CN100394620C - Mould and method for packing LED - Google Patents
Mould and method for packing LED Download PDFInfo
- Publication number
- CN100394620C CN100394620C CNB2005100088051A CN200510008805A CN100394620C CN 100394620 C CN100394620 C CN 100394620C CN B2005100088051 A CNB2005100088051 A CN B2005100088051A CN 200510008805 A CN200510008805 A CN 200510008805A CN 100394620 C CN100394620 C CN 100394620C
- Authority
- CN
- China
- Prior art keywords
- accommodation space
- weld pad
- mould
- support frame
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000012856 packing Methods 0.000 title abstract 3
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 230000004308 accommodation Effects 0.000 claims description 35
- 238000005538 encapsulation Methods 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 abstract description 11
- 239000013078 crystal Substances 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000002699 waste material Substances 0.000 description 4
- 230000008034 disappearance Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Abstract
The present invention relates to a mould and method for packing an LED. The mould for packing an LED comprises a bottom plate and a plurality of supporting racks, wherein the supporting racks are arranged on the bottom plate and are used for supporting a welding pad (Pad) which is provided with a plurality of unpacked bare crystals; the supporting racks are mutually connected to form a plurality of containing spaces used for correspondingly containing the bare crystals; thus, when the welding pad penetrates a pressing plate to press the bare crystals inside the corresponding containing spaces, the pressing force of the pressing plate is averagely distributed through the supporting racks to avoid packaging glue in the containing spaces from excessively overflowing so as to achieve the advantages of not wasting the packaging glue, not using known adhesive and not removing large amount of overflowing glue.
Description
Technical field
The present invention is relevant for a kind of mould that is used for encapsulation LED, and light emitter diode seal method, especially refer to a kind of mould that sees through, with the mould that is used for encapsulation LED of the naked crystalline substance before corresponding ccontaining a plurality of encapsulation in described accommodation space, and light emitter diode seal method with a plurality of accommodation spaces.
Prior art
See also shown in Figure 1ly, it is known bracing frame when not imposing rubberizing, and packaging plastic overflows to the schematic diagram of bracing frame and weld pad.By among the figure as can be known, the known mould 10a that is used for encapsulation LED has bracing frame 12a, and the accommodation space 13a by peripheral bracing frame shaping that 12a surrounds of a base plate 11a, a periphery, and is equipped with packaging plastic (scheming not show) in this accommodation space 13a.The light-emitting diode before the encapsulation does not have a plurality of naked brilliant 20a, and described naked brilliant 20a is arranged on a weld pad (Pad) 30a.By this weld pad of pressing plate 40a pressing 30a, described naked brilliant 20a is placed in the accommodation space 13a of this mould 10a, so that this packaging plastic (figure does not show) is packaged on this naked brilliant 20a.
See also shown in Figure 2, the pressure distribution schematic diagram when it is known weld pad pressurized.General convention as can be known, when this weld pad 30a is horizontal when overstating this mould 10a, because of the relation of this weld pad 30a pressurized produces barometric gradient, that is the suffered pressure minimum of the side of this weld pad 30a, and central authorities concentrate place, the pressure maximum that it is suffered for load.
Therefore, when this weld pad 30a is horizontal when overstating in this mould 10a, not only this weld pad 30a and described naked brilliant 20a can concentrate because of loading and produce distortion, more make described naked brilliant 20a in the sealing process, this packaging plastic takes place excessively overflow glue (arrow 50a is the packaging plastic of overflow) in this weld pad 30a back side, and cause the waste of packaging plastic and the shortcoming that can't remove, more form the packaging plastic of this excessive glue and stress on the concentrated place of load, and cause the possibility of excessive glue once more through this pressing plate 40a in the weld pad 30a back side.
For solving the problem of above-mentioned excessive glue, the general practice is sealed the excessive Jiao Chu that is easy to generate that this weld pad 30a and this mould 10a ask by a rubberizing (figure does not show).So, the anti-overflow glue poor effect of this rubberizing (figure does not show) on using, and cause unnecessary cost waste.
As from the foregoing, the above-mentioned known module that is used for encapsulation LED, and light emitter diode seal method on reality is used, obviously have inconvenience and exist with disappearance, and can treat in addition improver.
Edge is, the improving of the above-mentioned disappearance of inventor's thoughts, and according to the correlation experience of being engaged in for many years in this respect, and concentrated the observation and research, and cooperate the utilization of scientific principle, and propose a kind of reasonable in design and effectively improve the present invention of above-mentioned disappearance.
