CN100370633C - Method for preparing photon crystal in LED and apparatus thereof - Google Patents
Method for preparing photon crystal in LED and apparatus thereof Download PDFInfo
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- CN100370633C CN100370633C CNB2005100784382A CN200510078438A CN100370633C CN 100370633 C CN100370633 C CN 100370633C CN B2005100784382 A CNB2005100784382 A CN B2005100784382A CN 200510078438 A CN200510078438 A CN 200510078438A CN 100370633 C CN100370633 C CN 100370633C
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Abstract
The present invention relates to a method for making a photonic crystal in a light emitting diode and a device thereof, particularly to a light emitting diode, which provides a method for making a masking layer of the photonic crystal by a holographic method with low cost and high speed and a device thereof. The device is provided with a laser device, a beam expanding filter is arranged on the output optical axis of the laser device, a collimating lens is arranged on the output optical axis of the beam expanding filter, a diffraction optical element is provided with three identical transmission gratings and is arranged on the parallel beam of the collimating lens, and a photoetching adhesive layer is coated on the surface of the chip of the light emitting diode and is arranged on the interference region met by three first-level diffracted beams of the gratings. The method has the steps that the laser device is opened, light radiated from the laser device becomes a parallel beam by the beam expanding and the filtration of the beam expanding filter and the collimation of the collimating lens, and the parallel light is irradiated on the diffraction optical element; the chip of the light emitting diode coated with the photoetching adhesive layer on the surface is arranged on the interference region met by the three beams; an interference pattern is recorded in the photoetching adhesive layer by exposition and development used by holographic recording; etching is then carried out.
Description
Technical field
The present invention relates to a kind of light-emitting diode, especially relate to a kind of method and device thereof that in light-emitting diode (LED), prepares 2 D photon crystal with holographic technique.
Background technology
High-brightness LED has wilderness demand at aspects such as flat panel display, printing, illumination, light interconnection, but because there is the big and low problem of extraction efficiency of surface recombination in LED, though it has the internal quantum efficiency near 100%, its external quantum efficiency is very low, and 1/ (4n only has an appointment
2) emission light from the surface of LED or the bottom penetrate (M Boroditsky and E Yablonovitch, Proc.SPIE, 3002:119,1997), most of light has all lost.For improving the external quantum efficiency of LED, invented recent years on the LED surface and made method (the TN Oder that 2 D photon crystal improves the extraction efficiency of LED and reduces surface recombination, KH Kim, J Y Lin, H X Jiang, III-nitride blue and ultraviolet photonic crystal light emitting diodes, Appl.Phys.Lett., 84 (4): 466468; H Ichikawa, K Inoshita, T Baba, Reduced surfacerecombination and strongly enhanced light extraction in CH
4-plasma-irradiated GaInAsP photoniccrystal, IEEE 2000; A A Erchak, D J Ripin, S Fan, et al, Increased light extraction from alight-emitting diode using a two-dimensional photonic crystal, Pacific Rim Conference on Lasersand Electro-Optics, CLEO-Technical Digest, pp 125-126,2000), obtained good effect.
Photonic crystal is the artificial crystal that is formed by the dielectric substance periodic arrangement of different refractivity, and visible and near-infrared light waves are had the optical band gap.Surface at LED makes the 2 D photon crystal with certain depth, at present the method that adopts be basically carve photonic crystal on the LED surface with electron beam earlier figure as mask layer, use the method for induction plasma etching (ICP) or reactive ion etching (RI) to etch photon crystal structure then on semi-conductive top layer.The manufacture method cost height of this mask layer, speed are slow, because electron beam equipment is very expensive, and must pointwise carry out in mask layer is scribed the process of photonic crystal pattern, take a long time.
Summary of the invention
The objective of the invention is at preparing the deficiency that photon crystal mask layer exists at LED surface in the prior art, provide that a kind of cost is low, speed is fast, prepare the method and the device thereof of photon crystal mask layer with the method for holography.
