CN100388873C - Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods - Google Patents

Electromagnetic noise suppressor, article with electromagnetic noise suppression function, and their manufacturing methods Download PDF

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Publication number
CN100388873C
CN100388873C CNB2004800020175A CN200480002017A CN100388873C CN 100388873 C CN100388873 C CN 100388873C CN B2004800020175 A CNB2004800020175 A CN B2004800020175A CN 200480002017 A CN200480002017 A CN 200480002017A CN 100388873 C CN100388873 C CN 100388873C
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electromagnetic wave
wave noise
suppresses
magnet
adhesive
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CN1723748A (en
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川口利行
藤木弘直
谷口敦
权田贵司
田原和时
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Shin Etsu Polymer Co Ltd
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Abstract

An electromagnetic noise suppressor of the present invention includes a base material 2 containing a binding agent and a composite layer 3 formed by integrating the binding agent that is a part of the base material 2 and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer 3 on the surface of the base material 2 by physical vapor deposition of the magnetic material onto the surface of the base material 2. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.

Description

Electromagnetic wave noise suppresses body, the article with electromagnetic wave noise suppressing function and manufacture method thereof
Technical field
The present invention relates to a kind of electromagnetic wave noise and suppress body, article and manufacture method thereof with electromagnetic wave noise suppressing function.
Background technology
In recent years, along with popularizing that the internet utilizes, personal computer, information household appliances, radio LAN, bluetooth, optical module, mobile phone, carry information terminal, height road information system etc., have the quasi-microwave wave band that (CPU of 0.3～10GHz) high clock frequency or utilize the e-machine of high-frequency bus and utilize the information communication device of electric wave also to popularize has gradually welcome a networked society that the device that utilizes high-speed digitization and low voltage driveization needs ubiquitous (ubipuitous) of high performance.But,, the misoperation that the electromagnetic wave of these machine radiation brings, the problem of the Electromagnetic Interference such as influence of human body is also produced thereupon self or other e-machines along with popularizing of these machines.Therefore, in order self or other e-machines and human body not to be influenced, do not carry out misoperation even require these machines not radiate useless electromagnetic wave and be subjected to outside electromagnetic wave as far as possible yet.As the method that prevents this Electromagnetic Interference, comprise that utilizing electromagnetic shielding material is the electromagnetic shielding material of reflection electromagnetic wave or the method that absorbs electromagnetic electromagnetic wave absorbent material.
For preventing Electromagnetic Interference, taking following measure between e-machine: between the case surface of e-machine or e-machine, electromagnetic shielding material is set and comes shielding electromagnetic wave (inter-system EMC).In addition, in e-machine, cause misoperation for suppressing to influence each other between electronic device or circuit, or suppress the slow and signal waveform confusion of processing speed, so taked to come the measure (intra-system EMC) of overlay electronic device and circuit with electromagnetic shielding material.
In addition, following scheme has been proposed also recently: in the environment of the inner this environs of e-machine, the electronic device itself that the source takes place as electromagnetic wave noise is applied electromagnetic wave noise suppress body, with the generation of control electromagnetic wave noise; The perhaps interference between control signal is to improve transmission characteristic (miniature EMC).
Especially recently, e-machine, electronic device especially require high performance, miniaturization, lightweight, the electromagnetic wave noise that is used for these suppresses body too, and it is easy and be easy to carry out to require electromagnetic wave noise in this high frequency band of quasi-microwave wave band to suppress the operation of respond well, miniaturization and lightweight and countermeasure.
In the conductor screen that is all the time adopted, be increased by the electromagnetic coupled that reflection produced from the unwanted radiation source.Thus, the magnetic loss of magnet, promptly utilize imaginary part magnetic susceptibility μ " the rejection ratio of unwanted radiation more effective.And the thickness that discloses the flat powder of a kind of soft magnetic bodies in the Japanese kokai publication hei 9-93034 communique is thinner than skin depth, have sufficient length and width (aspect) adds the electromagnetic wave absorb that forms in the organic bond to than, about 95 quality % of magnet powder that magnet surface is formed non-conductorization.This electromagnetic wave absorb has electromaganic wave absorbing property efficiently, and has flexibility.In this embodiment, used the electromagnetic wave absorb with the copper coin reinforcement when estimating, the thickness of this electromagnetic wave absorb is embedded as 2mm to measure with copper coin.
But its thickness of this electromagnetic wave absorb is embedded as 2mm with copper coin, and the plate thickness of removing the electromagnetic wave absorb of copper coin itself is more than the 1mm, and 95 quality % of electromagnetic wave absorb itself are made of kicker magnets such as iron, thus heavier, the realization lightweight of being far from being.And, because the amount of organic bond is few, so robustness, flexibility are also insufficient.In addition, the non-conductorization on the flattening of soft magnetic bodies powder or surface is very bothersome, so the flat powder price of soft magnetic bodies is too high, but needs to use in a large number these, so the price of electromagnetic wave absorb is high too, can not satisfy the needs on the industry.
In addition, following electromagnetic wave absorb is disclosed in the Japanese kokai publication hei 9-93034 communique: ferromagnetism element and ceramic element are sprayed on magnetron make film on the substrate, with process annealing, in high-resistance ceramic phase, separate out the ultramicro-crystal that constitutes by kicker magnet thus then, thereby form insulation.This electromagnetic wave absorb resistance in the high-frequency frequency range of 100MHz～10GHz is very big, and controlled by the electromagnetic reflection that eddy current causes, the imaginary part magnetic susceptibility is big, so have good electromaganic wave absorbing property.
In this electromagnetic wave absorb, in ceramic phase, generate the ferromagnetism ultramicro-crystal, need carry out high-temperature heat treatment.In this embodiment, on sliding glass, spray the legal system film by the film that pottery and ferromagnetism element constitute, under 200～350 ℃, heat-treat, form the ferromagnetism ultramicro-crystal with the RF magnetron.In this electromagnetic wave absorb, consider and on organic film, make ceramic phase and ferromagnetism ultramicro-crystal phase, still, have to use high heat-resisting organic film as organic film.High heat-resisting organic film costs an arm and a leg, thereby uses this electromagnetic wave absorb price also higher.In addition, even form this ferromagnetism ultramicro-crystal phase on the heat-resisting organic film of height, because the coefficient of thermal expansion between the pottery of organic film and generation differs bigger, be easy to generate crackle, flexibility, robustness are not high.
In addition, also disclose a kind of electromagnetic wave noise of ferrite electroplating technology that utilizes and suppressed body, suppress body as electromagnetic wave noise, in the quasi-microwave wave band, slim inhibition body is respond well, and (Ah portion is just recording etc., " the 131st research association's data ", Japanese applied magnetics meeting, on July 4th, 2003, P25～31).
This utilize the electromagnetic wave noise of ferrite electroplating technology suppress body be with iron, nickel and inferior plumbous muriatic reactant liquor, with constitute oxidation liquid by sodium nitrate and acetate ammonia and on the polyimide plate that is equipped on the rotary plate, electroplate with the rotary spraying method, thereby form the thick ferrite compounds of 3 μ m.This electromagnetic wave noise suppresses body to be compared with the template electromagnetic wave noise inhibition body that the 50 μ m of metallic plate microparticulate in organic bond are thick of prior art, although thin thickness demonstrates identical absorption characteristic, helps being applied in the miniature electric machine.
But the kicker magnet thickness that this electromagnetic wave noise suppresses body is 3～11um, also is about 0.2 even this electromagnetic wave noise suppresses the interior power loss value of 1GHz of body on thicker, and the electromagnetic wave noise control effect of the low frequency part of quasi-microwave wave band is also bad.In addition, when the thickness of kicker magnet was big, the ferrite that forms on polyimide plate was hard, does not contain organic bond, so robustness, flexibility are far from being fully.In addition, because use wet processes, thus need to clean and dry impurity, cumbersome, so can't satisfy needs on the industry.
In addition, the electromagnetic wave noise that is made of the ultramicro-crystal magnetic film that also discloses a kind of ferromagnetism ultramicro-crystal phase that contains aluminium ceramic phase, iron or cobalt suppresses body, and (big natural pond is numerous great etc., " the 131st research association's data ", Japanese applied magnetics meeting, on July 4th, 2003, P17～24).This scheme relates to a kind ofly makes film with ferromagnetism element and ceramic element with high-frequency magnetron spraying process on substrate, annealing at low temperatures, thereby in high-resistance ceramic phase, separate out the ultramicro-crystal that constitutes by kicker magnet, also form slit to improve film resistance, and the electromagnetic wave that the 1um that is split to form is thick suppresses body, has good noise control effect.
But, this electromagnetic wave inhibition body demonstrates the same absorption characteristic of template electromagnetic wave noise inhibition body that the 50um of metallic plate microparticulate in organic bond is thick with prior art, power loss value among the 1GHz is about 0.2, is far from being to have electromagnetic wave noise inhibition effect in effective frequency band.In addition, for generation ferromagnetism ultramicro-crystal in the ceramic phase, thus need heat treatment, and the resistance of magnetic thin film is big, thus must form slit with photoetching process or Mo Kefa, very bothersome.And because be thin-film ceramics, so be easy to generate crackle, flexibility and robustness are not high.
In addition, electric, e-machine special requirement anti-flammability (be equivalent to UL94 V-0, V-1 or be equivalent to VTM-0, VTM-1) aspect fail safe, the electromagnetic wave noise that is used for these suppresses body and requires anti-flammability (be equivalent to UL94 V-0, V-1 or be equivalent to VTM-0, VTM-1) too.At this, so-called UL is that U.S. Underweiters LaboratoriesInc company formulates, the relevant fail safe specification of electrical equipment of approval, the little anti-flammability specification of UL94.The anti-flammability that below only will be equivalent to U94V-0, V-1, VTM-0, VTM-1 is designated as " anti-flammability ".
As the electromagnetic wave absorb with anti-flammability, the coating that Japanese kokai publication hei 2000-196281 communique has proposed to contain polymer binder, soft magnetic bodies powder and phosphorus flame retardant is applied to the scheme that forms electromagnetic wave absorbing layer on the supporting mass.
But, when using the soft magnetic bodies powder,, need to use in a large number in order to have given play to sufficient electromagnetic wave absorbability as electromagnetic wave absorbent material, specifically, this amount is 100 mass parts with respect to the polymer binder of 5～12 mass parts.And, when using the soft magnetic bodies powder,, must form electromagnetic wave absorbing layer than heavy back in order to have given play to sufficient electromagnetic wave absorbability as electromagnetic wave absorbent material.Therefore, electromagnetic wave absorbing layer is thicker and proportion is high, so exist electromagnetic wave absorb to become heavy problem.In addition, for electromagnetic wave absorbing layer is set on the supporting mass, also exist the electromagnetic wave absorb thickening to cause being difficult to realize the problem of miniaturization.In addition, because soft magnetic powder is a metal dust, so the heat of being easy to generate, catch fire.Therefore, for electromagnetic wave absorb is brought into play sufficient anti-flammability, also existing must a large amount of problem of adding fire retardant.In addition, because the soft magnetic bodies powder is most of, polymer binder only has on a small quantity, so, there is the problem that loses flexibility, becomes fragile.
In addition, as the electromagnetic wave absorb with anti-flammability, Japanese kokai publication hei 2002-84091 communique discloses and a kind ofly ferrite powder or soft magnetic metal powder has been mixed into the electromagnetic wave absorb in the resin and will has the electromagnetic wave absorb plate that the fire proofing lamination of anti-flammability forms.
But, when using ferrite powder or soft magnetic metal powder,, must use in a large number in order to have given play to sufficient electromagnetic wave absorbability as electromagnetic wave absorbent material, this amount is generally about 90 quality % of electromagnetic wave absorb.And, when using ferrite powder or soft magnetic metal powder,, must form electromagnetic wave absorb thickly in order to have given play to sufficient electromagnetic wave absorbability as electromagnetic wave absorbent material.Therefore, electromagnetic wave absorb is too thick and the proportion change is big, deposits the problem that becomes heavy to exist.In addition, because electromagnetic wave absorb is thick, so also there is the problem that is difficult to realize miniaturization.In addition, ferrite powder or soft magnetic metal powder are easy to generate heat, catch fire, so during only bonding fire proofing with anti-flammability, also can not bring into play sufficient anti-flammability sometimes.In addition, ferrite powder or soft magnetic metal powder are most of, resin only little by little, so, the problem that exists flexibility to lose, become fragile.
In addition, as the electromagnetic interference suppressor that suppresses electromagnetic interference, Japanese kokai publication hei 7-212097 communique discloses a kind of electromagnetic interference suppressor, the insulating properties soft magnetic bodies layer of one side at least that it comprises the conductivity supporting mass and is located at this conductivity supporting mass, this insulating properties soft magnetic bodies layer comprises soft magnetic bodies powder and organic bond.
But in this electromagnetic interference suppressor, the thickness of electromagnetic interference suppressor itself is big, and contains a large amount of magnets on the gamut of insulating properties magnet layer, and institute's ether is heavy, the realization lightweight of being far from being.In addition, because the amount of organic bond is few,, also can not satisfy aspect the High Density Packagingization realizing so robustness, flexibility also are far from being fully.
Summary of the invention
The object of the present invention is to provide: the electromagnetic wave noise in the quasi-microwave wave band suppresses effect electromagnetic wave noise good, that save space and lightweight and suppresses body; Article such as the electronic installation (device) of inhibition electromagnetic wave noise, printed circuit board (PCB); And the manufacture method that can make the said goods simply.
In addition, another purpose of the present invention is to provide a kind of and has flexibility, electromagnetic wave noise that intensity is high suppresses body.
In addition, another purpose of the present invention is to provide a kind of electromagnetic wave noise with sufficient anti-flammability to suppress body.
In addition, another purpose of the present invention is to provide a kind of electromagnetic wave noise that has both the electromagnetic wave shielding performance to suppress body.
Suppress body according to electromagnetic wave noise of the present invention, it is characterized in that comprising: contain the matrix of adhesive and the part adhesive and the integrally formed composite bed of magnet of described matrix.It is good that this electromagnetic wave noise suppresses the electromagnetic wave noise inhibition effect of body in the quasi-microwave wave band, saves space and light weight.
At this, described composite bed preferably with the magnet physical vapor deposition to described matrix surface and the layer that forms.The magnet of this composite bed disperses at adhesive, and adhesive and magnet are integrated, suppresses the high composite bed of effect thereby constituted electromagnetic wave noise.And, there is not foreign ion, so taking place, foreign ion damages electronic circuit.
That electromagnetic wave noise of the present invention suppresses the max transmissive attenuation of composite bed average thickness of body is preferred-0.5～-500dB/ μ m.Suppress in the composite bed of body at this electromagnetic wave noise, magnet is dispersed in the adhesive, and adhesive and magnet are integrated, so that electromagnetic wave noise suppresses effect is better.
And that electromagnetic wave noise of the present invention suppresses the max transmissive attenuation of body is preferred-10～-50dB.The electromagnetic wave noise inhibition effect that this electromagnetic wave noise suppresses body is better.
In addition, that electromagnetic wave noise of the present invention suppresses maximum reflection attenuation in the frequency of expression electromagnetic wave max transmissive attenuation of body is preferred-6～-50dB.The electromagnetic wave noise inhibition effect that this electromagnetic wave noise suppresses body is better.
Electromagnetic wave noise of the present invention suppresses the interior power loss value preferred 0.3～0.65 of 1GHz of body.The electromagnetic wave noise inhibition effect that this electromagnetic wave noise suppresses body is better.
The thickness of described composite bed is 0.005～20 μ m, preferred 0.005～3 μ m, more preferably 0.005～1 μ m, most preferably 0.005～0.3 μ m.The electromagnetic wave noise inhibition effect that this electromagnetic wave noise suppresses body is better, and can realize miniaturization, lightweight.
Electromagnetic wave noise of the present invention suppresses the proportion preferred 0.9～1.5 of body.Suppress body for this electromagnetic wave noise, its composite bed is extremely thin, and in composite bed, magnet is scattered in the adhesive, and adhesive is integrated with magnet, so electromagnetic wave noise inhibition effect is better.
Electromagnetic wave noise of the present invention suppresses body also can have a plurality of electromagnetic wave noises to suppress body by lamination.The magnet total amount that this electromagnetic wave noise suppresses body has increased, thereby electromagnetic wave noise inhibition effect is better.
Described adhesive preferred resin or rubber.By with resin or rubber as adhesive, the electromagnetic wave noise that can obtain having flexibility, intensity is high suppresses body.
Perhaps, the preferred hardening resin of described adhesive.If adhesive is a hardening resin, magnet just can be scattered in the unhardened adhesive more equably, and after the adhesive sclerosis, magnet can not grown up in the crystallization particulate, thereby can form adhesive and magnet with the incorporate composite bed of state of atom.
The shear modulus of described adhesive preferred 1 * 10 4～1 * 10 10Pa, more preferably 1 * 10 4～5 * 10 7Pa.Be located in this scope by shear modulus, can obtain that magnet is scattered in the adhesive, adhesive and magnet is integrated, electromagnetic wave noise suppresses the high composite bed of effect adhesive.
Electromagnetic wave noise of the present invention suppresses body and preferably also comprises the heat conduction layer that contains the heat conductivity filler.This electromagnetic wave noise suppresses the fine heat radiation property of body.
Electromagnetic wave noise of the present invention suppresses body and preferably also comprises supporting course.Even this electromagnetic wave noise suppresses the matrix skiving that body will form composite bed, flexibility is also good, and intensity is also higher, and easy operating.
Described matrix preferably contains non-halogen system and is the fire retardant of non-antimony system (below be designated as the non-Sb system fire retardant of non-halogen).Electromagnetic wave noise with this matrix suppresses body and has sufficient anti-flammability.
Perhaps, electromagnetic wave noise inhibition body of the present invention preferably also has the flame retardant resin layer.This electromagnetic wave noise suppresses body and has sufficient anti-flammability.
In addition, described matrix preferably contains electroconductive stuffing.Electromagnetic wave noise with this matrix suppresses body and has both the electromagnetic wave shielding function, and the electromagnetic coupled that is caused by electromagnetic reflection can not increased.
At this, described electroconductive stuffing preferably is selected from least a conductive powders in metal dust, metallic fiber, metallic cover particulate, carbon particulate and the carbon sodium rice fibre pipe.The electromagnetic wave shielding performance of matrix that contains this conductive powders is better.
Perhaps, electromagnetic wave noise inhibition body of the present invention preferably also has conductive layer.This electromagnetic wave noise suppresses body and has the electromagnetic wave shielding performance simultaneously, thereby can not increased by the electromagnetic coupled that electromagnetic reflection causes.
At this, at least a in described conductive layer preferable alloy paper tinsel, metal fiber cloth, conductive fibre fabric, metal wire entangled object, conductive fiber entangled object, the organic polymer layer that is dispersed with electroconductive stuffing and the conductive film.The electromagnetic wave shielding performance that electromagnetic wave noise with this conductive layer suppresses body is better.
