signal according to the single acid of monitoring, the additional exerciser of single acid calculates and drives measuring pump and replenishes a certain amount of list acid to the nitration mixture groove from single sour groove that adds, it is stable to keep single acid concentration, and it is stable to keep metal etching rate, prolongs acid changing period.
[description of drawings]
Fig. 1 is the single sour Monitoring systems structural representation of a kind of prior art.
Fig. 2 is the single sour micro-adding device embodiment structural representation of the present invention.
Fig. 3 is that concentration curve and the acid changing period of single sour A concerns schematic diagram in the nitration mixture groove of the single sour micro-adding device of the present invention.
Fig. 4 is process set concentration adjustment and the acid changing period relation schematic diagram of single sour A in the nitration mixture groove of the single sour micro-adding device of the present invention.
[embodiment]
Seeing also Fig. 2, is the single sour micro-adding device embodiment structural representation of the present invention.The sour micro-adding device 20 of this list comprises an etching unit 201, monitoring adding device 202 and a central chemical supply unit 203, and this etching unit 201 comprises an etching chamber 211, a nitration mixture groove 212 and a pump 2120; This monitoring adding device 202 comprises that sour instrument 213 is surveyed in a single acid, a list acid replenishes exerciser 214, two single acid interpolation groove 215 and two measuring pumps 2150; This central authorities chemistry supply unit 203 comprises two single acid storage grooves 2161 and nitration mixture storage groove 2162.
The mixed acid liquid of this nitration mixture groove 212 injects this etching chamber 211 by coupled pump 2120 from the top; Nitration mixture is finished the etching step to metal in etching chamber 211; These etching chamber 211 bottoms are communicated with this nitration mixture groove 212, make etching chamber 211 etchings flow back to this nitration mixture groove 212 with the waste liquid of finishing, and pump 2120 constantly injects etching chamber 211 with the mixed acid liquid in the nitration mixture groove 212 and carries out metal etch continuously.
This monomer acid acidimeter 213 links to each other with this nitration mixture groove 212, the change in concentration of single acid in the monitoring nitration mixture groove 212, and monomer acid acidimeter 213 is replenished exerciser 214 with single acid concentration signal transmission to coupled single acid that monitoring obtains; This single acid replenishes exerciser 214 and links to each other respectively by two measuring pumps 2150 with two single sour adding troughs 215, single sour adding trough 215 links to each other with nitration mixture groove 212 again, these single sour exerciser 214 control and its measuring pumps that link to each other respectively 2150 that replenish are to control the sour adding trough 215 of this list to adding single sour dosage with its nitration mixture groove that links to each other respectively 212; This nitration mixture groove 212, monomer acid acidimeter 213, single acid replenish exerciser 214 and single sour adding trough 215 joins end to end, and consist of single sour indium addition closed control loop.
When showing a certain single acid concentration in the nitration mixture groove 212, monitoring surpasses the scope that processing procedure requires concentration, single acid concentration signal of monomer acid acidimeter 213 monitorings is sent to the additional exerciser 214 of single acid by data wire and is calculated, drive measuring pump 2150 and replenish a certain amount of single acid to nitration mixture groove 212 from single sour adding trough 215, set value in the processing procedure safe concentration to stablize single acid concentration; Two single acid storage grooves 2161 of this central authorities chemistry supply unit 203 link to each other respectively with single sour adding trough 215, replenish various single acid, and 2162 direct nitration mixture grooves 212 of nitration mixture storage groove link to each other and add nitration mixture.
Seeing also Fig. 3, is that concentration curve and the acid changing period of single sour A concerns synoptic diagram in the nitration mixture groove 212 of the single sour micro-adding device of the present invention.C
sBe the process set concentration of single sour A, C
MinBe the processing procedure least concentration of single sour A, C
pLine is the concentration of etching reaction resultant.The sour Monitoring systems 10 of the list of prior art (consulting Fig. 1) in the A acid concentration near least concentration C
MinThe time change acid, acid changing period is T1; The sour micro-adding device 20 of list of the present invention whenever fixedly for some time carry out the sour A supply of list automatically, so the concentration that can keep single sour A is at C
sNear, when change acid and depend on C
p, work as C
pReach and just change acid when being enough to influence the etching chemistry molecular balance, acid changing period is T2, says lessly relatively compared to a large amount of acid of nitration mixture groove 212 because of the resultant amount, so can significantly prolong acid changing period, it is stable to keep single acid concentration, thereby keeps rate of etch stable.