The said device for preparing photonic crystal in light-emitting diode of the present invention is provided with:
Laser;
Expand the bundle filter, be located on the output optical axis of laser, the light that is used for laser is penetrated expands bundle and filtering;
Collimating lens is located on the output optical axis that expands the bundle filter, is used for forming a branch of directional light to through expanding the laser alignment of bundle;
Diffraction optical element, diffraction optical element are provided with 3 identical transmission gratings, and all the other zones are opaque, and 3 identical transmission gratings are distinguished 120 ° at interval, and diffraction optical element is located on the collimated light beam of collimating lens, and optical axis becomes symmetric arrays relatively;
Photoresist layer is applied to the light-emitting diode chip for backlight unit surface, is located at the interference region that 3 bundle first-order diffraction light of 3 transmission gratings of diffraction optical element meet.
The preparation method of the said light-emitting diode 2 D photon crystal of the present invention the steps include:
1, sets the above-mentioned device that in light-emitting diode, prepares photonic crystal;
2, open laser, the light that penetrates from laser becomes a branch of directional light through expanding after the bundle filter expands bundle filtering and collimating lens collimation, and directional light is radiated on the diffraction optical element;
3, the interference region placement surface of meeting at 3 bundle first-order diffraction light of diffraction optical element scribbles the light-emitting diode chip for backlight unit of photoresist layer;
4, exposure and the development of adopting through holographic recording records interference pattern in the photoresist layer;
5, etching, promptly in light-emitting diode, form with photoresist in identical two-dimensional photon crystal structure.
In step 4, if adopt positive photoresist, the back of developing forms many air circular holes and is hexagonal array in glue.
Its wavelength reply institute of the laser that is adopted is responsive with photoresist.
Compare with existing technology, the present invention makes two-dimensional photon crystal structure in the photoresist layer on LED surface, only needs single exposure and development, can form photonic crystal pattern on entire chip, and manufacturing process is very rapid.The grating that has only three symmetric arrays on the diffraction optical element is easy to make.Photoresist is easy to buy, and price is low.And existing method adopts the circular hole on the Electron Beam Fabrication mask, the very slow and apparatus expensive of manufacturing process.Because device therefor of the present invention is simple, cheap, cost is very low, and speed of production is fast, therefore is suitable for production in enormous quantities and makes the LED photonic crystal.
Description of drawings
Fig. 1 is the holographic preparation facilities schematic diagram of photoresist 2 D photon crystal mask layer.
Fig. 2 is the diffraction optical element structural representation.
Fig. 3 is the two-dimensional crystal lattice structural representation on photoresist surface.
Fig. 4 is a LED mask layer schematic cross-section.
Embodiment
As shown in Figure 1, 2, the device of preparation photonic crystal is provided with laser 1 in the light-emitting diode; Expand bundle filter 2 and be located on the output optical axis of laser 1, be used for the light that laser 1 penetrates is expanded bundle and filtering; Collimating lens 3 is located on the output optical axis that expands bundle filter 2, is used for forming a branch of directional light to through expanding the laser alignment of bundle; Diffraction optical element 4 is provided with 3 identical transmission gratings 5, and all the other zones are opaque, and 3 identical transmission gratings 5 are distinguished 120 ° at interval, and diffraction optical element 4 is located on the collimated light beam of collimating lens 3, and optical axis becomes symmetric arrays (referring to Fig. 2) relatively; Photoresist layer 6 is applied to light-emitting diode chip for backlight unit 7 surfaces, is located at the interference region that 3 bundle first-order diffraction light of 3 transmission gratings 5 of diffraction optical element 4 meet.The light that penetrates from laser 1 becomes a branch of directional light and is radiated on the diffraction optical element 4 after expanding bundle and collimation.In the behind of diffraction optical element 4, the first-order diffraction light of 3 transmission gratings 5 is folded to optical axis with equal angular.The zone of meeting at 3 bundle light forms interference, and interference figure is the X-Y scheme with hexagonal lattice structure, and its surfacial pattern is shown in Fig. 3, and the figure orbicular spot is high light intensity point, and grey color part is low light intensity district.Scribble the led chip 7 of one deck photoresist in the interference region placement surface, exposure and developing process through holographic recording usually adopts record interference pattern in the photoresist layer 6.As long as exposure is enough strong and cooperate suitable developing time, just can make the etched hole 61 that in photoresist layer 6, carves penetrate photoresist layer, so just form photon crystal mask layer.Fig. 4 is the sectional view of led chip, and the LED of the tapping correspondence of visible photoresist is exposed in the air.Adopt ICP or RI etching this moment, and the opening area 61 that the LED surface is not stopped by photoresist is subjected to etching, and form the LED zone 71 that is etched, thus in LED, form with photoresist in identical two-dimensional photon crystal structure.The wavelength reply institute of used laser 1 is responsive with photoresist.