In addition, described conductive film is that the metal level of 5～500nm constitutes by tread support membrane and the physical vapor deposition metal forms on this tread support membrane thickness preferably.The flexibility that electromagnetic wave noise with this conductive film suppresses body is good, and can realize miniaturization, lightweight.
In addition, described metal level is preferably formed by subtend target magnetic control sputtering method.Subtend target magnetic control sputtering method is highly beneficial aspect environmental protection and productivity.
In addition, described matrix preferably contains dielectric medium powder.Suppress body for electromagnetic wave noise, can realize and the impedance matching in space, therefore, be difficult to cause the reflection of electromagnetic unwanted radiation with this matrix.
At this, at least a in the preferred barium titanate ceramics of described dielectric medium powder, zirconium titanate system ceramics, the plumbous perovskite series ceramic.The matrix effect in the reflection that suppresses unwanted radiation that contains this dielectric medium powder is better.
The manufacture method that electromagnetic wave noise of the present invention suppresses body is characterised in that and comprises the evaporation step, in this step, with the magnet physical vapor deposition to the matrix surface that contains adhesive, thereby on matrix surface, form composite bed.According to this manufacture method, can make composite bed, electromagnetic wave inhibition body of the present invention at an easy rate with integrally formed adhesive and magnet.
Suppress in the manufacture method of body at electromagnetic wave noise of the present invention, preferably utilize subtend target magnetic control sputtering method with the magnet physical vapor deposition to the matrix surface that contains adhesive.According to this manufacture method, by magnet is scattered in the adhesive, and adhesive and magnet are integrated, suppress the better electromagnetic wave noise of effect and suppress body thereby can make electromagnetic wave noise at an easy rate.
In addition, suppress in the manufacture method of body at electromagnetic wave noise of the present invention, preferably particle can under 5～1000eV with the magnet physical vapor deposition to the matrix surface that contains adhesive.According to this manufacture method, by magnet is scattered in the adhesive, and adhesive and magnet are integrated, suppress the better electromagnetic wave noise of effect and suppress body thereby can make electromagnetic wave noise at an easy rate.
In addition, suppress in the manufacture method of body at electromagnetic wave noise of the present invention, the evaporating quality of magnet is represented preferred 0.5～200nm with the thickness scaled value of magnet Dan Pin.According to this manufacture method, by magnet is scattered in the adhesive, and adhesive and magnet are integrated, suppress the better electromagnetic wave noise of effect and suppress body thereby can make electromagnetic wave noise at an easy rate.
Suppress the manufacture method of body according to another electromagnetic wave noise according to the present invention, it is characterized in that comprising: the layered product manufacturing step, containing on the matrix of adhesive other layers of lamination to make layered product; And the evaporation step, on matrix surface, carry out physical vapor deposition, to form composite bed at matrix surface.According to this manufacture method, can make at an easy rate have adhesive and the incorporate composite bed of magnet and other layers, electromagnetic wave of the present invention suppresses body.
According to the article with electromagnetic wave noise suppressing function of the present invention, it is characterized by: the suppressing body to small part by electromagnetic wave noise of the present invention and coated of article surface.Near this small-sized electromagnetic wave noise of article configuration noise-producing source with electromagnetic wave noise suppressing function suppresses body, thereby can suppress the electromagnetic wave noise of quasi-microwave wave band effectively.
According to the manufacture method with article of electromagnetic wave noise suppressing function of the present invention, comprising: with the coating step to small part on adhesive coated article surface; And with the magnet physical vapor deposition to adhesive, to form the evaporation step of composite bed at adhesive surface.According to this manufacture method, can make article electromagnetic wave noise, that have electromagnetic wave noise suppressing function that can effectively suppress the quasi-microwave wave band at an easy rate.
Description of drawings
Fig. 1 is the high de-agglomeration transmissive type electron microscope image that electromagnetic wave noise of the present invention suppresses the composite bed in the body;
Fig. 2 is a near ideograph the composite bed;
Fig. 3 is the SEM image of the matrix profile status behind the magnet physical vapor deposition;
Fig. 4 is the laser microscope image (vertical view is Yi Bian be 73.5um) of the substrate surface state behind the magnet physical vapor deposition;
Fig. 5 is the laser microscope image of the matrix section shape behind the measurement magnet physical vapor deposition;
Fig. 6 is the laser microscope image (vertical view is Yi Bian be 73.5um) of the substrate surface state before the magnet physical vapor deposition;
Fig. 7 is a laser microscope image of measuring the preceding matrix cross sectional shape of magnet physical vapor deposition;
Fig. 8 illustrates the schematic cross-section that electromagnetic wave noise of the present invention suppresses an example of body;
Fig. 9 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 10 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 11 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 12 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 13 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 14 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 15 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 16 illustrates other routine schematic cross-sections that electromagnetic wave noise of the present invention suppresses body;
Figure 17 is the stereogram that illustrates as the camera module of an example of the article with electromagnetic wave noise suppressing function of the present invention;
Figure 18 is the sectional view that illustrates as the camera module of an example of the article with electromagnetic wave noise suppressing function of the present invention;
Figure 19 illustrates the sectional view that is equipped with as the printed circuit board (PCB) of the electronic installation of an example of the article with electromagnetic wave noise suppressing function of the present invention;
Figure 20 is the schematic diagram that the determinator of electromagnetic wave noise suppression characteristic is shown;
Figure 21 illustrates the incident electromagnetic wave amount as the transmission attenuation of the electromagnetic wave noise inhibition body of frequency range 0.05～3GHz of the embodiment 5 of benchmark (0) and the curve chart of reflection loss amount;
Figure 22 illustrates the incident electromagnetic wave amount as the transmission attenuation of the electromagnetic wave noise inhibition body of frequency range 0.05～18GHz of the embodiment 6 of benchmark (0) and the curve chart of reflection loss amount;
Figure 23 illustrates the incident electromagnetic wave amount as the transmission attenuation of the electromagnetic wave noise inhibition body of frequency range 0.05～18GHz of the embodiment 7 of benchmark (0) and the curve chart of reflection loss amount;
Figure 24 illustrates the incident electromagnetic wave amount as the transmission attenuation of the electromagnetic wave noise inhibition body of the frequency range 0.05～3GHz of the comparative example 2 of benchmark (0) and the curve chart of reflection loss amount;
Figure 25 illustrates the incident electromagnetic wave amount as the transmission attenuation of the electromagnetic wave noise inhibition body of the frequency range 0.05～18GHz of the comparative example 3 of benchmark (0) and the curve chart of reflection loss amount;
Figure 26 illustrates the incident electromagnetic wave amount as the transmission attenuation of the electromagnetic wave noise inhibition body of the frequency range 0.05～3GHz of the comparative example 4 of benchmark (0) and the curve chart of reflection loss amount;
Figure 27 is the curve chart that electromagnetic wave noise that frequency range 0.05～3GHz of embodiment 8 is shown suppresses the power consumption characteristic of body;
Figure 28 is the curve chart that electromagnetic wave noise that frequency range 0.05～3GHz of embodiment 9 is shown suppresses the power consumption characteristic of body;
Figure 29 is the curve chart that electromagnetic wave noise that frequency range 0.05～3GHz of embodiment 10 is shown suppresses the power consumption characteristic of body;
Figure 30 is the curve chart that electromagnetic wave noise that the frequency range 0.05～3GHz of comparative example 5 is shown suppresses the power consumption characteristic of body;
Figure 31 is the curve chart that electromagnetic wave noise that the frequency range 0.05～3GHz of comparative example 6 is shown suppresses the power consumption characteristic of body;
Figure 32 is the curve chart that electromagnetic wave noise that the frequency range 0.05～3GHz of comparative example 7 is shown suppresses the power consumption characteristic of body;
Figure 33 is the curve chart of frequency characteristic of the reflection loss amount of electromagnetic wave noise that embodiment 17 the is shown conducted noise that suppresses body;
Figure 34 is the curve chart of frequency characteristic of the power consumption value of electromagnetic wave noise that embodiment 17 the is shown conducted noise that suppresses body;
Figure 35 is the curve chart of frequency characteristic of the reflection loss amount of electromagnetic wave noise that embodiment 18 the is shown conducted noise that suppresses body;
Figure 36 is the curve chart of frequency characteristic of the power consumption value of electromagnetic wave noise that embodiment 18 the is shown conducted noise that suppresses body;
Figure 37 is the curve chart of frequency characteristic of the reflection loss amount of electromagnetic wave noise that embodiment 19 the is shown conducted noise that suppresses body;
Figure 38 is the curve chart of frequency characteristic of the power consumption value of electromagnetic wave noise that embodiment 19 the is shown conducted noise that suppresses body;
Figure 39 is the curve chart of frequency characteristic of the reflection loss amount of electromagnetic wave noise that embodiment 20 the is shown conducted noise that suppresses body;
Figure 40 is the curve chart of frequency characteristic of the power consumption value of electromagnetic wave noise that embodiment 20 the is shown conducted noise that suppresses body;
Figure 41 is the curve chart of frequency characteristic of reflection loss amount that the conducted noise of comparative example 11 is shown;
Figure 42 is the curve chart of frequency characteristic of power consumption value that the conducted noise of comparative example 11 is shown;
Figure 43 illustrates the curve of level that the electromagnetic wave noise of embodiment 17,18,19,20 and comparative example 11,12 is suppressed the inside decoupling rate of the radiation noise that body and function slightly-inclined rate method measures;
Figure 44 illustrates the curve chart of level that the electromagnetic wave noise of embodiment 17,18,19,20 and comparative example 11,12 is suppressed the mutual decoupling rate of the radiation noise that body and function slightly-inclined rate method measures.
Embodiment
Below the present invention is described in detail.
Electromagnetic wave noise of the present invention suppresses that body comprises a part of adhesive of the matrix that contains adhesive and described matrix and magnet integration and the composite bed that forms.
Fig. 1 is the photo of taking with the high-resolution transmission electron microscope, and Fig. 2 is the schematic diagram of electron micrograph.More specifically, as depicted in figs. 1 and 2, electromagnetic wave noise suppresses body 1 and is formed by matrix 2 that contains adhesive and composite bed 3, and this composite bed 3 becomes the state that magnet is the atom shape and mixes mutually with the molecule of a part of adhesive of matrix 2.
＜composite bed 〉
Composite bed 3 is the layers that for example the magnet physical vapor deposition formed to the surface of matrix 2, by physical vapor deposition magnet do not form homogeneous membrane, with state of atom be dispersed in the adhesive and with its integration.
As shown in Figure 2, composite bed 3 is to be made of following three parts: can observe as very little crystallization and arrange number
Figure C20048000201700221
The part of the crystal lattice 4 of magnet atom at interval can be observed and not exist magnet to have only the part of adhesive 6 in very little scope and can observe not crystallization but be dispersed in part in the adhesive of magnet atom 5.That is, do not observe the expression magnet, can think that this composite bed has magnet and the adhesive heterostructure (structure that heterogeneous body is uneven) with the formed complexity of nanoscale integration as the crystal boundary that the particulate with crystalline texture clearly exists.
The thickness of composite bed 3 is exactly the degree of depth that the magnet atom immerses matrix 2 top layers, and it depends on the evaporating quality of magnet, the material of adhesive and the condition of physical vapor deposition etc., approximately is 1.5～3 times of evaporation thickness of magnet.Here, the evaporation thickness of magnet is meant the thickness of physical vapor deposition magnet atomic time on the hard matrix that the magnet atom does not immerse.
In addition, transmission electron microscope picture that the thickness of composite bed 3 can be by the cross section or scanning electron microscopy (SEM) be as calculating, Fig. 3 the has illustrated physical vapor deposition SEM picture of cross section state of matrix of magnet.This SEM similarly is an image of the cross section of foundation being observed acquisition, and this foundation does not comprise protrusion of surface shape described later portion.By on the elastomer of the inorganic fillers such as wet silicon dioxide that comprise about 45 quality %, evaporation conversion thickness is the 30nm magnet, thereby forms the composite bed that thickness is 40nm (0.04 μ m) (the white horizontal lines of central authorities) on the top layer.
Become more than the 0.005 μ m by the thickness that makes composite bed 3, the magnet atom is dispersed in the adhesive and with its integration, can have the big loss characteristic in coming from the high-frequency zone of shape anisotropy, thereby can make it give full play to the electromagnetic wave noise inhibitory action.On the other hand, if the thickness of composite bed has surpassed 20 μ m, thereby will form the magnet film that crystalline texture clearly forms homogeneous so, revert to block magnet, reduced shape anisotropy, electromagnetic wave noise suppresses effect and also reduces, and actual effect is not fine.Therefore, the thickness of composite bed 3 is preferably below the 3 μ m, more preferably below the 1 μ m, most preferably is below the 0.3 μ m.
If evaporation magnet in order to form homogeneous membrane, so, because the intrinsic resistance of magnet is little, so meeting eddy generation, the electromagnetic wave noise of magnet suppress effect and disappear, but also have produced reflection function, therefore, the electromagnetic wave noise that electronic circuit or electronic installation are sent not only can't suppress, and also can reflect back, and can exert an influence to electronic circuit etc. on the contrary.Therefore, on matrix 2, during the physical vapor deposition magnet, had better not form the magnet film of homogeneous.The sheet resistance (D.C. resistance) of preferred composite bed 3 is about 1 * 10 1～1 * 10 10Ω.
＜matrix 〉
(adhesive)
Adhesive as the principal component of matrix 2 is not limited especially, for example, polyolefin-based resins, the polyphenylamine series resin, polyester based resin, polyethers is a resin, polyketone is a resin, poly-imido is a resin, poly-imines fat is resin, the polysiloxane series resin, phenol is resin, epoxy is a resin, propylene base system resin, polyacrylate is resins such as resin, perhaps natural rubber, isoprene rubber, butadiene rubber, benzene is diene series rubber such as alkene butadiene rubber, and butyl rubber, ethylene-propylene rubber, polyurethane rubber, organic substances such as non-diene series rubber such as silicone rubber can be as adhesive.These can be thermoplastics, also can be the thermosetting materials, can also be the non-hardening things of these materials.In addition, can also be sex change thing, mixture, the copolymer of above-mentioned resin, rubber.
In addition, adhesive can be the inorganic matter with low shear modulus described later, if space part is big, aeroge with the hardness that can catch ultramicron, porous silica etc., just can be used as adhesive.In addition, can also be and above-mentioned organic synthetic.
Wherein, consider that the magnet atom will be easy to enter the problem of adhesive, when physical vapor deposition magnet described later, preferably adopt the low adhesive of shear modulus as adhesive, specifically, preferably using shear modulus is 1 * 10 4～1 * 10 10The adhesive of Pa, more preferably using shear modulus is 1 * 10 4～5 * 10 7The adhesive of Pa.In order to make its shear modulus that reaches expectation, can for example adhesive can be heated to 100～300 ℃ as required, but must being unlikely to cause, heating-up temperature decomposes or evaporation.When carrying out physical vapor deposition at normal temperatures, adhesive preferably adopts rubber hardness to be about 80 ° (JIS-A) following elastomer.
If the shear modulus of adhesive is lower, when matrix 2 was carried out the physical vapor deposition of magnet, because the magnet atom invades in the matrix 2, perhaps the collision by the magnet atom had produced the distortion of adhesive or has flowed, so the magnet atom disperses on the matrix top layer easily.
Fig. 4 is evaporation the has been shown laser microscope image of substrate surface state of magnet, can see have on the surface concavo-convex.Among Fig. 5 its cross sectional shape is measured, the height of its projection is 6 μ m.On the other hand, Fig. 6 is the laser microscope image that the preceding substrate surface state of evaporation is shown, and the surface before the evaporation is smooth.Among Fig. 7 its cross sectional shape is measured, the average boldness on surface is 0.05 μ m.From Fig. 4～Fig. 7, can understand by evaporation and cause the situation that matrix deforms or flow.
In addition, from keeping the angle of above-mentioned inhomogeneous structure, after the magnet physical vapor deposition, preferably adopt the high adhesive of shear modulus as adhesive.By after the magnet physical vapor deposition, improving the shear modulus of adhesive, thereby can prevent effectively that nano level magnet atom or atom group agglutination and crystallization from forming particulate.Specifically, can use electromagnetic wave noise to suppress in the temperature range of body, preferably adopting shear modulus is 1 * 10 7The adhesive that Pa is above.For reaching the shear modulus of expectation, preferably behind the magnet physical vapor deposition that adhesive is crosslinked.
For this point,, after evaporation, can therefore, preferably adopt thermosetting resin, energy line (ultraviolet ray, electronics line) hardening resin by its modulus of crosslinked raising as adhesive owing to when evaporation, be low modulus.
In addition, can adopt the gas transmission as the index of representing the intermolecular gap length that the magnet atom is easy to enter.Originally, preferably by confirming the intermolecular space of adhesive with the big or small identical argon gas of magnet atom, the transmission of cryptone gas, but, because these gases generally are not used in the mensuration of gas transmission, so can replace with the transmission data of for example carbonic acid gas.As the bigger resin of carbonic acid gas transmission under the normal temperature, it is 1 * 10 that the carbonic acid gas transmission is for example arranged -9[cm 3(STP) cm/ (cm 2* s * cmHg)] rubber constituent and other mixture of ingredients or copolymers such as above polyphenylene oxide, poly-first amylene, nylon 11, HTPS, the carbonic acid gas transmission is 1 * 10 -8[cm 3(STP) cm/ (cm 2* s * cmHg)] above polybutadiene, polyisoprene, butadiene-styrene rubber, silicon rubber etc.Wherein, consider, especially rubber-like material such as preferred silicon (oxygen) rubber from the angle of shear modulus.
In addition, consider that from the angle that prevents the oxidation of magnet atom as the low resin of adhesive preferred oxygen transmission, for example, the oxygen transmission is 1 * 10 -10[cm 3(STP) cm/ (cm 2* s * cmHg)] following polyethylene, poly-trifluorochloroethylene, poly-first methacrylate etc., perhaps the oxygen transmission is 1 * 10 -12[cm 3(STP) cm/ (cm 2* s * cmHg)] following polyethylene terephthalate, polyacrylonitrile etc. can be as adhesives.
And, for a part that makes plasma or Ionized magnet atom and adhesive reacts, realize stabilisation, can be in adhesive mixed silanes couplant, titanate coupling agent, nonionic surface active agent, polar resin oligomer.By mixing such additive, except preventing oxidation, can also prevent to form homogeneous membrane, and can prevent from the electromagnetic reflection that causes by homogeneous membrane to improve absorption characteristic owing to the aggegation of atom.
In addition, can carry out the concavo-convex additional processing of physics on matrix 2 surfaces.Its average surface rugosity Ra preferably is about 0.5～10 μ m.Processing method to this concavo-convex additional processing does not limit especially, still, for example can have by sandblast, etching etc., perhaps duplicating of matsurface and form concavo-convex method.
And, because there is the space foams inside, be suitable for as matrix.As foams, preferably form continuous bubble by trickle unit (cell), the surface does not have the foams on top layer.The preferred cell diameter is about below the 100 μ m, preferably the following foams of 50 μ m.And void content is preferably 5～50%.
