Electric connector of planar grid array
[technical field]
The invention relates to a kind of electric connector of planar grid array, refer to especially a kind ofly have insulating body, frame and be located at the framework of insulating body week side, movably be hubbed at the gland of framework one end and the electric connector of planar grid array that is installed on the driving lever of the framework other end.
[background technology]
Electric connector of planar grid array is widely used in electronic applications, and it adopts the mode of pushing to realize the electric connection of adjacent elements.Fig. 5 and Fig. 6 have disclosed a kind of existing electric connector 6, and it comprises that an insulating body 61, frame be located at the framework 62 of insulating body 61 all sides, rotation and be articulated in the gland 63 of framework 62 1 ends and be articulated in framework 62 other ends and gland 63 can be pressed on driving lever 64 on the insulating body 61.Wherein framework 62 comprises a diapire 621 and from diapire 621 four sidewalls 622 of bending upwards, gland 63 is provided with a leading section 631, extends to form an auxiliary section 6310 under this leading section 631 is oblique.Above-mentioned gland 63 and driving lever 64 are articulated in respectively on wherein two opposing sidewalls 622, and above-mentioned insulating body 61 is installed on the framework 62, and leaves the gap between the respective side walls 622 of its each side and framework, and the front end of insulating base 61 is provided with boss 610.Gland 63 is empty frame shape in the square substantially, and it comprises the main board 630 of a hollow and the side plate 632 that extends from 630 liang of side direction insulating bodies of this main board 61.Driving lever 64 comprises the driving lever 642 that a drive rod 641 reaches perpendicular to drive rod 641, and wherein driving lever 642 can be by the auxiliary section 6310 that is pressed in gland 63, so that wafer module 7 and insulating body 61 are fixed between framework 62 and the gland 63.
During use, at first gland 63 is rotated to the enable possition, wafer module 7 is installed on the insulating body 61, close gland 63 then to horizontal level, this moment, the side plate 632 of gland 63 entered respectively among the corresponding gap between the side of frame side wall 622 and insulating body 61, stir the drive rod 641 of driving lever 64 at last, its driving lever 642 is rotated thereupon and the auxiliary section 6310 that is pressed on gland 63 so that wafer module 7 is retained between gland 63 and the insulating base 61.
In the above-mentioned use, before depression bar 642 malcompression auxiliary sections 6310, gland 63 (is reference direction with accompanying drawing drawing direction, as follows) easily all around direction play causes wafer module 7 location bad.And gland 63 presses on wafer module 7 fully, is easy to cause wafer module 7 to tilt when depression bar 642 is crossed commentaries on classics, even damages wafer module 7 by pressure.Change the problem that may cause wafer module 7 to tilt for above-mentioned the mistake because of depression bar 642, a kind of possible settling mode is exactly to set up boss 610 at the front end of insulating base 61, when depression bar 642 is crossed commentaries on classics, the lower surface that this boss 610 withstands gland leading section 631 tilts because of overvoltage to avoid wafer module 7, but this kind mode is easy to cause insulating base 61 warpages again, thereby influence is contained in the flatness of the conducting terminal in the insulating base 61, and finally causes the good electric connection between 7 groups of wafer dies and the electric connector 6.
In view of the above problems, be necessary to be provided with a kind of wafer module that can guarantee and accurately locate and when gland compresses the wafer module, can not cause the novel electric connector of insulating base warpage.
[summary of the invention]
The purpose of this invention is to provide a kind of wafer module that can guarantee and accurately locate and when gland compresses the wafer module, can not cause the novel electric connector of insulating base warpage.
The object of the present invention is achieved like this: a kind of electric connector of planar grid array, in order to electrically connect wafer module and circuit board, it comprises that an insulating body, frame be located at the framework of insulating body week side, movably be articulated in the gland of framework one end and the driving lever that is articulated in the framework other end, framework comprises that a diapire reaches from the upwardly extending sidewall of this diapire, gland comprises a main board and the side plate that extends to the insulating base direction respectively from the relative both sides of this main board, and the both sides of this side plate are provided with hypotenuse.Framework and the corresponding position of above-mentioned side plate are provided with slit, and the size of this slit and side plate size adapt, and when gland was in the close position, the side plate of gland entered in the slit of framework, and this slit can limit gland and reach the left and right directions play up and down with respect to framework.
Compared with prior art, advantage of the present invention is: when electric connector was in the close position, the side plate of gland entered in the slit of framework, thereby the restriction gland guarantees the accurate positioning of wafer module with respect to the framework play.When depression bar is crossed commentaries on classics, corresponding two inboards of slit will be withstood in two outsides of side plate, thereby avoid gland excessively to push the wafer module, or cause the insulating base warpage because of pushing this boss when being provided with boss on insulating base.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of electric connector of planar grid array of the present invention.
