CN100392782C - Key board and manufacturing method of its flexible circuit board - Google Patents
Key board and manufacturing method of its flexible circuit board Download PDFInfo
- Publication number
- CN100392782C CN100392782C CNB2003101180728A CN200310118072A CN100392782C CN 100392782 C CN100392782 C CN 100392782C CN B2003101180728 A CNB2003101180728 A CN B2003101180728A CN 200310118072 A CN200310118072 A CN 200310118072A CN 100392782 C CN100392782 C CN 100392782C
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- Prior art keywords
- circuit board
- keyboard
- chip
- board
- thickness
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Abstract
The present invention relates to a keyboard and a method for manufacturing the flexible circuit board of the keyboard. The keyboard comprises a plurality of keys, a base board and a circuit board, wherein the circuit board is arranged between the base board and the keys and is provided with a chip which is arranged on the circuit board. The thickness of the chip is reduced to specific thickness by a grinding mode, and the chip is arranged on the circuit board by a lead bonding mode.
Description
Technical field
The present invention relates to a kind of keyboard, particularly relate to a kind of keyboard with ultra-thin size.
Background technology
Along with the trend of compactization of electronic product, the size of keyboard is also more and more thinner gradually, with satisfy the user visually with the demand of carrying.When size reduced, the space that each assembly can occupy in the keyboard also was compressed relatively.Therefore, the size of each keyboard components will influence the integral thickness of keyboard.Have " separate type " in the mobile computer of keyboard, its keyboard itself has keyboard control chip and can separate and independently working on the mobile computer housing, and can do the data input by a PS/2, USB interface or wireless transmission interface and other computer.Because keyboard control chip has the Thickness Design that a thickness can have influence on keyboard itself, if the thickness attenuation of keyboard control chip then can effectively can be made the thickness attenuation of keyboard.
Summary of the invention
The present invention is in order to solve the problem of above-mentioned known technology, and a kind of keyboard that provides, this keyboard comprises: a plurality of buttons, a seat board and a circuit board.Circuit board is located between seat board and the button, and circuit board has a chip, is located on the circuit board.The mode that the chip utilization is ground is reduced to 0.2 millimeter with thickness, and utilizes the mode of lead-in wire bonding to be located on the circuit board.
The present invention also provides a kind of method for production of flexible print wiring board, comprises the steps: to provide a wafer, and this wafer has one first thickness; Grind this wafer, make the thickness of this wafer reduce to one second thickness, and this first thickness is greater than this second thickness; Cut this wafer and obtain at least one chip; This chip is located on the flexible print wiring board in the mode of lead-in wire bonding; And this chip surface coating sealing on this flexible print wiring board.
Keyboard of the present invention, its size is compact, can satisfy the user visually with the demand of carrying, effectively promote competitiveness of product.
Description of drawings
The 1st figure is the expression embodiments of the invention;
Fig. 2 a is that the mode of expression chip utilization lead-in wire bonding is located at the situation on the circuit board;
Fig. 2 b is the situation that expression is carried out sealing to the chip of being located on the circuit board.
The reference numeral explanation:
1～keyboard
11～seat board
12～film assembly
13～button
14～chip
15～glue
16～circuit board
Y～specific thicknesses
X, X '～connecting portion
Embodiment
Embodiments of the invention are keyboards as shown in Fig. 1, and this keyboard comprises a plurality of buttons 13, a seat board 11, a film assembly 12 and a circuit board 16.Film assembly 12 is located on the seat board 11.Circuit board 16 is located between seat board 11 and the button 13, and circuit board 16 has a chip 14.Chip 14 is to utilize the mode of grinding that thickness is reduced to a specific thicknesses Y, and is not corrupted to the circuit structure of chip, and utilizes the mode of lead-in wire bonding to be located on the circuit board 16.
In present embodiment, film assembly 12 is done electric property coupling with circuit board 16 by connecting portion X and X ', film assembly 12 has a plurality of switch modules (not icon), each switch module is corresponding button, when switch module senses pressing of button 13, can send a keying signal to chip 14, chip 14 is a keyboard controller (controller), in order to this keying signal is passed to an information processor by a host-host protocol, as computer.Because 0.8 millimeter before the thickness of chip 14 never grinds is reduced to 0.2 millimeter, and does not destroy the circuit structure of chip, therefore, has effectively saved the space between button 13 and the seat board 11, and then reduce the thickness of keyboard 1.
Before chip 14 cuts from wafer, earlier the full wafer wafer is ground, its thickness is milled to 0.2 millimeter (second thickness) from 0.8 millimeter (first thickness).Again chip 14 is cut down from wafer.Then, as shown in Fig. 2 a, utilize the mode (bounding) of lead-in wire bonding, chip 14 is located on the flexible print wiring board 16.At last, with reference to Fig. 2 b, the step of carrying out sealing with glue 15.Utilize above-mentioned fabrication steps, can make the component height after the sealing, be reduced to 0.7 millimeter from 1.3 millimeters.Therefore, can effectively reduce the thickness of keyboard.
Above-mentioned circuit board is flexible print wiring board (FPC).
Above-mentioned chip 14 can a button 13 located therein within, further to reduce the thickness of keyboard 1.
Keyboard of the present invention, its size is compact, can satisfy the user visually with the demand of carrying, effectively improve competitiveness of product.
Though the present invention discloses as above in preferred embodiment; right its is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; still can do some and change and retouching, thus protection scope of the present invention should with claims of application scope was defined is as the criterion.
Claims (4)
1. keyboard comprises:
One seat board;
Be arranged at a plurality of buttons on this seat board in the mode that can move up and down; And
One is located at the circuit board between this seat board and these buttons, and this circuit board has a chip, is located on this circuit board, and utilizes the mode of grinding that the thickness of chip is reduced to 0.2 millimeter.
2. keyboard as claimed in claim 1 is characterized in that: this chip is to utilize the mode of lead-in wire bonding to be located on this circuit board.
3. keyboard as claimed in claim 1 is characterized in that: this circuit board is a flexible print wiring board.
4. keyboard as claimed in claim 1 is characterized in that: in this chip button located therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101180728A CN100392782C (en) | 2003-11-20 | 2003-11-20 | Key board and manufacturing method of its flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101180728A CN100392782C (en) | 2003-11-20 | 2003-11-20 | Key board and manufacturing method of its flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1619735A CN1619735A (en) | 2005-05-25 |
| CN100392782C true CN100392782C (en) | 2008-06-04 |
Family
ID=34761056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101180728A Expired - Fee Related CN100392782C (en) | 2003-11-20 | 2003-11-20 | Key board and manufacturing method of its flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100392782C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI464767B (en) * | 2012-10-04 | 2014-12-11 | Wistron Corp | Keyboard and method for assembling the keyboard to portable electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412830A (en) * | 2001-10-19 | 2003-04-23 | 富士通株式会社 | Semiconductor substrate jig and method for manufacturing semiconductor device |
-
2003
- 2003-11-20 CN CNB2003101180728A patent/CN100392782C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412830A (en) * | 2001-10-19 | 2003-04-23 | 富士通株式会社 | Semiconductor substrate jig and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1619735A (en) | 2005-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080604 Termination date: 20111120 |