(the non-Sb system fire retardant of non-halogen)
Have anti-flammability in order to make electromagnetic wave noise of the present invention suppress body, can make and contain the non-Sb system fire retardant of non-halogen in the matrix 2.
Fire retardant must be the material that does not contain halogen element and antimony element.There is the problem that is regarded as environmental pollutants in the compound that contains halogen element and antimony element, and in recent years, the halogen/antimony product that can take into account environment must be indispensable.
In addition, though be non-halogen material, be not to contain halogen element anything but yet.This is because there is chlorine in natural environment, and, in the building-up process of material, use the halogen based compound, for example used epichlorohydrine in the epoxy resin, so, also have residual as the halogen element of impurity even material purified, residual to be controlled to be zero be unusual difficulty with these.Therefore, in the present invention, chlorinity, the bromine content that the halogen copper of JPCA standard is opened laminated sheet experimental technique (JPCA-ES-01) regulation all is that the material below 0.09% is defined as " not containing halogen element " (halogen).
Can use material of the prior art as the non-Sb system fire retardant of non-halogen, material liquid and solid, shaped can.According to the non-Sb system fire retardant of non-halogen being carried out suitable selection as the kind of the resin of adhesive, rubber etc.The non-Sb system fire retardants of non-halogen such as phosphorus flame retardant, nitrogen flame retardant, metal hydroxides, metal oxide, silicone-based fire retardant, platinum compounds are for example arranged.
As phosphorus flame retardant, triphenyl phosphate, tricresyl phosphate, tripotassium phosphate phenol, tricresyl phosphate ethyl, tricresyl phosphate base phenyl, tripotassium phosphate phenol diphenyl, tricresyl phosphate base (2 2, the 6-cresols), phosphoric acid 2-ethylhexyl diphenyl, di(2-ethylhexyl)phosphate methyl, red phosphorus, yellow phosphorus etc. are for example arranged.
As the nitrogen flame retardant, guanidine flame retardants such as Guanidine Sulfamate 99, phosphoguanidine are for example arranged; Dicyandiamidines such as phosphoric acid dicyandiamidines; Melamine flame retardants such as sulfuric acid melamine, polyphosphoric acid melamine.
In addition, also can with phosphorus and nitrogen as the compound that constitutes element, i.e. phosphagen flame retardant with two keys.As the phosphagen flame retardant, phosphagen compounds such as propoxyl group phosphagen, phenoxy group phosphagen, phosphoramidic acid be former are for example arranged.
As metal hydroxides, for example have aluminium hydroxide, magnesium hydroxide, dolomite,---, the hyrate of calcium hydroxide, barium hydroxide, zirconium hydroxide, tin oxide etc.In addition inorganic flame retardant has for example metal powder of aluminium, iron, titanium, manganese, inferior lead, molybdenum, cobalt, bismuth, chromium, nickel, copper, tungsten, tin etc.; Metal oxides such as silicon, aluminium oxide, iron oxide, titanium oxide, manganese oxide, magnesium oxide, zirconia, lead monoxide, molybdenum oxide, cobalt oxide, bismuth oxide, chromium oxide, nickel oxide, cupric oxide, tungsten oxide; The inferior lead of boric acid, the inferior lead of metaboric acid, barium metaborate, the inferior lead of carbonic acid, magnesium carbonate, calcium carbonate, brium carbonate etc.
As silicon-series five-retardant, for example can enumerate silica flour with epoxy radicals or methylpropenyl etc.
As platinum compounds, chlordene platinum (IV) acid, dinitro diamines platinum (II), tetramine dichloro platinum (II) etc. are for example arranged.
In addition, not only can adopt as fire retardant and just in adhesive, to add just so-called additive flame retardant, also can adopt reactive flame retardant, the skeleton generation molecular reaction of itself and adhesive imports in adhesive and comprises for example compound of nitrogen or phosphorus of ignition-proof element.
Fire retardant has the type that burning is taken place effect, and to generating heat the type of effect takes place, as required with the fire retardant of a plurality of kinds and with then more effective.In addition, fire retardant also can reduce other characteristics that electromagnetic wave noise suppresses body when composing sub-electromagnetic wave noise inhibition body anti-flammability, therefore, consider the balance of characteristic, is necessary the kind and the addition of fire retardant are carried out suitable setting.
The addition of the non-Sb system fire retardant of non-halogen is according to the kind of the kind of adhesive, fire retardant and difference.For example under the situation of phosphorus flame retardant, be preferably 0.5～20 mass parts with respect to adhesive 100 mass parts; Under the situation of metal hydroxides, be preferably 50～300 mass parts with respect to adhesive 100 mass parts; Under the situation of platinum compounds, be preferably 0.01～1 mass parts with respect to adhesive 100 mass parts.If the addition of the non-Sb system fire retardant of non-halogen is very few, then exist electromagnetic wave noise to suppress the insufficient worry of anti-flammability of body, if and the addition of the non-Sb system fire retardant of non-halogen is too much, the shear modulus of the adhesive that can't obtain to expect then, perhaps reduce the mechanical strength of adhesive self, for example drawing crack intensity, hot strength.
The electromagnetic wave noise that comprises the non-Sb system fire retardant of non-halogen in the matrix 2 suppresses the anti-flammability that body can be brought into play abundance.And, because magnet is with state of atom and adhesive integration in composite bed 3, so, thereby can suppress prior art make magnet powder be dispersed in that electromagnetic wave noise in the adhesive suppresses to exist in the body because magnet powder improves catalysis or heat conductivity promotes flammability, reduce the phenomenon of self fire extinguishing property.Therefore, suppress body with electromagnetic wave noise of the prior art and compare, can significantly reduce the use amount of the non-Sb system fire retardant of non-halogen.
(electroconductive stuffing)
In order to make electromagnetic wave noise of the present invention suppress the reflecting effect of body performance electromagnetic wave noise, promptly shielding character can make matrix 2 contain electroconductive stuffing.As shown in Figure 8, it is to be made of supporting mass layer 8 and the matrix 2 and the composite bed 3 that are laminated on the supporting mass layer 8 that electromagnetic wave noise suppresses body 10, and wherein composite bed 3 is the state that magnet mixes with the part of matrix 2 with the atom shape.In matrix 2, dielectric medium powder 11 and electroconductive stuffing 12 are dispersed in the adhesive 6.
Electroconductive stuffing 12 is to cover at least a conductive powders of selecting particulate, carbon particulate, the carbon nano-tube from metal powder, metallic fiber, metal, therefore, helps further to improve shielding character.
The shape of electroconductive stuffing 12 is according to the kind of material and difference, can be the irregularly shaped of metallic or, if given play to conductivity then there is no particular limitation by disperseing to add as the needle-like shape of carbon nano-tube etc. and the spherical carbon of formative tissue (structure) structure.If particle shape or erose material, preferred its particle diameter of the size of electroconductive stuffing 12 is below the 10 μ m, if then preferred its fibre diameter of the material of fiber shape is below the 5 μ m.Will increase if surpassed the thickness of these size matrixes 2, be unfavorable for slimming.
The dispersion addition of electroconductive stuffing 12 is preferably 10～50voL% in matrix 2 (100voL% (volume %)).If then be difficult to stably demonstrate conductivity,, be difficult to form composite bed 3 by integration with magnet if surpassed the shear modulus of 50voL% matrix then can increase less than 10voL%.
The intrinsic specific insulation (sometimes claim " intrinsic resistance value) (JIS K 7194) that comprises the matrix 2 of electroconductive stuffing 12 is preferably below the 500 Ω cm.More preferably below the 50 Ω cm.
Electromagnetic wave noise shown in Figure 8 suppresses in the body, composite bed 3 is electronic installations, the conducted noise that inhibition is produced by circuit self, disperse to be added on the radiation noise that electroconductive stuffing 12 in the matrix 2 covers the substrate that comes from the electronic installation outside etc., suppress the increaseization of the electromagnetic coupled that the reflection owing to unwanted radiation produces.
(dielectric medium powder)
In order to suppress the reflection of electromagnetic wave unwanted radiation, can make matrix 2 contain dielectric medium powder 11.
Preferably the dielectric constant in the high-frequency zone is big, and the comparatively gentle dielectric medium powder 11 of the frequency characteristic of dielectric constant.Dispersion by dielectric medium powder 11 is added, can realize and the space between impedance matching, therefore, just be difficult to cause the reflection of electromagnetic unwanted radiation.
At least a dielectric medium powder that employing is selected from barium titanate ceramics, zirconium titanate system ceramics, plumbous perovskite series ceramic is as dielectric medium powder 11, helps suppressing the raising of the performance of unwanted radiation.
There is no particular limitation for the shape of particle of dielectric medium powder 11, still, preferably is spherical particle substantially.In addition, the particle diameter of dielectric medium powder 11 is preferably below the 5 μ m.If surpass 5 μ m, then can't guarantee the dispersion addition in matrix, also be unfavorable for slimming simultaneously.More preferably below the 1 μ m.
The dispersion addition of dielectric medium powder 11, in matrix 2 (100voL%), be 5～50voL% preferably, if less than 5voL% then can't show the effect of dielectric loss in the high-frequency zone, if surpass 50voL% then the shear modulus of matrix 2 increases, the composite bed 3 that has been difficult to form with the magnet integration.
In addition, with dielectric medium powder 11 and electroconductive stuffing 12 and when disperseing to add, addition preferably can demonstrate the amount of its effect separately respectively, but, the dispersion addition of the total of dielectric medium powder 11 and electroconductive stuffing 12 is below the 50voL% in matrix 2 (100voL%) preferably.If surpassed 50voL% then the shear modulus of matrix 2 increases, the composite bed 3 that has been difficult to form with the magnet integration.
(other additives)
In addition, can also in adhesive, suitably add and strengthen filler, dispersant, age resister, antioxidant, colouring agent, thixotropic agent, plasticizer, lubricant, anti-live agent, heat-resisting reinforcing agent, ultra-violet absorber etc., but, if mix the material of hard, the magnet atom will bump with it, can not disperse fully, therefore should be noted that.In addition, after the evaporation magnet, can also implement the evaporation of silica or silicon nitride, thereby can improve anti-environmental characteristics.
(supporting mass layer)
Thinner using matrix 2 separately, perhaps because under the little and reluctant situation of shear modulus in serviceability temperature zone, as shown in Figure 9, supporting mass layer 8 can be set.Supporting mass layer 8 both can be the material identical with matrix 2, also can be metal forming or ceramic foil with flexibility.In addition, supporting mass layer 8 preferably with the adhesive that constitutes matrix 2 specific rigidity height mutually, and the high material of shear modulus.Supporting mass layer 8 is preferably thinner, and its thickness is preferably below the 50 μ m, most preferably is below the 25 μ m.
(heat conduction layer)
Have exothermicity in order to make electromagnetic wave noise of the present invention suppress body, heat conduction layer can be set.
Heat conduction layer is the thin slice that for example contains the heat conductivity filler.Can adopt metals such as copper, aluminium as the heat conductivity filler; The low-melting alloy of aluminium or indium etc.; Metal oxides such as aluminium oxide, silicon dioxide, magnesium oxide, colcother, beryllium oxide, titanium dioxide; Metal nitrides such as aluminium nitride, silicon nitride, boron nitride; Perhaps carborundum etc.But, have more than and be defined in these materials.
The mean particle diameter of heat conductivity filler is preferably 0.1-100 μ m, more preferably 1-50 μ m.Under the situation of mean particle diameter less than 0.1 μ m, the excessive high fillingization that is difficult to realize thereby the specific area of particle will become.Under mean particle diameter surpassed the situation of 100 μ m, the surface of heat conduction layer will occur small concavo-convex, exists thermal contact resistance to become big worry.
The amount of heat conductivity filler is according to the kind of filler and different, but is preferably 10-85vol%.If less than 10vol% then can there be the situation of the heat conductivity that can't obtain needs, if surpassed 85vol% then the worry that can exist thin slice to become fragile.
To constituting the thin slice material of heat conduction layer, do not limit especially, still, consider preferred silicon (oxygen) rubber, the polyurethane rubber etc. of adopting from thermal endurance, weather resisteant equal angles.Electromagnetic wave noise inhibition body with heat conduction layer is effective especially to the semi-conductive heat radiation purposes of heat generations such as power transistor or thyristor.
＜flame retardant resin layer 〉
Have anti-flammability in order to make electromagnetic wave noise of the present invention suppress body, the flame retardant resin layer can be set.
Suppress body as electromagnetic wave noise with flame retardant resin layer, for example have electromagnetic wave noise as shown in figure 10 to suppress body 20, this electromagnetic wave noise suppresses body 20 by flame retardant resin layer 7 be laminated to its surperficial matrix 2 and magnet constitutes with the composite bed 3 that a part of adhesive of atom shape and matrix 2 is admixture.In addition, can also be that as shown in figure 11 electromagnetic wave noise suppresses body 21, this electromagnetic wave noise suppresses the flame retardant resin layer 7 that body 21 is the composite bed 3 of admixture by matrix 2, magnet with a part of adhesive of atom shape and matrix 2 and is arranged on composite bed 3 surfaces and constitutes; As shown in figure 12 electromagnetic wave noise suppresses body 22, and this electromagnetic wave noise suppresses body 22 by flame retardant resin layer 7 be laminated to its surperficial matrix 2, magnet and be the composite bed 3 of admixture and be arranged on composite bed 3 lip-deep flame retardant resin layers 7 with a part of adhesive of atom shape and matrix 2 and constitute.
Flame retardant resin layer 7 is the layers that formed by flame retardant resin.Here, so-called flame retardant resin is meant and is difficult to catch fire, even perhaps have the resin of the character that also can put out a fire at short notice of catching fire.
Have resin self to have the resin of anti-flammability as flame retardant resin, promptly decomposition temperature is higher, the less resin of combustible that resin produces when decomposing; And the high resin of critical oxygen index, concrete have fluororesin, polyimide resin, polyamide-imide resin, polyethers-sulphone resin, polyethers-ether ketone resin, polyethers-imide resin, polyphenylene sulfides resin, a liquid crystal polymer etc.Particularly preferably have the UL94 of being equivalent to VTM-0, VTM-1, perhaps be equivalent to the flame retardant resin of the anti-flammability of UL 94V-0, V-1.
In addition, even lack the resin of anti-flammability, so long as by add fire retardant or and flame retardant resin carry out compoundly, had the UL94 of being equivalent to VTM-0, VTM-1, the resin that perhaps is equivalent to the anti-flammability of UL 94 V-0, V-1 just can be used as flame retardant resin of the present invention and uses.But, preferably not environment for use polluter halogen system, Sb system fire retardant.
Can in flame retardant resin, suitably add and strengthen filler, fire retardant, flame retardant, age resister, antioxidant, colouring agent, plasticizer, lubricant, heat-resisting reinforcing agent etc.
Do not limit the thickness of flame retardant resin layer 7 is special, still, for more frivolous, compact, the preferably relatively thinner flame retardant resin layer 7 of electromagnetic wave noise inhibition body.Specifically, preferably its thickness is below the 50 μ m, most preferably is below the 25 μ m.
Because magnet is with state of atom and adhesive integration in composite bed 3, thus electromagnetic wave noise of the present invention suppress body can suppress prior art make magnet powder be dispersed in electromagnetic wave noise in the adhesive to suppress the phenomenon that the raising catalysis or the heat conductivity that cause owing to magnet powder in the body promotes flammability, reduces self fire extinguishing property.Therefore, electromagnetic wave noise of the present invention suppresses body only by having flame retardant resin layer 7, just can bring into play sufficient anti-flammability.
＜conductor layer 〉
In order to make electromagnetic wave noise of the present invention suppress the shielding character of body performance, conductor layer can be set as the reflecting effect of electromagnetic wave noise.
Electromagnetic wave noise shown in Figure 13 suppresses body 30 and comprises conductor layer 9 and be laminated to the matrix 2 that is dispersed with dielectric medium powder 11 in adhesive 6 on these conductor layer 9 surfaces and magnet is admixture with a part of adhesive of atom shape and matrix 2 composite bed 3 formations.In this example, conductor layer 9 is made of the conductive film that support membrane 13 and metal level 14 form, this metal level 14 on support membrane 13 physical vapor deposition metal form.
In electromagnetic wave noise inhibition body 31 as shown in figure 14, the two sides of conductor layer 9 is provided with dielectric medium powder 11 respectively and is dispersed in matrix 2 in the adhesive 6, surface at these matrixes 2 is provided with composite bed 3 again respectively, wherein, conductor layer 9 is film formed by the conduction with support membrane 13 and metal level 14.
In electromagnetic wave noise inhibition body 32 as shown in figure 15, be provided with a plurality of dielectric medium powders 11 on the single face of conductor layer 9 respectively and be dispersed in matrix 2 and composite bed 3 in the adhesive 6, wherein, conductor layer 9 is film formed by the conduction with support membrane 13 and metal level 14.
Promptly, electromagnetic wave noise shown in Figure 13 suppresses in the body 30, on a face of conductor layer 9, be provided with a composite bed 3 across matrix 2, still, electromagnetic wave noise of the present invention suppresses in the body, for example can be as shown in figure 14, two sides at conductor layer 9 is provided with composite bed 3 across matrix 2, also can across matrix 2 a plurality of composite beds 3 be set as shown in figure 15 on a face of conductor layer 9.Shown in Figure 13,15, metal level 14 both can be arranged in the conductor layer 9 side opposite with matrix 2, also can be arranged on matrix 2 sides.When actual installation, consider the metal level 14 of protective film, preferably metal level 14 is arranged on matrix 2 sides.
Electromagnetic wave noise shown in Figure 16 suppress body 33 be with conductor layer 9 as the metal entangled object, and dielectric medium powder 11 be set on its surface be dispersed in matrix 2 and the part on this matrix 2 surfaces and the composite bed 3 that the magnet integration forms in the adhesive 6.
The intrinsic specific insulation of conductor layer 9 (JIS K 7194) is preferably below the 500 Ω cm.And, more preferably below the 50 Ω cm.
Conductor layer 9 is preferably selected from the organic polymer layer that is dispersed with metal forming, metal fiber cloth, conductive fibre fabric, metal wire entangled object, conductive fiber entangled object, electroconductive stuffing and conductive film.
As metal forming, the paper tinsel of aluminium, nickel, tin, copper, phosphor bronze, nickeline, brass and other copper alloys etc. is for example arranged.As metal fiber cloth, the adhesive-bonded fabric of fibers such as nickel or stainless steel is for example arranged.As conductive fibre fabric, the two-layer gold-plated adhesive-bonded fabrics such as conductive fiber of having implemented copper and nickel on carbon fiber or polyester fiber are for example arranged.As the metal wire entangled object, the net that is formed by nickel, tin, copper, phosphor bronze, nickeline, brass and other copper alloys etc. is for example arranged.As the conductive fiber entangled object, the net of the fiber of the gold-plated processing of having implemented copper, nickel and other metals is for example arranged.