Fig. 2 is an electric connector of planar grid array gland of the present invention three-dimensional combination figure when opening.
Fig. 3 is the three-dimensional combination figure after the gland of electric connector of planar grid array of the present invention is closed.
Fig. 4 is the three-dimensional combination figure of another angle after the gland of electric connector of planar grid array of the present invention is closed.
Fig. 5 is the three-dimensional exploded view of existing electric connector of planar grid array related to the present invention.
Fig. 6 is the three-dimensional combination figure of electric connector of planar grid array shown in Figure 5.
[embodiment]
See also Fig. 1 to Fig. 4, electric connector of planar grid array 1 of the present invention is to be used to electrically connect wafer module (not shown) and circuit board (not shown), and it mainly includes insulating body 2, frame and is located at framework 3, the rotation of insulating body 2 all sides and is articulated in the gland 4 on the framework 3 and is articulated in framework 3 other ends and gland 4 can be pressed on driving lever 5 on the insulating body 2.
Insulating body 2 is a square structure, is equipped with plurality of conductive terminals (not indicating) in it to electrically connect wafer module and circuit board.Framework 3 comprises the diapire 31 of a hollow and upwards bends the sidewall 32 that extends from diapire 31 that above-mentioned diapire 31 and sidewall 32 surround the space of accommodating insulating body 2 jointly.Above-mentioned gland 4 and driving lever 5 movably are articulated in respectively on wherein two opposing sidewalls 32.Insulating body 2 is installed in the framework 3, and framework 3 two sidewalls 32 that gland 4 and 5 are not installed and insulating body 2 corresponding sides leave the gap between becoming.Be provided with a slit 34 at the diapire 31 of framework 3 and the junction of respective side walls 32.
Gland 4 is the square plate columnar structure of a hollow, and it comprises the side plate 42 that the relative two side direction insulating bases 2 of a main board 41 and autonomous agent plate 41 extend, and described side plate 42 is roughly square, and the both sides of this side plate 42 are provided with hypotenuse.The length of the lower end of side plate 42 end of main board 41 (promptly away from) is slightly less than slit 34 length of framework 3, makes side plate 42 can relatively easily import slit 34.The oblique extension down of one end of main board 41 is formed with an auxiliary section 44, and its relative other end is provided with hook portion 43, is provided with a positioning strip 46 between hook portion 43.Be formed with the pressure section 410 that slightly bends at the middle part of main board 41, so that push the wafer module to insulating body 2 directions.Above-mentioned gland 4 is installed in an end of framework 3 by hook portion 43 rotations.
Driving lever 5 comprises the driving lever 52 that a drive rod 51 reaches perpendicular to drive rod 51, and driving lever 52 comprises a force section 520 to a lateral buckling, and this force section 520 can and be pressed on the auxiliary section 44 of gland 4 along with driving lever 52 rotations, thereby clamps fixing wafer module.
During assembling electric connector 1, at first insulating body 2 is installed in the diapire 31 of framework 3 and the space that sidewall 32 is surrounded, then gland 4 and driving lever 5 are rotated the opposite end that is connected to framework 3 respectively, leave the gap between the corresponding side of two sidewalls 32 that this moment, framework 3 was not installed gland 4 and 5 and insulating body 2.
During work, at first gland 4 is rotated to the enable possition, the wafer dies assembling is located in the insulating body 2, rotate gland 4, make it rotate to make position, this moment, the pressure section 410 of gland 4 was pressed on the wafer module, and during biside plate 42 end portions enter in the slit established in diapire 31 places of framework 3 34 respectively, stir the drive rod 51 of driving lever 5 at last, its driving lever 52 is rotated thereupon and the wafer module is retained between gland 4 and the insulating base 2 by force section 520.Because side plate 42 is provided with hypotenuse, during pressurized, the hypotenuse of this side plate 42 matches with slit 34 and can help gland 4 location.
Because the sidewall 32 of framework 3 is provided with slit 34 with the junction of diapire 31, when gland 4 is in the close position, the end portion of its side plate 42 can enter in this slit 34, thereby just can limit gland 4 with respect to framework 3 plaies before gland 4 pressurizeds, guarantees the accurate positioning of wafer module.When depression bar 5 is crossed commentaries on classics, the respective sides of slit 34 will be withstood in the both sides of side plate 42, thereby the pressure transfer that produces when depression bar 5 is changeed excessively is to the diapire 31 of framework 3, but not directly act on the insulating base 2 of wafer module or electric connector 1, cause the wafer module to tilt or damage and influence electric connection performance between electric connector 1 and wafer module thereby avoid gland 4 excessively to push the wafer module.