Seeing also Fig. 4, is process set concentration adjustment and the acid changing period relation schematic diagram of single sour A in the nitration mixture groove 212 of the single sour micro-adding device of the present invention.It is to adopt the spectrophotometric principle that sour instrument 213 is surveyed in single acid of the single sour micro-adding device 20 of the present invention, also can measure simultaneously the concentration C of etching reaction product simultaneously in the monitoring acid concentration
p, work as C
pValue reaches in the time of will having influence on etching reaction speed, heightens the process set concentration C of single sour A
sTo appropriate value, it is stable to keep metal etching rate, can prolong acid changing period.
Various different single acid in the nitration mixture groove 212 all are to adopt same principle to finish the interpolation of single acid.
Compared to prior art, because the single sour micro-adding device 20 of the present invention comprises that a single acid replenishes exerciser 214, groove 215 and a central chemical supply unit 216 are added in a single acid, survey single acid concentration that sour instrument 213 is monitored in the nitration mixture grooves 212 in conjunction with single acid, change in concentration signal according to the single acid of monitoring, the additional exerciser 214 of single acid calculates and drives measuring pump 2150 and replenishes a certain amount of list acid to nitration mixture groove 212 from single sour groove 215 that adds, it is stable to keep single acid concentration, it is stable to keep metal etching rate, prolongs acid changing period.
Single acid is surveyed sour instrument 213 and is adopted the spectrophotometric principle, and the survey acid concentration time is fast, and need not get sour sample liquid, can connect the change in concentration that many wet etching machines are monitored single acid in each nitration mixture groove 212 in turn.
This list acid is surveyed sour instrument 213 and also can be adopted the titration principle, the titration principle is to extract a certain amount of mixed acid liquid from nitration mixture groove 212, a kind of reagent solution of known accurate concentration is added drop-wise in the mixed acid liquid of this extraction, till added reagent and tested single acid are according to the stoichiometric relation quantitative reaction, calculate institute according to the concentration of reagent solution with consumption then and survey the sour concentration of list.
Claims (13)
1. the sour micro-adding device of list comprises an etching unit and a monitoring adding device, and this etching unit comprises an etching chamber and a nitration mixture groove; This monitoring adding device comprises a monomer acid acidimeter, and this monomer acid acidimeter links to each other with this nitration mixture groove; It is characterized in that: this monitoring adding device comprises that also a single acid replenishes exerciser and a single sour adding trough; This single acid replenishes exerciser and links to each other with this monomer acid acidimeter and single sour adding trough, and single sour adding trough links to each other with the nitration mixture groove again; This nitration mixture groove, monomer acid acidimeter, the additional exerciser of single acid and single sour adding trough join end to end and consist of single sour indium addition closed control loop, this monomer acid acidimeter is monitored the change in concentration of single acid in this nitration mixture groove and the concentration of etching reaction product, when the concentration of this etching reaction product does not reach when affecting etching reaction speed, this list acid replenishes exerciser and controls the single acid of the sour adding trough interpolation of this list to this nitration mixture groove, and the single acid concentration in this nitration mixture groove is maintained in the constant scope; When the concentration of this etching reaction product reaches when affecting etching reaction speed, this list acid replenishes exerciser and controls the sour adding trough of this list and add single acid and arrive this nitration mixture groove, makes the single acid concentration in this nitration mixture groove exceed this constant scope.
2. the sour micro-adding device of list as claimed in claim 1 is characterized in that: the sour micro-adding device of this list also comprises a central chemical supply unit, and this central authorities chemistry supply unit adds the acid of groove supplementary schedule to this single acid, and replenishes nitration mixture to the nitration mixture groove.