In addition, conductor layer 9 also can be the organic polymer layer that is dispersed with electroconductive stuffing, promptly, organic polymer and be dispersed in the organic polymer layer that electroconductive stuffing wherein forms.There is no particular limitation to organic polymer, still, also can be the insulating properties organic polymer.As the organic polymer that conductor layer adopted, resins such as polyolefin, polyester system, polyethers system, polyketone system, polyurethane are for example arranged; Elastomers such as silicone, isoprene, butadiene, styrene-butadiene, urethane, ethene-butadiene.As the electroconductive stuffing that conductor layer adopted, metallic, carbon fiber, carbon nano-tube, micropowder end etc. are for example arranged.
As conducting film, the conducting film that for example has support membrane 13 and metal level 14 to form.As conductor layer 9, as shown in figure 13, when adopting the conducting film of support membrane 13 and metal level 14 formation, metal layer thickness is preferably 5～500nm.If not enough 5nm then as its conductivity instability of metal level, thereby is difficult to bring into play electromagnetic shielding effect,, then be unfavorable for reducing cost if surpass 500nm.Thickness helps to realize that at 5～150nm electromagnetic wave noise suppresses lightweight, slimming and the flexibility of body 30.
As the material of support membrane 13, resins such as polyolefin, polyester system, polyethers system, polyketone system, polyurethane are for example arranged; Elastomers such as silicone, isoprene, butadiene, styrene-butadiene, urethane, ethene-butadiene.And, the flexible membrane that also can adopt for example poly-imines film, polyester film etc. to form.
As the formation process of metal level 14, for example there is pair support membrane 13 to carry out the lamination process of metal-plated metalworking, support membrane 13 and metal forming, support membrane 13 is carried out the physical vapor deposition of metal etc.Wherein, can stably obtain to satisfy condition and the even metal layer 14 that above-mentioned thickness is 5～500nm by employing to the physical vapor deposition that support membrane 13 carries out metal.
In gold-plated processing, can adopt for example metals such as nickel, tin, copper, phosphor bronze, nickeline, brass, other copper alloys, in lamination process, can adopt aluminium, copper, nickel foil etc.
Be used to obtain the metal physics evaporation of metal level 14, preferably adopt subtend target magnetic control sputtering method.This is because compare with the wet type processing of adopting gold plating liquid in gold-plated processing method; subtend target magnetic control sputtering method is dry-type processing; so there is not liquid waste processing; not only safety but also be beneficial to environmental protection; simultaneously; can easily the metal level film is adjusted into homogeneous and have stable thickness, be a kind of productive processing method that is very beneficial for.
Suppress in the body at electromagnetic wave noise with conductor layer 9, composite bed 3 suppresses the conducted noise of electronic installation, circuit self generation, conductor layer 9 covers the radiation noise that the substrate of electronic installation outside etc. sends, and suppresses the increaseization of the electromagnetic coupled that the reflection owing to unwanted radiation produces.
＜electromagnetic wave noise suppresses body 〉
When magnet is the micron order size, in order to obtain bigger transmission absorption rate, though need to use a large amount of highdensity magnets, adopt thick and heavy electromagnetic wave noise to suppress body,, if magnet is with nanoscale and adhesive integration, when forming complicated heterostructure, compare with micron-sized particle, characteristic is just different, it is big that magnetic conductivity becomes, and absorption bands enlarges.Therefore,, just there is no need as above-mentioned situation, use a large amount of highdensity magnets, adopt thick and heavy electromagnetic wave noise to suppress body in order to obtain bigger transmission absorption rate.
Though the magnet state in the Direct observation composite bed 3 is difficulty relatively, but, can judge composite bed 3 by the electromagnetic wave max transmissive attenuation (dB/ μ m) that electromagnetic wave noise suppresses composite bed 3 average thicknesss of body and have the heterostructure of magnet with nanoscale and the formed complexity of adhesive integration.
If the electromagnetic wave max transmissive attenuation of the thickness correspondence of composite bed 3 is-0.5～-500dB/ μ m, just represent that magnet is with nanoscale and adhesive integration.In the present invention, the electromagnetic wave max transmissive attenuation of the thickness correspondence of this composite bed 3 must be-0.5～-500dB/ μ m.If this index is less than-0.5dB/ μ m (for example-0.4dB/ μ m) or greater than-500dB/ μ m (for example-600dB/ μ m), the Noise Suppression deterioration of efficiency then can generate electromagnetic waves, perhaps, the electromagnetic wave noise of bringing into play regulation need thicken the thickness that electromagnetic wave noise suppresses body for suppressing effect, thereby to the restriction on the generation spaces such as employed electronic equipment.
Electromagnetic wave max transmissive attenuation is meant the max transmissive attenuation of measuring in the frequency band of hope inhibition electromagnetic wave noise.While for example just be meant and in wave bands such as 10MHz～1GHz, 100MHz～3GHz, 1～3GHz, 3～20GHz, 20～50GHz, 50～100GHz, the electromagnetic wave amount that changes frequency transmission composite bed 3 measured, the Electromgnetically-transparent attenuation of measuring under the frequency when the transmission attenuation is maximum.For example, electromagnetic wave max transmissive attenuation is in chart shown in Figure 21, Electromgnetically-transparent attenuation (thick line) is bottom 3.0GHz-11.9dB on the chart, in chart shown in Figure 22, Electromgnetically-transparent attenuation (thick line) is bottom 18.0GHz-30.2dB on the chart, in chart shown in Figure 23, Electromgnetically-transparent attenuation (thick line) is bottom 15.7GHz-32.9dB on the chart.
Even the thickness Electromgnetically-transparent amount with respect to composite bed 3 is less, it also must be the Electromgnetically-transparent value that in the middle of reality is used, has actual effect, can bring into play transmission attenuation that electromagnetic wave noise suppresses effect effectively and be-6～-50dB, be-10 in peak value～-50dB.
Equally, suppress effect in order to obtain electromagnetic wave noise, electromagnetic volume reflection is preferably little, and the reflection loss amount in the wave band of expression max transmissive attenuation is preferably-6～-50dB, more preferably-10～-50dB.
In addition, though be not very clear and definite in theory, but, by the less magnet of evaporating quality on matrix, electromagnetic wave noise of the present invention suppresses body because wait the intrinsic magnetic anisotropy of quantum effect or material, shape magnetic anisotropy or the anisotropy by the generation of external magnetic circle that relation is arranged with the smart grain of nanometer, so, the power loss value that suppresses effectiveness indicator as electromagnetic wave noise can be made as bigger value.
Here, as shown in figure 33, the variation of transmission characteristic S11 (reflection characteristic) and S21 (transmissison characteristic) is investigated,, drawn the power loss value by following formula according to the value of S11 under the characteristic frequency and S21.The power loss value is 0～1.
Power loss value (Ploss/Pin)=1-(| Г | 2+ | T| 2)
S11＝20log |Г|
S21＝20log |T |
Here, Г is a reflection coefficient, and T is a transmission coefficient.
The power loss value is the overall target of the reflection and transmission characteristic of electromagnetic wave noise suppressing function, and needing it is the power loss value that reflection loss amount and transmission attenuation have actual effect in actual use.Therefore, electromagnetic wave noise of the present invention suppresses the power loss value of body in 1GHz preferably 0.3～0.65, is more preferably 0.4～0.65.
In order to give full play to the function that suppresses body as electromagnetic wave noise, even the little transmission attenuation that also is greater than of reflection loss amount, preferred reflection loss amount is greater than-6dB, the transmission attenuation greater than-3dB (for example, the reflection loss amount is-7dB, the transmission attenuation is-4dB), promptly the power loss value is more than 0.3.If less than this value then can't have sufficient electromagnetic wave noise suppressing function.And preferred reflection loss amount is greater than-10dB, and (for example, the reflection loss amount is-11dB the transmission attenuation, and the transmission attenuation is-4dB), promptly the power loss value is more than 0.4 greater than-3dB.If reflection loss amount and transmission attenuation all-(for example, the reflection loss amount is-12dB, and the transmission attenuation is-11dB), then can have sufficient electromagnetic wave noise and suppress effect more than the 10dB.On the other hand, the power loss value surpasses 0.65, from the angle consideration that improves characteristic is to be worth very much expectation, but, anyway inquire into that electromagnetic wave noise suppresses the selection of magnet in the body or to the selection of adhesive evaporation condition, under existing technical conditions, all can't obtain in 1GHz power loss value and surpass 0.65 electromagnetic wave noise and suppress body.
For the power loss value that makes this electromagnetic wave noise suppress body is 0.3～0.65, when making electromagnetic wave noise inhibition body, by carrying out high-octane physical vapor deposition, to make adhesive and magnet atom integral body turn to primary condition at nanometer level, suitably select physical vapor deposition condition, magnet evaporation amount etc.
Shown in Figure 30～32, electromagnetic wave noise of the prior art suppresses the curve of the power loss characteristic of body, near along with the ascending power loss value of frequency 1GHz climbing is smaller, begin to uprise from certain frequency that surpasses 1GHz along with the climbing of the ascending power loss value of frequency, have the variation bending point that the inclination of curve changes in a side higher, form the curve that protrudes downwards than 1GHz frequency.And electromagnetic wave noise of the present invention suppresses the power loss characteristic curve of body, shown in Figure 27～29, begins rapid rising from the frequency that is lower than 1GHz, and afterwards, climbing begins passivation near 1.5GHzZ or after surpassing 2GHz, forms curve protruding upward.Therefore, it is big that near the power loss value the 1GHz becomes, and actual effect is very good, and wherein, electromagnetic wave noise inhibition body of the present invention has actual effect under the situation of 1GHz.
Suppress in the body at electromagnetic wave noise of the present invention, the amount of the magnet of formation composite bed 3 is considerably less.Therefore, electromagnetic wave noise suppresses the proportion of body to be compared with the simple matrix that is formed by adhesive, and maximum also just increases approximate number %.Therefore, be under the situation of resin or rubber at adhesive, the proportion that electromagnetic wave noise suppresses body is 0.9～1.5.Like this, relative less because the amount of magnet is compared with electromagnetic wave noise inhibition body of the prior art, so can keep the characteristic of adhesive, keep sufficient mechanical properties.
Electromagnetic wave noise of the present invention suppresses the shape of body, can be the plane of sheet etc., also can be three-dimensional structure.In addition, as hereinafter described, when electromagnetic wave noise being suppressed body be used to cover article surface, its shape can be imitated contoured article.
In addition, a plurality of composite beds can be had only the electromagnetic wave noise inhibition body of one deck to carry out lamination, thereby a plurality of composite beds are set.The integral thickness that the lamination electromagnetic wave noise suppresses body preferably approximately is 20～200 μ m.Therefore, consider preferably to comprise that the lamination electromagnetic wave noise of matrix thickness suppresses the integral thickness of body, thereby suitably select.
Suppress in the body at the lamination electromagnetic wave noise, the composite bed thickness that forms the electromagnetic wave noise inhibition body of each layer can be identical, also can change the composite bed thickness of each layer.
For example, suppress in the body at electromagnetic wave noise, produce reflection of electromagnetic wave to a certain degree, can exert an influence to radiating electromagnetic electronic circuit or electronic installation, therefore, the composite bed thickness of each layer of lamination increases the line tilt configuration etc. of going forward side by side, the inhibitory reflex of can trying one's best gradually from the layer beginning near electronic installation one side.
＜electromagnetic wave noise suppresses the manufacture method of body 〉
Below, the manufacture method that electromagnetic wave noise is suppressed body describes.
Electromagnetic wave noise of the present invention suppresses the manufacture method of body, is to have the magnet physical vapor deposition to matrix, forms the method for the evaporation step of composite bed on matrix surface.
(evaporation step)
At first, carry out the general remark of physical vapor deposition (PVD).
Physical vapor deposition (PVD) generally is that the evaporating materials after making evaporating materials gasification and make gasification by some method in vacuum tank is deposited on the substrate of nearby placing and film forming method, because the difference of the gasification process of evaporated material, thereby be divided into evaporation and sputtering method.Evaporation has EB evaporation, ion plating etc., and sputtering method has high-frequency sputtering, magnetron sputtering, subtend target magnetic control sputtering etc.
The EB evaporation has following feature, because the energy of evaporation particle is little, is 1eV, so the damage of substrate is less, film forms pore easily, has the tendency of film strength deficiency, and still, it is big that the intrinsic resistance of film can become.
In ion plating, for the ion acceleration shock that makes argon gas or evaporation particle to substrate, energy is bigger than BP's, particle can reach 1KeV, can obtain the film of strong adhesion, still, existence can't avoid being called as the adhering to of particle of the micron size of drop, has the possibility that stops to discharge.In addition, can also make the oxide film forming by the method that imports oxygen isoreactivity gas.
In magnetron sputtering, though the utilization ratio of target (evaporating materials) is low, it has following feature: owing to the influence in magnetic field produces strong plasma, so its growth rate is very fast, and particle can be high, is tens of eV.In high-frequency sputtering, can use the target of insulating properties.
Subtend target magnetic control sputtering in the magnetron sputtering is that a kind of making between the opposed target produces plasma, by magnetic field plasma is sealed, outside opposed target, substrate is set, the method that plasma loss just can generate desired film can not take place.Therefore, the film on the sputter substrate once more, growth rate is faster, need not be collided mitigation by the atom of sputter, just can generate and the fine and close identical material of target constituent composition.
In addition, because the magnetic line of force can pass the magnet target in common magnetron sputtering, so will be according to the thickness decision sputter rate of target, perhaps, at meeting become be not easy the discharge, the subtend target magnetic control sputtering has following feature: magnetic field vertically is applied on the sputter face of target, so, also can keep magnetic field even adopt magnet to be used as target, also can realize and the irrelevant high-speed sputtering of the thickness of target.
In above-mentioned physical vapor deposition,, make electromagnetic wave noise inhibition body of the present invention and preferably adopt the subtend target magnetic control sputtering based on following reason.
Under the situation that adhesive is formed by resin (or rubber), the covalent bond energy of resin is about 4eV, and specifically, for example the binding energy of C-C, C-H, Si-O, Si-C is respectively 3.6eV, 4.3eV, 4.6eV, 3.3eV.Corresponding, in subtend target magnetic control sputtering method,,, bump so cut off a part of chemical bond of resin because evaporation particle has high-energy.
Therefore, in the present invention, if the modulus of elasticity of the adhesive that is formed by resin (perhaps rubber) is enough little, when making the magnet evaporation, the molecule of resin vibrates, moves, and the molecule of resin is cut off in some cases, immixture takes place in the part that magnet atom and resin take place, interpenetrate with resin etc., can form the magnet film that is not homogeneous, but have the composite bed of nano level inhomogeneous structure.
When making the particle can be for the magnet Atomic Physics evaporation more than the 5eV on adhesive the time, owing to once just a large amount of magnets can be dispersed in the adhesive therefore preferably employing.Promptly just can obtain the quality of magnet, so can obtain the big electromagnetic wave noise inhibition body of electromagnetic wave noise inhibition efficient easily by an evaporation.Owing to the speed of the vibration of comparing adhesive with particle rapidity or motion is slow, different according to magnet certainly so the speed of evaporation preferably adopts smaller speed to cooperate the mitigation sequential of adhesive, but preferably be about below the 60nm/min.
In the evaporation step as the employed magnet of evaporating materials, mainly adopt metal be soft magnetic bodies and/or, oxide based soft magnetic bodies and/or, nitride based soft magnetic bodies.These can use wherein a kind of separately, also can be use mixing two or more.
As metal is soft magnetic bodies, generally uses iron and ferroalloy.As ferroalloy, specifically can use Fe-Ni, Fe-Co, Fe-Cr, Fe-Si, Fe-Al, Fe-Cr-Si, Fe-Cr-Al, Fe-Al-Si, Fe-Pt alloy.These metals are soft magnetic bodies, can use wherein a kind ofly separately, also two or more alloy combination can be used.Except iron and ferroalloy, can also use the metal of cobalt, nickel or their alloy.Using under the situation of nickel, separately because it has resistance to oxidation, so can preferably use.
As oxide based soft magnetic bodies, preferably use ferrite, specifically, can use MnFe 2O 4, CoFe 2O 4, NiFe 2O 4, CuFe 2O 4, ZnFe 2O 4, MgFe 2O 4, Fe 3O 4, Cu-Zn-ferrite, Ni-Zn-ferrite, Mn-Zn-ferrite, Ba 2Co 2Fe 12O 22, Ba 2Ni 2Fe 12O 22, Ba 2Zn 2Fe 12O 22, Ba 2Mn 2Fe 12O 22, Ba 2Mg 2Fe 12O 22, Ba 2Cu 2Fe 12O 22, Ba 3Co 2Fe 24O 41These ferrites can use wherein a kind ofly separately, also two or more ferrite can be mixed and use.
As nitride based soft magnetic bodies, known have a Fe 2N, Fe 3N, Fe 4N, Fe 16N 2Deng, because its permeability and corrosion resistance height, so preferably use these nitride based soft magnetic bodies.
In addition, when making the magnet physical vapor deposition to adhesive, because magnet is as being entered adhesive by plasma or Ionized magnet atom, so, be dispersed in the composition of the magnet in the adhesive by differential, not limiting it must be with identical as the composition of the employed magnet of evaporating materials.In addition, also may react, and the variation that magnet is converted into normal magnet or anti-kicker magnet etc. takes place with the part of adhesive.
The evaporating quality of the magnet in the operation of physical vapor deposition, with the thickness scaled value of its magnet Dan Pin preferably below 200nm.If thicker than this, though according to the shear modulus of adhesive and difference, adhesive can have the ability that comprises magnet, and magnet just can't be dispersed in the adhesive but pile up from the teeth outwards, thereby generates the continuous block film with conduction of homogeneous.Just because of this, the evaporating quality of magnet is preferably below the 100nm, more preferably below the 50nm.On the other hand, consider that from the angle of electromagnetic wave noise inhibition effect the evaporating quality of magnet is preferably more than the 0.5nm.
If evaporating quality diminishes, will reduce electromagnetic wave noise and suppress effect, therefore by the laminated multilayer composite bed, can increase the gross mass of magnet.Though this gross mass is according to the inhibition level of desired electromagnetic wave noise and difference, the thickness scaled value of total magnet preferably is about 10～500nm.In addition, can and make it have electromagnetic reflection characteristic with the part of the layer of lamination as reguline metal layer with conduction.Can also carry out syntheticization with dielectric layer, suppress effect thereby can adjust electromagnetic wave noise.
Here, on hard substrates such as glass, silicon,, can draw evaporating quality by the thickness of measuring its accumulation with the same terms physical vapor deposition magnet.
The thickness of employed adhesive in the evaporation step, not special the qualification, if compact electromagnetic wave noise suppresses body, the thin adhesive of then preferred used thickness.Specifically, its thickness is preferably below the 50 μ m, more preferably below the 10 μ m.