Summary of the invention
Technical problem to be solved by this invention, be to provide a kind of mould that is used for encapsulation LED, and light emitter diode seal method, it is by a plurality of bracing frames of mould, with the suffered pressing strength of mean allocation weld pad, take place excessively to be spilled over to the weld pad back side must exempt from packaging plastic, and then reach the advantage of saving cost and need not remove a large amount of glue that overflow.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, provide a kind of mould that is used for encapsulation LED, include: base plate and a plurality of bracing frame.Support frame as described above is arranged on this base plate, and support frame as described above is connected with each other, to surround a plurality of accommodation spaces, support frame as described above is used to support a weld pad, this weld pad is provided with a plurality of not naked crystalline substances of encapsulation, and each naked crystalline substance is placed in each accommodation space accordingly, holds packaging plastic in each accommodation space; Wherein, when this weld pad sees through a pressing plate with pressing, make when each naked crystalline substance is placed in each corresponding accommodation space accordingly, by the pressing strength of this pressing plate of support frame as described above mean allocation, the back side that this weld pad takes place excessively to be spilled over to the packaging plastic of avoiding in described accommodation space.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, a kind of light emitter diode seal method is provided, its step includes: at first, one mould is provided, reaches a plurality of naked crystalline substances that are arranged on the weld pad (Pad), this mould has a base plate, a plurality of bracing frame that is arranged on this base plate, and support frame as described above is connected with each other to surround a plurality of accommodation spaces, and each accommodation space is corresponding to each naked crystalline substance; Then, by a pressing plate, on support frame as described above, each naked crystalline substance is placed in each corresponding accommodation space with this weld pad of pressing; At last, by the pressing strength of this pressing plate of support frame as described above mean allocation, the back side that this weld pad takes place excessively to be spilled over to the packaging plastic of avoiding being placed in the described accommodation space.
Description of drawings
Fig. 1 is a known bracing frame when not imposing rubberizing, and packaging plastic overflows to the schematic diagram of bracing frame and weld pad;
Pressure distribution schematic diagram when Fig. 2 is known weld pad pressurized;
Fig. 3 is the encapsulation schematic diagram of light-emitting diode of the present invention; And
Fig. 4 is a light emitter diode seal method flow chart of the present invention.
[primary clustering symbol description]
[known]
Naked brilliant 20a
Weld pad 30a
The packaging plastic 50a of overflow
[the present invention]
Naked brilliant 20
Embodiment
Reach technology, means and the effect that predetermined purpose is taked in order to make your juror can further understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, go deep into and concrete understanding when getting one thus, yet appended graphic only provide with reference to and explanation usefulness, be not to be used for to the present invention's limitr in addition.
See also shown in Figure 3ly, it is for the encapsulation schematic diagram of light-emitting diode of the present invention.By among the figure as can be known, the invention provides a kind of mould 10 that is used for encapsulation LED, this includes: base plate 11 and a plurality of bracing frame 12.
Wherein said bracing frame 12 is arranged on this base plate 11, be used to support naked brilliant 20 thereon the weld pads (Pad) 30 that are provided with a plurality of not encapsulation, support frame as described above 12 is connected to each other, to surround a plurality of corresponding ccontaining described naked accommodation spaces of brilliant 20 13 that are used for, this accommodation space 13 can form the accommodation space of field stalk shape.By this, when this weld pad 30 sees through a pressing plate 40 with pressing described naked brilliant 20 in described corresponding accommodation space 13 time, by the pressing strength of this pressing plate 40 of support frame as described above 12 mean allocation, excessively be spilled over to the back side of this weld pad 30 with packaging plastic (figure does not show) generation that must exempt to be placed in the described accommodation space 13.And then do not waste packaging plastic, must not use known rubberizing and need not remove the advantage of a large amount of glue that overflow.
See also shown in Figure 4ly, it is a light emitter diode seal method flow chart of the present invention.By in the flow chart as can be known, the invention provides a kind of light emitter diode seal method, its step includes: at first, one mould 10 is provided, and a plurality ofly is arranged at naked brilliant 20 on the weld pad (Pad) 30, wherein this mould 10 has a plurality of bracing frames 12, and the accommodation space 13 (S100) that surrounded by support frame as described above 12; Then, by a pressing plate 40, on this bracing frame 12, make described naked brilliant 20 to be placed in the described corresponding accommodation space 13 (S102) with this weld pad 30 of pressing.