3. the sour micro-adding device of list as claimed in claim 2, it is characterized in that: this central authorities chemistry supply unit comprises a single acid storage groove and nitration mixture storage groove, this single acid storage groove adds groove with single acid of monitoring adding device and links to each other, and replenishes single acid that groove is added in this single acid; This nitration mixture storage groove links to each other with the nitration mixture groove of etching unit, can directly replenish nitration mixture.
4. the sour micro-adding device of list as claimed in claim 1, it is characterized in that: this monitoring adding device comprises a measuring pump, the single acid of connection replenishes exerciser and adds groove with list acid, adds groove to the single acid of nitration mixture groove interpolation of etching unit by the single acid of the additional exerciser control of single acid.
5. the sour micro-adding device of list as claimed in claim 1 is characterized in that: this etching unit comprises a pump, and the nitration mixture in the nitration mixture groove is carried in etching chamber.
6. the sour micro-adding device of list as claimed in claim 1 is characterized in that: this list acid is surveyed sour instrument and can be connected with two nitration mixture grooves, and monitoring is single sour change in concentration wherein.
7. the sour micro-adding device of list as claimed in claim 1 is characterized in that: the sour instrument employing of this list acid survey spectrophotometric principle.
8. the sour micro-adding device of list as claimed in claim 1 is characterized in that: the sour instrument employing of this list acid survey titration principle.
9. the sour indium addition method of list comprises the steps: to monitor single sour change in concentration in the nitration mixture groove, and single sour change in concentration is changed into data signals; The data signal is calculated, and send control instruction; Control instruction is sent to measuring pump, and single acid amount is added in control, when the concentration of this etching reaction product does not reach when affecting etching reaction speed, the single acid concentration in this nitration mixture groove is maintained in the constant scope; When the concentration of this etching reaction product reaches when affecting etching reaction speed, make the single acid concentration in this nitration mixture groove exceed this constant scope.
10. the sour micro-addition means of list as claimed in claim 9 is characterized in that: the sour micro-addition means of this list can be monitored the change in concentration of single acid in two nitration mixture grooves in proper order.
11. the sour indium addition method of list as claimed in claim 9 is characterized in that: the change in concentration of the single acid of monitoring adopts AAS.
12. the sour indium addition method of list as claimed in claim 9 is characterized in that: the change in concentration of the single acid of monitoring adopts titration.
13. the sour indium addition method of list as claimed in claim 9 is characterized in that: the switch amplitude of control instruction control measuring pump, add single acid amount with control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100277754A CN100402702C (en) | 2004-06-19 | 2004-06-19 | Single-acid micro adding device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100277754A CN100402702C (en) | 2004-06-19 | 2004-06-19 | Single-acid micro adding device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1710146A CN1710146A (en) | 2005-12-21 |
| CN100402702C true CN100402702C (en) | 2008-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100277754A Expired - Lifetime CN100402702C (en) | 2004-06-19 | 2004-06-19 | Single-acid micro adding device and method |
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| Country | Link |
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| CN (1) | CN100402702C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108614027B (en) * | 2018-04-28 | 2020-05-29 | 武汉华星光电技术有限公司 | Liquid change monitoring device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1456709A (en) * | 2002-05-10 | 2003-11-19 | 韩国Dns株式会社 | Chemical agent supplier |
| JP2004137519A (en) * | 2002-10-15 | 2004-05-13 | Nagase & Co Ltd | Method for controlling etching liquid, and apparatus for controlling etching liquid |
-
2004
- 2004-06-19 CN CNB2004100277754A patent/CN100402702C/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1456709A (en) * | 2002-05-10 | 2003-11-19 | 韩国Dns株式会社 | Chemical agent supplier |
| JP2004137519A (en) * | 2002-10-15 | 2004-05-13 | Nagase & Co Ltd | Method for controlling etching liquid, and apparatus for controlling etching liquid |
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| Publication number | Publication date |
|---|---|
| CN1710146A (en) | 2005-12-21 |
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