(layered product manufacturing step)
In addition, when electromagnetic wave noise of the present invention suppresses body except matrix and composite bed, when also comprising other layers such as supporting mass layer, heat conduction layer, flame-retarded resin layer, conductor layer, it is to form by the manufacture method manufacturing that comprises layered product manufacturing step and evaporation step, wherein, the layered product manufacturing step is a step of making the layered product comprise the matrix that contains adhesive and other layers; The evaporation step is to make the magnet physical vapor deposition to matrix, forms the step of composite bed at matrix surface.
The Production Example of layered product is as carrying out by the following method: the method for the stacked adhesive of extruding on the various films that constitute other layers; The method of coating adhesive on various films; To contain the matrix of adhesive and the coherent method of various films etc. by binding agent, adhesive agent.
＜have article of electromagnetic wave noise suppressing function 〉
Article with electromagnetic wave noise suppressing function of the present invention, at least a portion of article surface are suppressed body by electromagnetic wave noise of the present invention and cover.
As article, the printed circuit board (PCB), electric connector, flat cable, push-button switch of electronic installation is for example arranged, electronic installation being installed with key head parts, initial processing with inserting sheet, semiconductor integrated circuit etc.
Below, the object lesson with article of electromagnetic wave noise suppressing function of the present invention is described.
(electronic installation)
Electromagnetic wave noise of the present invention suppresses the electromagnetic wave noise that body can suppress the electronic installation generation of various electronic equipments.Promptly, cause the electronic installation of misoperation in the electronic installation that electronic equipment is included easily because of the electromagnetic wave of other devices, thereby the use for electronic equipment that causes other electronic installation misoperations of perhaps self generating electromagnetic waves electromagnetic wave noise of the present invention suppresses body to be covered, and can control electromagnetic wave noise that electronic installation produces or that electronic installation is made a difference.As such electronic equipment, so long as send signal, received signal or send the equipment of received signal, any electronic equipment can become and is capped object.That is, the article with electromagnetic wave noise suppressing function of the present invention, at least a portion that is exactly included electronic installation of this electronic equipment or group of electronic devices is covered by electromagnetic wave noise inhibition body of the present invention.
(printed circuit board (PCB))
Article with electromagnetic wave noise suppressing function of the present invention are that electromagnetic wave noise of the present invention suppresses body and is arranged on the part of at least one face of at least one printed circuit board (PCB) of the electronic equipment that comprises printed circuit board (PCB) or whole.Just both can cover the two sides of printed circuit board (PCB) or the integral body of single face, also can cover the part of its two sides or single face.As long as the electromagnetic wave that the electronic installation that is provided with on the printed circuit board (PCB) produces can not produce harmful effect to other electronic installations that are configured on the identical printed circuit board (PCB), also can it is whole with the covering of electromagnetic wave noise suppressor, come from outside electromagnetic wave with absorption.
In addition, if the electromagnetic wave that the electronic installation that is provided with on the printed circuit board (PCB) produces can produce harmful effect to other electronic installations that are configured on the identical printed circuit board (PCB), then can be with except the bad electromagnetic electronic installation that exerts an influence, for example all using shielded box or electromagnetic wave noise to suppress body covers, and bad electromagnetic electronic installation also covers with the electromagnetic wave noise suppressor separately with exerting an influence.
Because suppressing body, electromagnetic wave noise of the present invention has flexibility, so even above-mentioned printed circuit board (PCB) is a flexible print wiring board, printed circuit board (PCB) is owing to stress deforms, thereby electromagnetic wave noise suppresses distortion that body also can easily imitate printed circuit board (PCB) overlay electronic device securely, therefore, be particularly suitable for using.
Figure 17 and 18 is the schematic diagrames as the camera assembly of an example of the article with electromagnetic wave noise suppressing function.This camera assembly roughly comprises as lower member: printed circuit board (PCB) 42, and its surface is provided with imageing sensor 41; Camera lens 43, it is corresponding with imageing sensor 41; Camera is supported platform 44, and it is keeping camera lens 43, and surrounds imageing sensor 41 on printed circuit board (PCB) 42; Shell 45 is entrenched in the outside that camera is supported platform 44; And electromagnetic wave noise suppresses body 1, the surface of covering shell 45.
For example, can on shell 45, cover electromagnetic wave noise with method as described below and suppress body 1.To be immersed in by the shell 45 as resin structure that the injection molding method is shaped in the epoxy resin solution as adhesive, it is B platform (stage) the shape epoxy resin of 15 μ m that thickness is set on its surface.Then, by physical vapor deposition with the magnet evaporation on epoxy resin, the conversion thickness is 45nm, forms composite bed.Being entrenched in camera by the shell 45 that will have this electromagnetic wave noise suppressing function supports to implement the noise counter-measure of camera assembly on the platform 44.
Figure 19 is the schematic diagram as the printed circuit board (PCB) of other examples of the article with electromagnetic wave noise suppressing function.This printed circuit board (PCB) roughly comprises as lower member: wiring circuit 52, and it is formed on the substrate 51; Semiconductor package 53 and substrate (chip) parts 54 are connected wiring circuit 52; And electromagnetic wave noise inhibition body 1, its covering comprises the printed circuit board surface of wiring circuit 52, semiconductor package 53 and substrate assembly 54.
For example, can on printed circuit board (PCB), cover electromagnetic wave noise with method as described below and suppress body.The insulating properties adhesive of coating 50 μ m on printed circuit board (PCB) is to cover wiring circuit 52, semiconductor package 53 and substrate assembly 54.In the above, by physical vapor deposition evaporation magnet, form composite bed.Because be not wet process,, can give electromagnetic wave noise suppressing function easily so need not implement to remove the cleaning step of deionization.
(electric connector)
Article with electromagnetic wave noise suppressing function of the present invention, at least comprise printed circuit board (PCB) and transmit the electric connector (connector) of signal to printed circuit, if electromagnetic wave noise of the present invention is suppressed body to be laminated at least a portion of this electric connector, the signal that then can prevent to feed through to electric connector is invaded, thereby this signal brings out by coming from the work that makes a mistake of outside electromagnetic wave.In this case, also, electromagnetic wave noise of the present invention has flexibility because suppressing body, so even electric connector is a flexible connector, because distortion has taken place in the external stress flexible connector, thereby suppressing body, electromagnetic wave noise also can easily imitate the soft securely connector of its distortion, therefore, be particularly suitable for using.Example as above-mentioned article can list mobile phone, have the mobile phone of the function of taking pictures etc.
(push-button switch key head parts)
As the article with electromagnetic wave noise suppressing function of the present invention, can list and cover the push-button switch key head parts that electromagnetic wave noise of the present invention suppresses body.As the object lesson of this push-button switch, can list the push-button switch key head parts that form below by lamination electromagnetic wave noise inhibition body of the present invention at the modification sheet that is provided with button portion with the key head parts.
Material as described modification sheet, can select thermoplastic resins such as polyester, poly-imines fat, polycarbonate, acrylic, vinyl chloride, polyethylene, polypropylene, but, consider the mixture of preferred polyester, polycarbonate, acrylic, copolymer from the printing or the processing equal angles that is shaped.
This modifies literal that sheet can be as required needs in the assigned position printing of thin slice, symbol, pattern etc.Can adopt printing process of the prior art to print, not special the qualification.And, also can adopt methods such as coating, gold-plated, evaporation, brand, laser labelling to modify.
Modify on the sheet by described button portion is screwed into to be worked into, be provided with recess, both can be at this recess potting resin, elastomer etc., the formed body of the push-button switch shape that forms by resin, elastomer etc. of also can on a face of flat modification sheet, boning.To be filled in the recess of modifying sheet or be arranged on resin or the elastomer of modifying on the sheet, not special the qualification.
Electromagnetic wave noise suppress body be laminated to the modification sheet that is provided with button portion below.When having filled resin, elastomer etc. in the recess that is provided with on modifying sheet, the lamination electromagnetic wave noise suppresses body, with bottom surface that covers the resin-elastomer that is filled in the recess etc. simultaneously and the face with a side of modifying the sheet recess.When on modifying sheet, being provided with the formed body of push-button switch shape, with the face upper strata piezoelectricity magnetic wave noise suppressor that is provided with the opposite side of face of modifying sheet.
In addition, as the article with electromagnetic wave noise suppressing function of the present invention, can list article: comprise the ratchet of arranging ratchet (click) parts and be arranged on key head on the ratchet with following feature, and on a face of ratchet, had lamination electromagnetic wave noise of the present invention suppress body and the push-button switch key head parts that form.
In addition, as the object lesson of this push-button switch with the key head parts, can list the parts with following feature: pawl component is raise up dome-shaped, at least on the top of dome-shaped pawl component inner face (below the ratchet) travelling contact that is formed by conductive film is set, pawl component deforms when the lamination key head, for example can touch the fixed contact on the configuration printed wiring board in its lower section.
Electromagnetic wave noise suppresses also can be laminated on the face of an opposite side with the key head side on the face of key head one side that body can be laminated to ratchet.When on the face that is laminated to an opposite side with the key head side, electromagnetic wave noise suppresses body and is set to be electric insulating state with described travelling contact.Promptly, electromagnetic wave noise inhibition body can be laminated to the part of ratchet surface except travelling contact, whole upper strata piezoelectricity magnetic wave noise suppressor that also can be below ratchet, suppress to be set up travelling contact on the top of dome-shaped pawl component inner face by dielectric film at least in the surface of body at electromagnetic wave noise.
If electromagnetic wave noise suppresses body and travelling contact is an electric insulating state, disturb in the time of then can being suppressed at the key search and between other keys.If electromagnetic wave noise suppresses body when being set to cover whole an of face of dome-shaped pawl component, can prevent to reveal at the electromagnetic wave of millimere-wave band.
Consider the morphotropism of when extruding ratchet, and problems such as the nerve that produces of the bounce-back when removing, mouldability, preferably use the polyester based resin of polyethylene terephthalate, polyethylene etc. owing to extruding force.As the material that constitutes travelling contact, so long as conductive material just can, not special the qualification, still, the preferred material that adopts formation such as silver, copper, carbon.
(initial processing is with inserting sheet)
In addition, as the article with electromagnetic wave noise suppressing function of the present invention, there is at least one surface layer to press electromagnetic wave noise of the present invention to suppress the initial processing of body with inserting sheet.
Initial processing is formed at the surface of the formed products that uses in the instrument face plate, button etc. of front panel, the automobile of AV equipment with the insertion sheet, have light transmission base material, light transmission printed layers.That is, can be on a face of light transmission base material, to have the light transmission printed layers, also can be with the light transmission printed layers two light transmission substrate material layer of lamination that are clipped in the middle.Initial processing of the present invention is with inserting sheet as the parts that are formed at the formed products surface of using in the push-button switch, and effect is very good.
When inserting sheet is when having the light transmission printed layers on the face at the light transmission base material, preferably electromagnetic wave noise being suppressed body is laminated on the face different with the light transmission printed layers, when the light transmission printed layers being clipped in the middle two light transmission substrate material layer of lamination, electromagnetic wave noise can being suppressed body and be laminated on any.
Preferably suppressing on the face of the opposite side of light transmission base material of body conductive layer to be set with electromagnetic wave noise.As conductive layer, the conductive paste of metal forming, metal evaporation film, printing etc. is for example arranged.By this conductive layer is set, can realize following effect: make reflection of electromagnetic wave, can not be leaked to the outside, and can absorb reflected wave again; Thereby by the Q that the makes resonance suppressing antenna effect that diminishes; The function that can have the metallic luster layer, or the like.
(semiconductor integrated circuit)
When semiconductor integrated circuit is given electromagnetic wave noise suppressing function, on semiconductor wafer by spin coating or CVD (chemical vapour deposition (CVD), Chemical Vapor Deposition) thickness of formation such as the polyimides of She Zhiing, Parylene, polytetrafluoroethylene, polyallyl ether, poly-xylylene, poly-adamantane ether, polybenzoxazole, cyclobutane resin is on the organic insulating film of 200nm～100 μ m, pass through physical vapor deposition, evaporation magnet 10～50nm forms composite bed.As required, also can use mask partly to form composite bed.Because this composite bed is made by dry-cure, so there is not the influence of ionic impurity, there is no need to clean, be fit to very much be applied to semiconductor wafer.Suppress body by the electromagnetic wave noise with nanoscale inhomogeneous structure being set on meticulous integrated circuit next door, even considerably less magnet quality, resonance when the pulse that also can suppress digital circuit transmits and the unwanted radiation noise that produces because of not matching of impedance etc., can improve the quality of transmission characteristic, for example improve transfer rate etc.
＜effect 〉
Electromagnetic wave noise of the present invention in above explanation suppresses in the body, though be not very clear and definite in theory, but, because adhesive and magnet form composite bed by the physical vapor deposition integration, so, even magnet seldom also can have high resonance frequency owing to the intrinsic magnetic anisotropy of the quantum effect that comes from its nano level inhomogeneous structure and material, shape magnetic anisotropy or based on the influence of anisotropy of external magnetic field etc.Therefore, can bring into play good magnetic properties, even magnet seldom also can be brought into play electromagnetic wave noise and suppress effect in the scope of high frequency band.
In addition, suppress in the body at electromagnetic wave noise of the present invention, even suppress effect because magnet seldom also can be brought into play electromagnetic wave noise, thus can reduce the amount of magnet in a large number, thus realize lightweight.
And, suppress in the body at electromagnetic wave noise of the present invention, because also can bringing into play sufficient electromagnetic wave noise, the thin thickness of composite bed suppresses effect, so can make electromagnetic wave noise suppress the body attenuation, save the space.
And, described composite bed so, is dispersed in the adhesive with state of atom by magnet if make the magnet physical vapor deposition to matrix and form, make adhesive and magnet integration, can obtain to have the composite bed that very high electromagnetic wave noise suppresses effect with a spot of magnet.In addition, so because do not exist foreign ion not have because these foreign ions cause the worry that electronic circuit is impaired.
In addition, because can reduce the amount of magnet in a large number, so when above-mentioned adhesive is resin or rubber, the resin that causes owing to magnet or the flexibility of rubber and the reduction of intensity can be controlled in the Min..
And described adhesive is if hardening resin, so, magnet more is evenly dispersed in the adhesive before sclerosis, after sclerosis, even use electromagnetic wave noise to suppress body under hot conditions, also can prevent the magnet crystallization and form particulate, improve its anti-environmental characteristics.
In addition, article (for example: printed circuit board (PCB), semiconductor integrated circuit) with electromagnetic wave noise suppressing function of the present invention, suppress body by the electromagnetic wave noise that nearby disposes compactly that produces the source at noise, can suppress the electromagnetic wave noise of high frequency band effectively.
Embodiment
(evaluation)
As shown in figure 20, (KEYCOM makes the test position fix device 62 that employing is formed by the microstrip line 61 of 50 Ω, TF-3A) (ANRITSU makes with the network analyser 63 that is connected with microstrip line 61, vector network analyzer 37247C), on test position fix device 62, disposed the test pieces 65 of electromagnetic wave noise inhibition body across dielectric film 64, measuring frequency number is under the condition of 2GHz, and the electromagnetic wave noise of measuring embodiment 1～4 and comparative example 1 suppresses the electromagnetic wave noise suppression characteristic (transmission attenuation and reflection loss amount) nearby of body.
[embodiment 1]
At the thickness as matrix is that (shear modulus is 3.8 * 10 for the poly terephthalic acid second membrane of lipoprotein (hereinafter referred to as PET) of 12 μ m 9(Pa), the carbonic acid gas transmissivity is 1 * 10 -11[cm 3(STP) cm/ (cm 2* s * cmHg)], the average surface rugosity is 1.8 μ m) on, be that the high magnetic conductivity ferrite of the Mn-Zn system of 3nm carries out sputter by subtend target magnetic control sputtering method with the conversion thickness, form composite bed.By direct current 4 terminal method exactissima diligentias measured the sheet resistance of composite bed.In addition, this film being adjusted into desired size, inserting polyester and be adhesive agent in the middle of ten films and with its lamination, make its integration by vacuum press, is that the electromagnetic wave noise of 138 μ m suppresses body thereby obtain gross thickness.Then, measure proportion and electromagnetic wave noise suppression characteristic.The result is as shown in table 1.
[embodiment 2]
Be that the thickness that is provided as matrix on the PET film of 25 μ m is that (shear modulus is 1 * 10 for silicon (oxygen) rubber of 20 μ m at thickness as the supporting mass layer 7(Pa), the carbonic acid gas transmissivity is 2.2 * 10 -7[cm 3(STP) cm/ (cm 2* s * cmHg)]), thereon by subtend target magnetic control sputtering method, sputter conversion thickness is the soft magnetic metal of the Fe-Ni system of 20nm, forms composite bed.By direct current 4 terminal method exactissima diligentias measured the sheet resistance of composite bed.In addition, this film is adjusted into desired size, obtaining gross thickness is the electromagnetic wave noise inhibition body of 45 μ m.Then, measure proportion and electromagnetic wave noise suppression characteristic.The result is as shown in table 1.
[embodiment 3]
Be that the thickness that is provided as matrix on the PET film of 25 μ m is that (shear modulus is 1.7 * 10 for the polyurethane gle of 10 μ m at thickness as the supporting mass layer 6(Pa), the carbonic acid gas transmissivity is 5.3 * 10 -8[cm 3(STP) cm/ (cm 2* s * cmHg)]), thereon by magnetron sputtering method (non-subtend target type), sputter conversion thickness is the soft magnetic metal of the Fe-Si-Al system of 15nm, forms composite bed.By direct current 4 terminal method exactissima diligentias measured the sheet resistance of composite bed.And, on composite bed, be coated with the polyurethane gle of 2 μ m, and carried out sputter once more.By repeating this process three layers of composite bed are set, obtaining gross thickness is the electromagnetic wave noise inhibition body of 79 μ m.Then, measure proportion and electromagnetic wave noise suppression characteristic.The result is as shown in table 1.
[embodiment 4]
Except adopting subtend target magnetic control sputtering method to replace the magnetron sputtering method, the same with embodiment 3, sputter conversion thickness is the soft magnetic metal of the Fe-Si-Al system of 15nm, and three layers of composite bed are set, and obtaining gross thickness is the electromagnetic wave noise inhibition body of 79 μ m.And carry out the evaluation same with embodiment.The result is as shown in table 1.
[comparative example 1]
Ointment is coated on the supporting mass that is used to whitewash operation by the scraper rubbing method forms film, so that its dried thickness is 1.1mm, after its intensive drying, carry out the heating in vacuum press forming again, under 85 ℃ condition, carry out sclerosis in 24 hours, film is peeled off from the supporting mass that is used to whitewash operation, is that the electromagnetic wave noise of 1mm suppresses body thereby obtain thickness.Then, measure proportion and electromagnetic wave noise suppression characteristic.The result is as shown in table 1.Wherein, this ointment is that poly-imines fat resin 5 mass parts of adding, isocyanate compound 1 mass parts as curing agent, solvent (1: 1 mixture of cyclohexanone and toluene) 30 mass parts form in soft magnetic metal powder (average particulate diameter is 15 μ m, and length-width ratio is 65) 94 mass parts of the Fe-Ni of flat system.