In sum, the present invention is the pressing strength that a kind of utilization sees through this pressing plate 40 of support frame as described above 12 mean allocation, must exempt to be placed in the back side that this weld pad 30 takes place excessively to be spilled over to the packaging plastic in the described accommodation space 13.And then reach and do not waste packaging plastic, must not use known rubberizing and need not remove the advantage of a large amount of glue that overflow.
Therefore, the present invention is a rare novel invention product in fact, has novelty and progressive, meets the application for a patent for invention important document fully, files an application according to Patent Law in the whence, would like to ask detailed survey and grants accurate this case patent, to ensure inventor's rights and interests.
Only; the above; only be the detailed description of one the specific embodiment of the best of the present invention and graphic; only feature of the present invention is not limited thereto; be not in order to restriction the present invention; all scopes of the present invention should be as the criterion with following claim; all closing in the embodiment of the spirit variation similar of protection range of the present invention with it; all should be contained in the category of the present invention; anyly be familiar with this skill person in the field of the invention, can think easily and variation or modify the protection range that all can be encompassed in following this case.
Claims (4)
1. a mould that is used for encapsulation LED is characterized in that, includes:
Base plate; And
A plurality of bracing frames, it is arranged on this base plate, and support frame as described above is connected with each other, to surround a plurality of accommodation spaces, support frame as described above is used to support a weld pad, and this weld pad is provided with a plurality of not naked crystalline substances of encapsulation, each naked crystalline substance is placed in each accommodation space accordingly, holds packaging plastic in each accommodation space;
Wherein, when this weld pad sees through a pressing plate with pressing, make when each naked crystalline substance is placed in each corresponding accommodation space accordingly, by the pressing strength of this pressing plate of support frame as described above mean allocation, the back side that this weld pad takes place excessively to be spilled over to the packaging plastic of avoiding in described accommodation space.
2. the mould that is used for encapsulation LED as claimed in claim 1 is characterized in that, support frame as described above surrounds the accommodation space of field stalk shape.
3. light emitter diode seal method, its step includes:
One mould is provided, reaches a plurality of naked crystalline substances that are arranged on the weld pad, this mould has a base plate, a plurality of bracing frame that is arranged on this base plate, and support frame as described above is connected with each other to surround a plurality of accommodation spaces, and each accommodation space is corresponding to each naked crystalline substance;
By a pressing plate, on support frame as described above, each naked crystalline substance is placed in each corresponding accommodation space with this weld pad of pressing; And
By the pressing strength of this pressing plate of support frame as described above mean allocation, the back side that this weld pad takes place excessively to be spilled over to the packaging plastic of avoiding being placed in the described accommodation space.
4. light emitter diode seal method as claimed in claim 3 is characterized in that, support frame as described above surrounds the accommodation space of field stalk shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100088051A CN100394620C (en) | 2005-02-23 | 2005-02-23 | Mould and method for packing LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100088051A CN100394620C (en) | 2005-02-23 | 2005-02-23 | Mould and method for packing LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1825638A CN1825638A (en) | 2006-08-30 |
| CN100394620C true CN100394620C (en) | 2008-06-11 |
Family
ID=36936162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100088051A Expired - Fee Related CN100394620C (en) | 2005-02-23 | 2005-02-23 | Mould and method for packing LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100394620C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101315900B (en) * | 2007-06-01 | 2010-07-14 | 宏齐科技股份有限公司 | Packaging method for LED with high cooling efficiency and packaging structure thereof |
| CN101442088B (en) * | 2007-11-22 | 2012-03-28 | 广州市鸿利光电股份有限公司 | Method for shaping patch type LED optical lens model |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6858474B1 (en) * | 2003-12-01 | 2005-02-22 | Agilent Technologies, Inc. | Wire bond package and packaging method |
| CN2788361Y (en) * | 2005-02-23 | 2006-06-14 | 宏齐科技股份有限公司 | Mould for packaging LED |
-
2005
- 2005-02-23 CN CNB2005100088051A patent/CN100394620C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6858474B1 (en) * | 2003-12-01 | 2005-02-22 | Agilent Technologies, Inc. | Wire bond package and packaging method |
| CN2788361Y (en) * | 2005-02-23 | 2006-06-14 | 宏齐科技股份有限公司 | Mould for packaging LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1825638A (en) | 2006-08-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080611 Termination date: 20120223 |