Table 1
Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Comparative example 1
The supporting mass layer Do not have PET PET PET Do not have
Thickness (μ m) - 25 25 25 -
Matrix PET Silicone rubber Polyurethane gle Polyurethane gle Do not have
Shear modulus (Pa) 3.8×10 9 1×10 7 1.7×10 6 1.7×10 6 -
Carbonic acid gas transmissivity [cm 3(STP)cm/(cm 2×s× cmHg)] 1×10 -11 2.2×10 -7 5.3×10 -8 5.3×10 -8 -
Thickness (μ m) 12 20 10 10 -
Magnet The Mn-Zn based ferrite Fe-Ni Fe-Si-Al Fe-Si-Al Fe-Ni
Evaporating quality (thickness conversion, nm) 3 20 15 15 -
Physical vapor deposition Subtend target type Subtend target type Magnetic control Subtend target type -
Sheet resistance (Ω/) 3×10 7 2×10 2 1×10 3 4×10 5 1×10 6
The lamination number 10 1 3 3 -
Adhesive agent thickness (μ m) 2 - 2 2 -
Electromagnetic wave noise suppresses body gross thickness (μ m) 138 45 79 79 1000
The total evaporating quality of magnet (thickness conversion, nm) 30 20 45 45 -
Proportion 1.3 1.2 1.2 1.2 6.1
Transmission attenuation (dB, mensuration frequency 2GHZ) -7 -8 -15 -18 -6
Reflection loss amount (dB, mensuration frequency 2GHZ) -20 -10 -12 -18 -6
Fracture strength (Mpa) 205 10.5 21 21 2.5
Fracture stretching (Mpa) 149 450 687 687 7
Outward appearance Has equality strength with matrix Thin, the light stretching Approach, gently have flexibility Approach, gently have flexibility Heavy, crisp
Judge ○ ○ ○ ○ ×
In table 1, proportion is the value (when using PET as matrix, band PET measures) in the supporting mass layer is included in.In addition, do not comprise that the supporting mass layer is measured fracture strength and the degree of drawing that ruptures.
As can be seen from Table 1, the electromagnetic wave noise suppression characteristic of the electromagnetic wave noise of embodiment 1～4 and comparative example 1 inhibition body much at one.But it is than heavy that the electromagnetic wave noise of comparative example 1 suppresses body, is 6.1, and crisp, therefore, when being impacted, easily impaired.Relative therewith, the electromagnetic wave noise of embodiment 1 suppresses body, have with as the polyethylene terephthalate of matrix identical intensity and flexibility.The electromagnetic wave noise of embodiment 2 suppresses body, and total thickness is 45 μ m, and light, has degree of drawing and flexibility, and therefore, solidness is good, and processability is good.In addition, it is also thin and light that the electromagnetic wave noise of embodiment 3 suppresses body, has flexibility.In addition, comparing embodiment 3 and embodiment 4 can know, the inclined to one side of the magnet ultramicron of subtend target magnetic control sputtering method is better than common magnetron sputtering method (non-subtend target type) in property.
(evaluation)
With method as described below embodiment 5～7 and comparative example 2～4 are estimated.
Surface observation: the laser microscope VK-9500 with KEYENCE makes, with 4000 times multiplying power, observe the surface.
Sheet resistance: the MCP-T600 with DIAINSTRUMENTS makes, measuring voltage 100V, measure by direct current 4 terminal methods.Illustrate with count 5 mean value of mensuration.
The mensuration of composite bed:, suppress the cross section electron micrograph (50000 times of multiplying powers) of body by electromagnetic wave noise and measure with scanning electron microscopy (SEM) JEM-2100F that NEC is made.
The electromagnetic wave noise suppression characteristic: the nearby electromagnetic wave noise made from KEYCOM suppresses the material determinator, measures S21 (transmission attenuation) and S11 (reflection loss amount) by the S parametric method.As the vector network analyzer 37247C that network analyser uses ANRITSU to make, use TF-3A, the TF-18A of KEYCOM manufacturing as the test position fix device.
[embodiment 5]
At the thickness as the supporting mass layer is that (shear modulus of normal temperature is 3.8 * 10 for the PET film of 12 μ m 9(Pa)) thickness that is provided as matrix on is that (shear modulus of normal temperature is 1 * 10 for silicon (oxygen) rubber of 20 μ m 7(Pa), the carbonic acid gas transmissivity in normal temperature is 2.2 * 10 -7[cm 3(STP) cm/ (cm 2* s * cmHg)], contain wet silicon dioxide), thereon by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 30nm, forms composite bed.At this moment, the temperature of matrix is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.By direct current 4 terminal method exactissima diligentias measured the sheet resistance of composite bed.Be adjusted into desired size, obtaining gross thickness is the electromagnetic wave noise inhibition body of 32 μ m.Observe the surface before and after the sputter, then, the electromagnetic wave noise that obtains with the slicing machine section suppresses the part of body, implements particle beams polishing in the cross section, measures the thickness of composite bed.In addition, measure the electromagnetic wave noise suppression characteristic.
Table 2 shows result's summary.Fig. 4～Fig. 7 shows the surface observation result, and Fig. 3 shows the surface observation result of composite bed, and Figure 21 shows the electromagnetic wave noise suppression characteristic of 0.05～3GHz.In Figure 21, the transmission attenuation when thick line represents to be benchmark (0) with the incident electromagnetic wave amount, fine rule is represented the reflection loss amount.
[embodiment 6]
The thickness that is provided as matrix on the supporting mass layer identical with embodiment 5 is that (shear modulus of normal temperature is 5 * 10 for silicon (oxygen) rubber of 60 μ m 4(Pa), the carbonic acid gas transmissivity in normal temperature is 2 * 10 -7[cm 3(STP) cm/ (cm 2* s * cmHg)]), thereon by inclined to one side (bias) magnetron sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 80nm, forms composite bed, the acquisition gross thickness is that the electromagnetic wave noise of 72 μ m suppresses body.At this moment, the temperature of matrix is remained normal temperature, adjust bias voltage,, carry out sputter so that evaporation particle has the particle energy of 20eV.Then, identical with embodiment 5, the thickness and the electromagnetic wave noise suppression characteristic of mensuration sheet resistance, composite bed.
Table 2 shows result's summary.Figure 22 shows the electromagnetic wave noise suppression characteristic of 0.05～18GHz.In Figure 22, the transmission attenuation when thick line represents to be benchmark (0) with the incident electromagnetic wave amount, fine rule is represented the reflection loss amount.
[embodiment 7]
At the thickness as matrix is that (shear modulus of normal temperature is 1.7 * 10 for the polyacrylonitrile thin slice of 100 μ m 9(Pa), the shear modulus under 160 ℃ is 1.5 * 10 6(Pa), the carbonic acid gas transmissivity in normal temperature is 5.3 * 10 -8[cm 3(STP) cm/ (cm 2* s * cmHg)], the oxygen transmissivity in normal temperature is 2.8 * 10 -15[cm 3(STP) cm/ (cm 2* s * cmHg)]), by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the Ni metal of 60nm thereon, forms composite bed, obtaining gross thickness is the electromagnetic wave noise inhibition body of 100 μ m.At this moment, the temperature of matrix is remained 160 ℃, adjust bias voltage,, carry out sputter so that evaporation particle has the particle energy of 100eV.Then, identical with embodiment 6, the thickness and the electromagnetic wave noise suppression characteristic of mensuration sheet resistance, composite bed.
Table 2 shows result's summary.Figure 23 shows the electromagnetic wave noise suppression characteristic of 0.05～18GHz.In Figure 23, the transmission attenuation when thick line represents to be benchmark (0) with the incident electromagnetic wave amount, fine rule is represented the reflection loss amount.
[comparative example 2]
Ointment is coated on the supporting mass that is used to whitewash operation by the scraper rubbing method forms film, so that its dried thickness is 1.1mm, after its intensive drying, carry out the heating in vacuum press forming again, under 85 ℃ condition, carry out sclerosis in 24 hours, film is peeled off from the supporting mass that is used to whitewash operation, is that the electromagnetic wave noise of 1mm suppresses body thereby obtain thickness.Then, identical with embodiment 6, measure sheet resistance and electromagnetic wave noise suppression characteristic.Wherein, this ointment is that poly-imines fat resin 5 mass parts of adding, isocyanate compound 1 mass parts as curing agent, solvent (1: 1 mixture of cyclohexanone and toluene) 30 mass parts form in soft magnetic metal powder (average particulate diameter is 15 μ m, and length-width ratio is 65) 94 mass parts of the Fe-Ni of the flat with non-conductor film that surface oxidation is formed system.
Table 2 shows result's summary.Figure 24 shows the electromagnetic wave noise suppression characteristic of 0.05～3GHz.In Figure 24, the transmission attenuation when thick line represents to be benchmark (0) with the incident electromagnetic wave amount, fine rule is represented the reflection loss amount.
[comparative example 3]
Except using average particulate diameter is 8 μ m, and length-width ratio is the soft magnetic metal powder of 31 Fe-Ni system, and thickness is become outside the 0.03mm, and other and comparative example are handled equally.Identical with embodiment 6, measure sheet resistance and electromaganic wave absorbing property.
Table 2 shows result's summary.Figure 25 shows the electromagnetic wave noise suppression characteristic of 0.05～18GHz.In Figure 25, the transmission attenuation when thick line represents to be benchmark (0) with the incident electromagnetic wave amount, fine rule is represented the reflection loss amount.
[comparative example 4]
Except carrying out the evaporation with the EB evaporation coating device, other are handled similarly to Example 6.Particle can be 1eV.Do not form composite bed, form the homogeneous membrane of the thick magnet of 80nm (0.08 μ m).
Table 2 shows result's summary.Figure 26 shows the electromagnetic wave noise suppression characteristic of 0.05～3GHz.In Figure 26, the transmission attenuation when thick line represents to be benchmark (0) with the incident electromagnetic wave amount, fine rule is represented the reflection loss amount.
Table 2
Embodiment 5 Embodiment 6 Embodiment 7 Comparative example 2 Comparative example 3 Comparative example 4
The supporting mass layer PET PET Do not have Do not have Do not have PET
Thickness (μ m) 12 12 - - - 12
Matrix Silicone rubber Silicone rubber PAN - - Silicone rubber
Shear modulus during evaporation (Pa) 1×10 7 5×10 4 1.5×10 6 - - 5×10 4
Thickness (μ m) 20 60 100 - - 60
Magnet Fe-Ni Fe-Ni Ni Fe-Ni Fe-Ni Fe-Ni
Evaporating quality (thickness conversion, nm) 30 80 60 - - 80
Particle energy (eV) 8 20 100 - - -
The thickness (μ m) of the composite bed layer of magnet (or contain) 0.04 15.0 1.1 1000 30 0.08
Max transmissive attenuation (dB) -11.9 -30.2 -32.9 -37 -0.8 -12.8
The frequency of max transmissive attenuation (GHz) 3.0 18.0 15.7 2.8 10.5 1.5
The reflection loss amount (dB) of same frequency -8.4 -10.7 -9.1 -9.1 -18.5 -1.0
Sheet resistance (Ω/) 2×10 2 5×10 5 1×10 3 1×10 6 1×10 6 3×10 -2
The max transmissive attenuation (dB/ μ m) of the average thickness of the composite bed layer of magnet (or contain) 298 2.01 29.9 0.037 0.027 160
Judge ○ ○ ○ × × ×
As table 2 and Figure 21～shown in Figure 25, the electromagnetic wave noise suppression characteristic of comparative example 2,3, be transmission attenuation and reflection loss amount tendency much at one, in low-frequency region, the reflection loss amount is big, the transmission attenuation is little.Along with frequency rises, increase the transmission attenuation.
In embodiment 5～7, between magnet amount and the max transmissive attenuation correlation is arranged, the magnet amount is many more, and big more attenuation is shown.The thin thickness of composite bed has transmission attenuation characteristic and the reflection loss characteristic suitable with comparative example 4.
In comparative example 2, the thickness of layer (gross thickness that suppresses body with electromagnetic wave noise is identical) that contains magnet is thick, is 1000 μ m, transmission attenuation suitable with embodiment and reflection loss amount are shown, still, because the ratio of adhesive is few, therefore, when being subjected to impacting, easily impaired.And in low-frequency region, the value of transmission attenuation is little, and compare the band territory with embodiment narrow.
In comparative example 3, though thin thickness, simultaneously absorption characteristic is bad with it, and therefore, the max transmissive attenuation and the comparative example 2 of average thickness of layer that contains magnet is equally little.In addition, the max transmissive attenuation does not reach-10dB, has electromagnetic wave noise in fact hardly and suppresses ability.
In comparative example 4, the particle during owing to evaporation can be little, forms the even metal film on the surface of matrix, as shown in figure 26, demonstrated the behavior similar to metal (characteristic), has the distinctive peak of metal, gives the transmission decay by reflection.It is little that its electromagnetic wave noise suppresses effect, works as electromagnetic wave shielding.
The electromagnetic wave noise of embodiment 5～7 suppresses body, and the thickness of max transmissive attenuation/composite bed is big, and the electromagnetic wave noise suppression characteristic of average thickness is good, and, the residual characteristic that adhesive is arranged, therefore thin, light, have degree of drawing and flexibility.
(evaluation)
With method as described below embodiment 8～10 and comparative example 5～7 are estimated.
Surface observation: the laser microscope VK-9500 with KEYENCE makes, with 4000 times multiplying power, observe the surface.
Sheet resistance: the MCP-T600 with DIAINSTRUMENTS makes, measuring voltage 10V, measure by direct current 4 terminal methods.Illustrate with count 5 mean value of mensuration.
The mensuration of composite bed:, suppress the cross section electron micrograph (50000 times of multiplying powers) of body by electromagnetic wave noise and measure with scanning electron microscopy (SEM) JEM-2100F that NEC is made.
The electromagnetic wave noise suppression characteristic: the nearby electromagnetic wave noise made from KEYCOM suppresses the material determinator, measures S21 (transmission attenuation) and S11 (reflection loss amount) by the S parametric method.As the vector network analyzer 37247C that network analyser uses ANRITSU to make, use the TF-3A of KEYCOM manufacturing as the test position fix device of microwave transmission line with 50 Ω impedances.In addition, the power loss of obtaining 1GHz according to S21 and the S11 of 1GHz.
[embodiment 8]
Be that the thickness that is provided as matrix on the PET film of 12 μ m is that (shear modulus of normal temperature is 1 * 10 for silicon (oxygen) rubber of 20 μ m at thickness as the supporting mass layer 7(Pa), the carbonic acid gas transmissivity in normal temperature is 2.2 * 10 -7[cm 3(STP) cm/ (cm 2* s * cmHg)], contain wet silicon dioxide), thereon by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 30nm, forms composite bed.At this moment, the temperature of matrix is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.By direct current 4 terminal method exactissima diligentias measured the sheet resistance of composite bed.Be adjusted into desired size, obtaining gross thickness is the electromagnetic wave noise inhibition body of 32 μ m.Then, the part of the sample that obtains with slicing machine section is implemented particle beams polishing in the cross section, measure the thickness that electromagnetic wave noise suppresses layer.In addition, measure the electromagnetic wave noise suppression characteristic.
Table 3 shows result's summary.Figure 27 shows the power consumption characteristic of 0.05～3GHz.
[embodiment 9]
The thickness that is provided as matrix on the thickness as the supporting mass layer is the poly-imines film (below, be called PI) of 6 μ m is that (combine and grind chemistry manufacturing, commodity are called 1604N to the acrylic acid series sticker of 25 μ m (below, be called AC), and the shear modulus of normal temperature is 6 * 10 4(Pa), the carbonic acid gas transmissivity in normal temperature is 2 * 10 -8[cm 3(STP) cm/ (cm 2* s * cmHg)]), thereon by inclined to one side (bias) magnetron sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 30nm, forms composite bed, the acquisition gross thickness is that the electromagnetic wave noise of 72 μ m suppresses body.At this moment, the temperature of matrix is remained normal temperature, adjust bias voltage,, carry out sputter so that evaporation particle has the particle energy of 10eV.Then, identical with embodiment 8, the thickness and the electromagnetic wave noise suppression characteristic of mensuration sheet resistance, composite bed.
Table 3 shows result's summary.Figure 28 shows the power consumption characteristic of 0.05～3GHz.
[embodiment 10]
The thickness that is provided as matrix is that (shear modulus of normal temperature is 1.7 * 10 for the PAN thin slice of 70 μ m 9(Pa), the shear modulus under 160 ℃ is 1.5 * 10 6(Pa), the carbonic acid gas transmissivity in normal temperature is 5.3 * 10 -8[cm 3(STP) cm/ (cm 2* s * cmHg)], the oxygen transmissivity in normal temperature is 2.8 * 10 -15[cm 3(STP) cm/ (cm 2* s * cmHg)]), by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the Ni metal of 50nm thereon, obtaining gross thickness is the electromagnetic wave noise inhibition body of 100 μ m.At this moment, the temperature of matrix is remained 160 ℃, adjust bias voltage,, carry out sputter so that evaporation particle has the particle energy of 20eV.Similarly to Example 9, measure the thickness and the electromagnetic wave noise suppression characteristic of sheet resistance, composite bed.
Table 3 shows result's summary.Figure 29 shows the power consumption characteristic of 0.05～3GHz.
[comparative example 5]
Ointment is coated on the supporting mass that is used to whitewash operation by the scraper rubbing method forms film, so that its dried thickness is 0.51mm, after its intensive drying, carry out the heating in vacuum press forming again, under 85 ℃ condition, carry out sclerosis in 24 hours, film is peeled off from the supporting mass that is used to whitewash operation, is that the electromagnetic wave noise of 0.5mm suppresses body thereby obtain thickness.Then, similarly to Example 9, measure sheet resistance and electromagnetic wave noise suppression characteristic.Wherein, this ointment is that poly-imines fat resin 5 mass parts of adding, isocyanate compound 1 mass parts as curing agent, solvent (1: 1 mixture of cyclohexanone and toluene) 30 mass parts form in soft magnetic metal powder (average particulate diameter is 15 μ m, and length-width ratio is 65) 94 mass parts of the Fe-Ni of the flat with non-conductor film that surface oxidation is formed system.
Table 3 shows result's summary.Figure 30 shows the power consumption characteristic of 0.05～3GHz.
[comparative example 6]
Use the high-frequency magnetic control sputtering device,, utilize the Co-Fe-Al target, on the thick glass plate of 0.6mm, make the amorphouse film of 2.5 μ m flowing under the condition of oxygen.Then, apply the magnetic field of 19894A/m (250Oe), be heated to 300 ℃, the plated metal crystallization.
Observe with transmission electron microscope, confirmed that the diameter that has by metallic crystal is the particle of number nm and the nano grain structure that the insulating properties oxide is formed.Similarly to Example 9, measure the thickness of sheet resistance and noncrystalline film, film is used die sinking (section) saw at interval with 2.5mm, and (sword is thick: 0.15mm) cut apart, and carry out insulating, measure the electromagnetic wave noise suppression characteristic.
Table 3 shows result's summary.Figure 31 shows the power consumption characteristic of 0.05～3GHz.
[comparative example 7]
The aqueous solution that to be made up of frerrous chloride (16.6mmol/l), protochloride nickel (15.3mmol/l) and zinc chloride (0.18mmol/l) and the oxidation liquid be made up of sodium nitrate (5mmol/l) and ammonium acetate (65mmol/l) are respectively with 50ml/ minute flow, it at thickness spin spraying on the PI film of 50 μ m, sprayed approximately 15 hours, making nickel-zinc ferrite (ferrite) plated film thick is 15 μ m, afterwards, wash, obtain sample.Use this sample, similarly to Example 9, measure the thickness and the electromagnetic wave noise suppression characteristic of sheet resistance, nickel-zinc ferrite plated film.
Table 3 shows result's summary.Figure 32 shows the power consumption characteristic of 0.05～3GHz.
Table 3
Embodiment 8 Embodiment 9 Embodiment 10 Comparative example 5 Comparative example 6 Comparative example 7
The supporting mass layer PET PI Do not have Do not have Glass PI
Thickness (μ m) 12 6 - - 600 50
Matrix Silicone rubber AC PAN - - -
Shear modulus during evaporation (Pa) 1×10 7 6×10 4 1.5×10 6 - - -
Thickness (μ m) 20 25 70 - - -
Magnet Fe-Ni Fe-Ni Ni Fe-Ni Co-Fe-Al- O Ni-Zn-Fe -O
Evaporating quality (thickness conversion, nm) 30 50 50 - - -
Particle energy (eV) 8 10 20 - - -
The thickness (μ m) of the composite bed layer of magnet (or contain) 0.04 0.06 0.15 500 2.0 15.0
Transmission attenuation (dB at 1GHz) -4.0 -7.8 -12.6 -0.8 -0.9 -1.9
Reflection loss amount (dB at 1GHz) -6.8 -6.8 -4.1 -9.6 -11.2 -11.0
Power consumption value (at 1GHz) 0.39 0.62 0.56 0.064 0.11 0.28
Sheet resistance (Ω/) 2×10 2 4×10 3 2×10 4 1×10 6 2×10 0 7×10 7
Electromagnetic wave noise suppresses body gross thickness (μ m) 32 31 70 500 602 65
The thickness (/ μ m) of the power consumption value/composite bed layer of magnet (or contain) 9.75 10.3 3.73 1.3×10-4 0.055 0.019
Electromagnetic wave noise suppresses effect Well Well Well Insufficient Insufficient Insufficient
Estimate Rubber-like elasticity is shown, flexibility is arranged The surface has adherence, and flexibility shows the characteristic of supporting mass It is strong film Have fragility a little, do not have draftability Hard and easy to crack Amorphous layer ftractures or peels off, and is difficult to operation
Judge ○ ○ ○ × × ×
As shown in table 3, the power consumption value of 1GHz is more than or equal to 0.3 in embodiment 8～10, is less than 0.3 in comparative example 5～7, particularly in comparative example 1 less than 0.1.That is, in an embodiment, actual effect is good, and it is effective that the electromagnetic wave noise in the quasi-microwave wavestrip of 1GHz periphery suppresses.And, in an embodiment, the thickness of composite bed as thin as a wafer, there were significant differences for the power consumption value of the average thickness of composite bed and comparative example, compares with comparative example 5, embodiment is big approximately 4 grades.
In Figure 27～29 of expression embodiment, the power consumption value of 3GHz is all identical, is about 0.8, but in Figure 30 and Figure 31 of expression comparative example, littler than above-mentioned value, be about 0.5.
In addition, along with frequency rises, the rising of power consumption value, in Figure 27 of expression embodiment, the power consumption value of 0.5GHz is about 0.2, and the power consumption value of 1GHz is about 0.6, in Figure 29, the power consumption value of 0.5GHz is about 0.3, and the power consumption value of 1GHz is about 0.6.That is, in the figure of expression embodiment, the rising of the power consumption value till demonstrating before and after the 1GHz totally presents the trend of rapid rising.And in Figure 30 of expression comparative example, the power consumption value of 0.5GHz is about 0.03, and the power consumption value of 1GHz is about 0.1, and in Figure 31, the power consumption value of 0.5GHz is about 0.04, and the power consumption value of 1GHz is about 0.1.In Figure 32, the power consumption value of 0.5GHz is about 0.1, and the power consumption value of 1GHz is about 0.28.That is, in comparative example, the power consumption value till demonstrating before and after the 1GHz totally presents the trend of slow rising.
In addition, in an embodiment, be that the frivolous electromagnetic wave noise with flexibility identical with supporting mass suppresses body, and be that thick and heavy and fragile electromagnetic wave noise suppresses body in comparative example.
(evaluation)
With method as described below embodiment 11～16 and comparative example 8～10 are estimated.
Cross-section: with the transmission electron microscope H9000NAR of Hitachi's manufacturing.
Electromaganic wave absorbing property: the nearby electromagnetic wave noise made from KEYCOM suppresses the material determinator, measures S11 (reflection loss amount) and S21 (transmission attenuation) by the S parametric method.As the vector network analyzer 37247C that network analyser uses ANRITSU to make, adopt the TF-3A of KEYCOM manufacturing as the test position fix device of microstrip line with 50 Ω.In addition, according to the variation of S11 and S21, obtain electromagnetic wave noise with following formula and suppress effect (Ploss/Pin).
Ploss/Pin＝1-(|S11| 2+|S21| 2)
Burning test: adopt testing vertical flammability UL94VTM to implement.The size of sample is that length is that 200mm, width are that 50mm, thickness are 0.1mm, and sample number is 5.Table 4 shows determinating reference.
Table 4
(unit: second) 94VTM-0 94VTM-1 94VTM-2
The residual fire time (t of each sample 1Or t 2) ≤10 ≤30 ≤30
According to the residual fire of respectively organizing of all processing time total (t of 5 samples 1+t 2) ≤50 ≤250 ≤250
Second the residual fire time and residual burning time of each sample after starting to exchange fire added up to (t 2+t 3) ≤30 ≤60 ≤60
Whether sample residual fire or the residual graticule that burns to 125mm Not Not Not
Whether the graticule cotton catches fire owing to flame material or droppings Not Not Be
[embodiment 11]
(shear modulus of normal temperature is 1.7 * 10 with PAN 7(Pa) be dissolved in the N,N-DMAA (below, be called DMAc), modulated the DMAc solution of the PAN of 25 quality %.In these solution 400 mass parts, add aromatic condensation phosphate (salt) (PX-200: big eight chemical industry societies make) 20 mass parts as fire retardant, coating, drying on PET, making dry film thickness is the film of 0.1mm, obtains the PAN thin slice.On the PAN surface of this PAN thin slice, by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 20nm, forms composite bed, and PET is stripped from, and has obtained electromagnetic wave noise and has suppressed body.At this moment, the temperature of PAN thin slice is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.
The electromagnetic wave noise that obtains with slicing machine section suppresses the part of body, implements particle beams polishing in the cross section, observes the cross section of composite bed with the high-resolution transmission electron microscope.The thickness of composite bed is 40nm (0.040 μ m).
In addition, measure the electromagnetic wave noise suppression characteristic of 1GHz, and carry out burning test.Table 5 shows the result.
[embodiment 12]
(presclerotic normal temperature shear modulus is 8.0 * 10 at epoxy resin 6Normal temperature shear modulus after Pa, the sclerosis is 5 * 10 9Pa) in 100 mass parts, interpolation as the glyoxal ethyline of curing agent (four countries change into society and make) 3 mass parts, as the triphen phosphate (salt) of fire retardant (below, be called TPP) (big eight chemical industry societies make) 20 mass parts, aluminium hydroxide (below, be designated as Al (OH) 3) 50 mass parts, magnesium hydroxide (below, be designated as Mg (OH) 2) after 50 mass parts, on PET, be coated with, making thickness is the film of 0.1mm, obtains epoxy resin thin slice (B platform state).On the epoxy resin surface of this epoxy resin thin slice, by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 15nm, forms composite bed.At this moment, the temperature of epoxy resin thin slice is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.Then,, 120 ℃ of heating 2 hours, make epoxy cure again, peel off PET, obtain electromagnetic wave noise and suppress body 40 ℃ of heating 6 hours.
The electromagnetic wave noise that obtains with slicing machine section suppresses the part of body, implements particle beams polishing in the cross section, observes the cross section of composite bed with the high-resolution transmission electron microscope.The thickness of composite bed is 25nm (0.025 μ m).
In addition, measure the electromagnetic wave noise suppression characteristic of 1GHz, and carry out burning test.Table 5 shows the result.
[embodiment 13]
In containing the silicon of wet silicon dioxide (oxygen) rubber (2 liquid type) 100 mass parts, interpolation is as after dinitro diamines (II) 0.2 mass parts of fire retardant, acetylene black 1.0 mass parts, 150 ℃ of sulfurations 1 hour, (the normal temperature shear modulus after the sulfuration was 1.5 * 10 to obtain the thick silicon sheet of 0.1mm 7Pa).On the single face of this silicon sheet, by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 15nm, forms composite bed, obtains electromagnetic wave noise and suppresses body.At this moment, the temperature of silicon sheet is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.
The electromagnetic wave noise that obtains with slicing machine section suppresses the part of body, implements particle beams polishing in the cross section, observes the cross section of composite bed with the high-resolution transmission electron microscope.The thickness of composite bed is 30nm (0.030 μ m).
In addition, measure the electromagnetic wave noise suppression characteristic of 1GHz, and carry out burning test.Table 5 shows the result.
[comparative example 8]
(average particulate diameter is 15 μ m to the soft magnetic metal powder of the Fe-Ni system of the flat of the non-conductor film that forms having surface oxidation, length-width ratio is 65) in 300 mass parts, adding carry out pasteization according to binder solution A 100 mass parts that contain of following method preparation, be coated on the supporting mass that is used to whitewash operation by the scraper rubbing method and form film, so that its dried thickness is 0.1mm, after its intensive drying, carry out the heating in vacuum press forming again, under 85 ℃ condition, carry out sclerosis in 24 hours, film is peeled off from the supporting mass that is used to whitewash operation, suppressed body thereby obtain electromagnetic wave noise.Then, similarly to Example 11, estimate.Table 5 shows the result.
The preparation of solution A: in solvent (1: 1 mixture of cyclohexanone and toluene) 400 mass parts, add polyurethane resin 60 mass parts, as isocyanate compound 20 mass parts of curing agent, as aromatic condensation phosphate (salt) (PX-200: big eight chemical industry societies make) 20 mass parts of fire retardant, prepared solution A.
[comparative example 9]
(average particulate diameter is 15 μ m to the soft magnetic metal powder of the Fe-Ni system of the flat of the non-conductor film that forms having surface oxidation, length-width ratio is 65) in 300 mass parts, add silicon (oxygen) rubber (2 liquid type) 100 mass parts contain wet silicon dioxide, as dinitro diamines platinum (II) 0.2 mass parts, acetylene black 1.0 mass parts of fire retardant, mix with mixing mill, obtain built-up magnet.Prolong this built-up magnet with two roll-ins, making becomes after the thick thin slice of 0.1mm, 150 ℃ of sulfurations 1 hour, obtains electromagnetic wave noise and suppresses body.Similarly to Example 11, estimate.Table 5 shows the result.
Table 5
Figure C20048000201700691
From the result of table 5 as can be seen, the Ploss/Pin of 1GHz is at good numerical value shown in the embodiment 11～13, and it is respond well that electromagnetic wave noise suppresses.Comparative example 8,9 has been owing to only mixed soft magnetic bodies powder and adhesive, and therefore, thickness is 0.1mm and thin the time, the Ploss/Pin of 1GHz is below 0.1, and it is very low that electromagnetic wave noise suppresses effect.In addition, in comparative example 8, the slimming about 0.1mm is difficulty also, does not reach the evaluation criterion of anti-flammability.
About anti-flammability, in embodiment 11～13,, in embodiment 11,12, realize VTM-1 owing in adhesive, add enough fire retardants, realize VTM-0 in the embodiment 13 that uses silicon (oxygen) rubber, the electromagnetic wave noise of embodiment 11～13 suppresses body and has sufficient anti-flammability.On the other hand, in comparative example 9, add the fire retardant identical, but, therefore, do not obtain sufficient anti-flammability owing to having used the soft magnetic bodies powder with embodiment 13.
[embodiment 14]
(presclerotic normal temperature shear modulus is 8.0 * 10 at epoxy resin 6Normal temperature shear modulus after Pa, the sclerosis is 5 * 10 9Pa) in 100 mass parts, after glyoxal ethyline (four countries change into society and make) 3 mass parts of interpolation as curing agent, at thickness is poly-(acyl) imide resin film (KAPTON of 25 μ m, 100EN, TORAY-DUPON society makes) upward coating, making thickness is the film of 15 μ m, obtains the layered product of being made up of the epoxy resin and the flame retardant resin film of B platform state.On the epoxy resin surface of this layered product, by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 10nm, forms composite bed.At this moment, the temperature of epoxy resin thin slice is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.Then,, 120 ℃ of heating 2 hours, make epoxy cure again, obtain electromagnetic wave noise and suppress body 40 ℃ of heating 6 hours.
The electromagnetic wave noise that obtains with slicing machine section suppresses the part of body, implements particle beams polishing in the cross section, observes the cross section of composite bed with the high-resolution transmission electron microscope.The thickness of composite bed is 25nm (0.025 μ m).
In addition, measure the electromagnetic wave noise suppression characteristic of 1GHz, and carry out burning test.Table 6 shows the result.
[embodiment 15]
(the normal temperature shear modulus after the sulfuration is 1.5 * 10 will to contain silicon (oxygen) rubber (2 liquid type) of wet silicon dioxide 7Pa), be that the polyethersulfone resin film (SUMITOMO BAKELITE society makes for SUMILITE, FS-13000) of 25 μ m is gone up the extruding lamination at thickness, making its thickness is 20 μ m, 150 ℃ of sulfurations 1 hour, obtains layered product.On the silicon face of this layered product, by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 15nm, forms composite bed, obtains electromagnetic wave noise and suppresses body.At this moment, the temperature of silicon sheet is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.
The electromagnetic wave noise that obtains with slicing machine section suppresses the part of body, implements particle beams polishing in the cross section, observes the cross section of composite bed with the high-resolution transmission electron microscope.The thickness of composite bed is 30nm (0.030 μ m).
In addition, measure the electromagnetic wave noise suppression characteristic of 1GHz, and carry out burning test.Table 6 shows the result.
[embodiment 16]
(the normal temperature shear modulus is 1.7 * 10 with PAN 7Pa) be dissolved among the DMAc, prepared the DMAc solution of the PAN of 25 quality %.This solution is coated on the thick fluorine resin film of 50 μ m (Asahi Glass society makes for AFLEX, 50N-NT) with metering bar coater, and the thickness of making dry PAN is the film of 10 μ m, obtains layered product.On the pan surface of this layered product, by subtend target magnetic control sputtering method, physical vapor deposition conversion thickness is the soft magnetic metal of the Fe-Ni system of 20nm, forms composite bed, obtains electromagnetic wave noise and suppresses body.At this moment, the temperature of PAN thin slice is remained normal temperature, apply negative voltage a little,, carry out sputter so that evaporation particle has the particle energy of 8eV.
The electromagnetic wave noise that obtains with slicing machine section suppresses the part of body, implements particle beams polishing in the cross section, observes the cross section of composite bed with the high-resolution transmission electron microscope.The thickness of composite bed is 30nm (0.030 μ m).
In addition, measure the electromagnetic wave noise suppression characteristic of 1GHz, and carry out burning test.Table 6 shows the result.
[comparative example 10]
(average particulate diameter is 15 μ m to the soft magnetic metal powder of the Fe-Ni system of the flat of the non-conductor film that forms having surface oxidation, length-width ratio is 65) in 300 mass parts, add silicon (oxygen) rubber (2 liquid type) 100 mass parts that contain wet silicon dioxide, mix with mixing mill, obtain built-up magnet.At thickness is that poly-(acyl) imide resin film (TORAY-DUPON society makes for KAPTON, 100EN) of 25 μ m is gone up the extruding lamination, and the thickness that makes the built-up magnet layer is 20 μ m, 150 ℃ of sulfurations 1 hour, obtains electromagnetic wave noise and suppresses body.Similarly to Example 14, estimate.Table 6 shows the result.
Table 6
Embodiment 14 Embodiment 15 Embodiment 16 Comparative example 10
Adhesive Epoxy resin Silicon (oxygen) rubber PAN Silicon (oxygen) rubber
Flame retardant resin Poly-(acyl) imide resin Polyethersulfone resin Fluororesin Poly-(acyl) imide resin
The thickness of flame retardant resin layer (μ m) 25 25 50 25
(thickness converts the magnet amount, nm) 10 15 20 -
The thickness of composite bed (μ m) 0.025 0.030 0.030 -
Reflection loss amount (S11) (at 1GHz) -6.0 -8.2 -7.0 -9.5
Transmission attenuation (S21) (at 1GHz) -7.4 -7.9 -6.1 -0.9
Ploss/Pin(at 1GHz) 0.57 0.69 0.56 0.07
t 1Or t 2(second) 2～4 8～14 2～5 15～24
The t of 5 samples 1+t 2(second) 40 106 34 198
t 2+t 3(second) 2～6 11～23 0～4 24～42
Whether sample the residual graticule that burns to 125mm of residual fire Not Not Not Not
Whether the graticule cotton catches fire owing to flame material or droppings Not Not Not Not
UL94 judges VTM-0 VTM-1 VTM-0 VTM-1
Comprehensively ◎ ○ ◎ ×
From the result of table 6 as can be seen, the Ploss/Pin of 1GHz is at good numerical value shown in the embodiment 14～16, and it is respond well that electromagnetic wave noise suppresses.Comparative example 10 has been owing to only mixed soft magnetic bodies powder and adhesive, and therefore, thickness is 100 μ m and thin the time, the Ploss/Pin of 1GHz is below 0.1, and it is very low that electromagnetic wave noise suppresses effect.
About anti-flammability, in embodiment 14～16, owing to used resin material with good flame-retarding characteristic, therefore, realize VTM-0 in embodiment 14,16, realize VTM-1 in embodiment 15, the electromagnetic wave noise of embodiment 14～16 suppresses body and has sufficient anti-flammability.In comparative example 10, owing to used flame retardant resin, and realized VTM-1,, but do not had electromagnetic wave noise to suppress effect although the built-up magnet layer of 100 μ m thickness is arranged, and, because it is use the magnet powder of volume, therefore heavy and lack flexibility.(in the table, in the item of " comprehensively ", ◎ represents that electromagnetic wave noise suppresses the effect height, and anti-flammability realizes VTM-0; Zero expression electromagnetic wave noise suppresses the effect height, and anti-flammability realizes VTM-1; * expression electromagnetic wave noise inhibition effect and/or anti-flammability are low.)
In embodiment 17～20, comparative example 11 and comparative example 12, basis material is used as sample, be benchmark with JIS K 6254, in normal temperature, measure the shear modulus of matrix.
[embodiment 17]
Make electromagnetic wave noise shown in Figure 8 according to condition as described below and suppress body.
(being dispersed with the matrix of electroconductive stuffing and dielectric medium powder)
Preparation disperse to be added by average particulate diameter and is the dielectric medium powder 15vol% that forms of the barium titanate of 1 μ m and is silicon (oxygen) rubber of the electroconductive stuffing 30vol% that forms of the phosphorus flake silver powder of 3.5 μ m by average particulate diameter that (shear modulus of normal temperature is 8.3 * 10 as basis material with it 8(Pa), the carbonic acid gas transmissivity of normal temperature is 2.1 * 10 -7[cm 3(STP)/(cm 2* sec * cmHg)], contain wet silicon dioxide).
At the thickness that becomes the supporting mass layer is that (shear modulus of normal temperature is 3.8 * 10 for the PET film of 12 μ m 9Pa) on, the basis material that coating obtains above is provided with the matrix that thickness is 10 μ m.
(composite bed)
On above-mentioned matrix surface, sputter conversion thickness is the soft magnetic metal of the Fe-Ni system of 20nm, forms composite bed, obtains electromagnetic wave noise and suppresses body.Sputter is undertaken by subtend target magnetic control sputtering method, and substrate temperature is remained normal temperature, applies bias voltage a little, so that have the particle energy of 8eV.
Having measured the sheet resistance that the electromagnetic wave noise that obtains suppresses body by direct current 4 terminal methods, is 2 * 10 2Ω/, the gross thickness that electromagnetic wave noise suppresses body is 19 μ m.
[embodiment 18]
Make electromagnetic wave noise shown in Figure 13 according to condition as described below and suppress body.
(conductor layer)
At the thickness as tread support membrane is on the PI film of 9 μ m, by subtend target magnetic control sputtering method physical vapor deposition thickness is the Ag metal of 45nm and the Ni metal that thickness is 80nm, form metal level, the manufacturing sheet resistance is the conductor layer of 0.2 Ω/ (4 terminal method).
(matrix)
Then, on the metal film forming face of this conductor layer coating (shear modulus of normal temperature is 6.5 * 10 except not containing the electroconductive stuffing matrix material grain identical with embodiment 17 7Pa, the carbonic acid gas transmissivity of normal temperature is 2.3 * 10 -7[cm 3(STP)/(cm 2* sec * cmHg)], contain wet silicon dioxide), forming thickness is the matrix of 10 μ m.
(composite bed)
On above-mentioned matrix surface, will be the kicker magnet that the Ni metal of 50nm is formed by the conversion thickness, carry out sputter by subtend target magnetic control sputtering method, apply bias voltage, so that have the particle energy of 100eV, obtaining sheet resistance is 6 * 10 3Ω/, gross thickness are that the electromagnetic wave noise of 19.125 μ m suppresses body.
[embodiment 19]
(shear modulus of normal temperature is 1.2 * 10 to silicon (oxygen) rubber that adds except the dispersion of electroconductive stuffing and dielectric medium powder with the basis material of embodiment 17 7(Pa), the carbonic acid gas transmissivity of normal temperature is 2.2 * 10 -7[cm 3(STP)/(cm 2* sec * cmHg)], contain wet silicon dioxide) form matrix, obtain other electromagnetic wave noises similarly to Example 18 and suppress body.
[embodiment 20]
(conductor layer)
Tread support membrane is not set, will be as the SUS net (line footpath 0.05mm φ, mesh 0.104mm, voidage 43.9%) of plain weave 165 meshes of metal wire entangled object as conductor layer.
(matrix)
Then, on the metal wire entangled object of this conductor layer, use the basis material identical that the thick matrix of 10 μ m is set with embodiment 18.
(composite bed)
Carry out the sputter identical with embodiment 18 on above-mentioned matrix surface, the electromagnetic wave noise that obtains gross thickness and be 110 μ m suppresses body.
[comparative example 11]
Poly-imines fat resin 5 mass parts of adding, isocyanate compound 1 mass parts as curing agent, solvent (1: 1 mixture of cyclohexanone and toluene) 30 mass parts form ointment in soft magnetic metal powder (average particulate diameter is 15 μ m, and length-width ratio is 65) 94 mass parts of the Fe-Ni of the flat with non-conductor film that surface oxidation is formed system.This ointment is gone up the formation resin bed by the SUS net (line footpath 0.05mm φ, mesh 0.104mm, voidage 43.9%) that the scraper rubbing method is coated on as plain weave 165 meshes of metal wire entangled object, so that its dried thickness is 510 μ m, intensive drying.Carry out vacuum press again, carry out sclerosis in 24 hours under 85 ℃ condition, the thickness that obtains resin bed is that 500 μ m, gross thickness are the electromagnetic wave noise inhibition body of 1120 μ m.
[comparative example 12]
As metal forming, be that the Copper Foil of 100 μ m is directly used in the evaluation described later with thickness.
(evaluation)
With method as described below embodiment 17～20 and comparative example 11,12 are estimated.
Cross-section: with the transmission electron microscope H9000NAR of Hitachi's manufacturing.
Electromaganic wave absorbing property: the nearby electromagnetic wave noise made from KEYCOM suppresses the material determinator, measures S11 (reflection loss amount) and S21 (transmission attenuation) by microstrip line (MSL) method.And, estimated its power loss value.
At this, the power loss value is the overall target of the reflection and transmission characteristic of electromagnetic wave noise suppressing function, obtains with following formula, gets 0～1 value.As shown in figure 33, the variation of transmission characteristic S11 and S21 is investigated, obtained the power loss value according to following formula.
Power loss value (Ploss/Pin)=1-(| Г | 2+ | T| 2)
S11＝20log|Г|
S21＝20log|T|
As the vector network analyzer 37247C that network analyser uses ANRITSU to make, adopt the TF-3A of KEYCOM manufacturing as the test position fix device of microstrip line with 50 Ω.
Electromagnetic radiation noise characteristic: little ring of the φ 2mm (2mm diameter) that makes with KEYCOM, nearby use electromagnetic wave reflecting background characteristic by little loop antenna method mensuration, and the frequency spectrum analyser R3132 that makes with ADVANTEST society measures the inner decoupling rate and the rate that intercouples.
Table 7 shows result's summary, Figure 31 to Figure 42 shows by microstrip line (MSL) method and measures conducted noise characteristic (S11, S21) and power loss characteristic, and Figure 43 and Figure 44 show the attenuation characteristic (inner decoupling level and mutual decoupling level) of the radiation noise of measuring by little loop antenna method.
Table 7
Embodiment 17 Embodiment 18 Embodiment 19 Embodiment 20 Comparative example 11 Comparative example 12
Supporting mass layer or support membrane PET PI PI Do not have Do not have -
Thickness (μ m) 12 9 9 - - -
Matrix Silicon (oxygen) rubber Silicon (oxygen) rubber Silicon (oxygen) rubber Silicon (oxygen) rubber Polyurethane resin -
Electroconductive stuffing (particle diameter, μ m) Ag powder (3.5) - - - - -
Dielectric medium powder (particle diameter, μ m) Barium titanate (1.0) Barium titanate (1.0) - Barium titanate (1.0) - -
Shear modulus (Pa) 8.3×10 8 6.5×10 7 1.2×10 7 6.5×10 7 - -
Thickness (μ m) 10 10 10 10 500 -
Magnet Fe-Ni Ni Ni Ni Fe-Ni is the flat metal powder -
Magnet amount (thickness conversion, nm) 30 50 50 50 - -
The physical vapor deposition method Subtend target evaporation Subtend target evaporation Subtend target evaporation Subtend target evaporation - -
Sheet resistance (Ω/) 2×10 2 1.5×10 3 1.5×10 3 1.5×10 3 - -
The thickness of composite bed (μ m) About 0.05 About 0.1 About 0.1 About 0.1 - -
Dielectric layer Do not have Ag+Ni Ag+Ni 165 mesh SUS nets 165 mesh SUS nets The Cu paper tinsel
Thickness (μ m) - 0.125 0.125 100 100 100
The formation method - Evaporation on support membrane Evaporation on support membrane - - -
Intrinsic resistance value (Ω-cm) 300 * 0.07 0.07 (1.2) (1.2) 2×10- 6
Electromagnetic wave noise suppresses the thickness (μ m) of body 22 19.125 19.125 110 600 100
Proportion 2.5 1.3 1.3 2.1 3.3 8.9
Flexibility Rubber-like elasticity is shown, and flexibility is good The flexibility of support membrane is shown The flexibility of support membrane is shown The flexibility of metal fabric is shown Thick, heavy, hard, rapid wear ring Metal forming
MSL(S11)dB(at 1GHz) -7.07 -6.38 -6.38 -7.37 -7.93 -
MSL(S21)dB(at 1GHz) -5.29 -3.93 -4.53 -4.69 -2.29 -
Power loss value (at 1GHz) 0.45 0.6 0.55 0.48 0.23 -
Nearby conducted noise suppresses effect ○ ○ ○ ○ × -
Little ring (inner decoupling rate) (dB at 0.8GHz) -5.3 -3.0 -3.5 -6.5 -6.9 +3.5
Little ring (rate intercouples) (dB at 0.8GHz) -15.9 -26.5 -24.1 -16.7 -14.6 -36.6
Nearby radiate noise suppression effect ○ ○ ○ ○ ○ -
(*: the intrinsic resistance value of expression matrix.)
The electromagnetic wave noise of embodiment 17～20 suppresses body and has the part of matrix and the composite bed of magnet integration, and by microstrip collimation method evaluation conducted noise, particularly transmission attenuation is-3.93～-5.29dB (at 1GHz), have big attenuation characteristic.For the power loss value, brought into play the performance of (at 1GHz) more than 0.45.In the structure of comparative example 11, even contracting, functional layer needs thickness about 500 μ m, and the transmission attenuation be-2.29 (at 1GHz), and in contrast to this, the electromagnetic wave noise of embodiment suppresses body and approaches and present king-sized decay.
In addition, by little loop antenna method evaluation radiation noise, in the metal forming of comparative example 12, use the inner couplings level, encouraged by antenna or covibration radiation noise, demonstrate the value of positive side, and suppress in the body at the electromagnetic wave noise of embodiments of the invention 17～20, for-3.0～-6.5dB (at 0.8GHz), illustrate and brought into play inhibit feature.
As mentioned above, the electromagnetic wave noise of embodiment 17～20 suppresses body, when having the screening effect as electro-magnetic screen function, also has the function that suppresses electromagnetic conducted noise nearby and radiation noise.
In addition, electromagnetic wave noise of the present invention suppresses body, can be installed in the inside of electronic equipment, or direct wiring substrate (substrate) surface that is configured in electronic installation or the electronic equipment that covers, has flexibility, when being inserted between the wiring substrate, also can suppress increaseization by the electromagnetic coupled of radiation or reflection when carrying out slimming.
Application possibility on the industry
Electromagnetic wave noise of the present invention suppresses body and can cover on electronic equipment, the electronic installation etc., is all bringing into play good electromagnetic wave noise inhibition, the miniaturization that can realize electronic equipment, electronic installation, lightweight in the quasi-microwave wave band.

Claims (41)

1. an electromagnetic wave noise suppresses body, it is characterized in that having:
Matrix, it contains adhesive; And
Composite bed, by under particle can be for the condition of 5～1000eV, the magnet physical vapor deposition being formed to described matrix surface, have and make described magnet be dispersed in the part adhesive of described matrix with nanoscale or state of atom and form incorporate heterostructure
The electromagnetic wave max transmissive attenuation of the average thickness of described composite bed is-0.5～-500dB/ μ m.
2. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that, and the maximum reflection attenuation of the frequency of expression electromagnetic wave max transmissive attenuation is-10～-50dB.
3. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that, and the maximum reflection attenuation of the frequency of expression electromagnetic wave max transmissive attenuation is-6～-50dB.
4. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that the power loss value of 1GHz is 0.3～0.65.
5. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that the thickness of described composite bed is 0.005～20 μ m.
6. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that the thickness of described composite bed is 0.005～3 μ m.
7. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that the thickness of described composite bed is 0.005～1 μ m.
8. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that the thickness of described composite bed is 0.005～0.3 μ m.
9. an electromagnetic wave noise suppresses body, it is characterized in that, a plurality of electromagnetic wave noises according to claim 1 of lamination suppress body.
10. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that described adhesive is resin or rubber.
11. electromagnetic wave noise according to claim 10 suppresses body, it is characterized in that proportion is 0.9～1.5.
12. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that described adhesive is a hardening resin.
13. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that the shear modulus of described adhesive is 1 * 10 4～1 * 10 10Pa.
14. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that the shear modulus of described adhesive is 1 * 10 4～5 * 10 7Pa.
15. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that having the heat conduction layer that contains the heat conductivity filler.
16. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that having the supporting mass layer.
17. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that, described matrix contains non-halogen system and is the fire retardant that non-antimony is.
18. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that having the flame retardant resin layer.
19. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that described matrix contains electroconductive stuffing.
20. electromagnetic wave noise according to claim 19 suppresses body, it is characterized in that, described electroconductive stuffing is at least a conductive powders that is selected from metal dust, metallic fiber, metal covering particulate, carbon particulate and the carbon sodium rice fibre pipe.
21. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that having conductor layer.
22. electromagnetic wave noise according to claim 21 suppresses body, it is characterized in that described conductive layer is to be selected from least a in metal forming, metal fiber cloth, conductive fibre fabric, metal wire entangled object, conductive fiber entangled object, the organic polymer layer that is dispersed with electroconductive stuffing and the conductive film.
23. electromagnetic wave noise according to claim 22 suppresses body, it is characterized in that, described conductive film is that the metal level of 5～500nm constitutes by tread support membrane and the physical vapor deposition metal forms on this tread support membrane thickness.
24. electromagnetic wave noise according to claim 23 suppresses body, it is characterized in that, described metal level forms by subtend target magnetic control sputtering method.
25. electromagnetic wave noise according to claim 1 suppresses body, it is characterized in that described matrix contains dielectric medium powder.
26. electromagnetic wave noise according to claim 25 suppresses body, it is characterized in that, described dielectric medium powder is to be selected from least a in barium titanate ceramics, zirconium titanate system ceramics and the plumbous perovskite series ceramic.
27. an electromagnetic wave noise suppresses the manufacture method of body, it is characterized in that, comprise the evaporation step, under particle can be for the condition of 5～1000eV with the magnet physical vapor deposition to the matrix surface that contains adhesive, have the composite bed that makes described magnet be dispersed in the part adhesive of described matrix with nanoscale or state of atom and form incorporate heterostructure thereby on described matrix surface, form.
28. electromagnetic wave noise according to claim 27 suppresses the manufacture method of body, it is characterized in that, by subtend target magnetic control sputtering method with the magnet physical vapor deposition to the matrix surface that contains adhesive.
29. electromagnetic wave noise according to claim 27 suppresses the manufacture method of body, it is characterized in that the evaporating quality of magnet is expressed as 0.5～200nm with the thickness scaled value of magnet Dan Pin.
30. an electromagnetic wave noise suppresses the manufacture method of body, it is characterized in that having:
The layered product manufacturing step is containing on the matrix of adhesive other layers of lamination to make layered product; And
The evaporation step, under particle can be for the condition of 5～1000eV with the magnet physical vapor deposition to matrix surface, have the composite bed that makes described magnet be dispersed in the part adhesive of described matrix with nanoscale or state of atom and form incorporate heterostructure thereby on described matrix surface, form.
31. the article with electromagnetic wave noise suppressing function is characterized in that, at least a portion of article surface suppresses body by the described electromagnetic wave noise of claim 1 and is covered.
32. the article with electromagnetic wave noise suppressing function according to claim 31 is characterized in that described article are electronic installations.
33. the article with electromagnetic wave noise suppressing function according to claim 31 is characterized in that, described article are printed circuit board (PCB)s that electronic installation is installed.
34. the article with electromagnetic wave noise suppressing function according to claim 33 is characterized in that described printed circuit board (PCB) is a flexible print wiring board.
35. the article with electromagnetic wave noise suppressing function according to claim 31 is characterized in that described article are electric connectors.
36. the article with electromagnetic wave noise suppressing function according to claim 35 is characterized in that described electric connector is a flexible connector.
37. the article with electromagnetic wave noise suppressing function according to claim 31 is characterized in that described article are flat cables.
38. the article with electromagnetic wave noise suppressing function according to claim 31 is characterized in that, described article are push-button switch key head parts.
39. the article with electromagnetic wave noise suppressing function according to claim 31 is characterized in that, described article are that initial processing is with inserting thin slice.
40. the article with electromagnetic wave noise suppressing function according to claim 31 is characterized in that described article are semiconductor integrated circuit.
41. a manufacturing has the method for the article of electromagnetic wave noise suppressing function, it is characterized in that, has:
Covering step with at least a portion of adhesive coverage article surface; And
The evaporation step, under particle can be for the condition of 5～1000eV with the magnet physical vapor deposition to matrix surface, have the composite bed that makes described magnet be dispersed in the part adhesive of described matrix with nanoscale or state of atom and form incorporate heterostructure thereby on described matrix surface, form.
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Publication number Priority date Publication date Assignee Title
CN107710353A (en) * 2015-07-10 2018-02-16 株式会社东金 Anti-flammability composite magnetic body

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05183285A (en) * 1991-05-29 1993-07-23 Toyama Parts:Kk Electromagnetically shielded cabinet
JPH09115708A (en) * 1995-10-16 1997-05-02 Nippon Telegr & Teleph Corp <Ntt> Electromagnetic wave absorbing material and package
CN1277798A (en) * 1997-10-31 2000-12-20 美商纳克公司 Electromagnetic shielding
JP2001308574A (en) * 2000-04-25 2001-11-02 Tokin Corp Esd suppressing sheet
CN1327599A (en) * 1999-10-18 2001-12-19 株式会社东金 Composition magnetic body andelectromagnetic interference suppressing body using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05183285A (en) * 1991-05-29 1993-07-23 Toyama Parts:Kk Electromagnetically shielded cabinet
JPH09115708A (en) * 1995-10-16 1997-05-02 Nippon Telegr & Teleph Corp <Ntt> Electromagnetic wave absorbing material and package
CN1277798A (en) * 1997-10-31 2000-12-20 美商纳克公司 Electromagnetic shielding
CN1327599A (en) * 1999-10-18 2001-12-19 株式会社东金 Composition magnetic body andelectromagnetic interference suppressing body using the same
JP2001308574A (en) * 2000-04-25 2001-11-02 Tokin Corp Esd suppressing sheet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107710353A (en) * 2015-07-10 2018-02-16 株式会社东金 Anti-flammability composite magnetic body
CN107710353B (en) * 2015-07-10 2019-11-01 株式会社东金 Anti-flammability composite magnetic body

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