Claims (2)
1. in luminous two diodes, prepare the device of photonic crystal, it is characterized in that being provided with:
Laser;
Expand the bundle filter, be located on the output optical axis of laser, the light that is used for laser is penetrated expands bundle and filtering;
Collimating lens is located on the output optical axis that expands the bundle filter, is used for forming a branch of directional light to through expanding the laser alignment of bundle;
Diffraction optical element, diffraction optical element is provided with 3 identical transmission gratings, all the other zones are opaque, 3 identical transmission gratings are distinguished 120 ° at interval, diffraction optical element is located on the collimated light beam of collimating lens, and parallel placement with collimating lens, the central point of 3 perspective gratings overlaps with systematic optical axis;
Photoresist layer is applied to the light-emitting diode chip for backlight unit surface, is located at the interference region that 3 bundle first-order diffraction light of 3 transmission gratings of diffraction optical element meet.
2. the preparation method of light-emitting diode 2 D photon crystal is characterized in that the steps include:
1), set in light-emitting diode the device of preparation photonic crystal, the device of preparation photonic crystal is provided with in light-emitting diode:
Laser:
Expand the bundle filter, be located on the output optical axis of laser;
Collimating lens is located on the output optical axis that expands the bundle filter;
Diffraction optical element, diffraction optical element is provided with 3 identical transmission gratings, all the other zones are opaque, 3 identical transmission gratings are distinguished 120 ° at interval, diffraction optical element is located on the collimated light beam of collimating lens, and parallel placement with collimating lens, the central point of 3 perspective gratings overlaps with systematic optical axis;
Photoresist layer is applied to the light-emitting diode chip for backlight unit surface, is located at the interference region that 3 bundle first-order diffraction light of 3 transmission gratings of diffraction optical element meet;
2), open laser, the light that penetrates from laser becomes a branch of directional light through expanding after the bundle filter expands bundle filtering and collimating lens collimation, directional light is radiated on the diffraction optical element;
3), the 3 bundle light interference region placement surface of meeting on diffraction optical element scribble the light-emitting diode chip for backlight unit of photoresist layer;
4), through exposure and development that holographic recording adopts, interference pattern is recorded in the photoresist layer;
5), etching, promptly in light-emitting diode, form with photoresist in identical two-dimensional photon crystal structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100784382A CN100370633C (en) | 2005-06-10 | 2005-06-10 | Method for preparing photon crystal in LED and apparatus thereof |
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| CNB2005100784382A CN100370633C (en) | 2005-06-10 | 2005-06-10 | Method for preparing photon crystal in LED and apparatus thereof |
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| CN100370633C true CN100370633C (en) | 2008-02-20 |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1818798B (en) * | 2006-03-15 | 2011-09-07 | 浙江大学 | Method and device for producing photon crystal mask layer on LED |
| CN100442171C (en) * | 2006-09-25 | 2008-12-10 | 厦门大学 | Lens-free optical device for making proton crystal |
| CN100462752C (en) * | 2006-09-25 | 2009-02-18 | 厦门大学 | Manufacturing device of combined optical element hologram |
| CN101723310B (en) * | 2009-12-02 | 2013-06-05 | 吉林大学 | Light processing method for preparing conducting micro-nano structure by utilizing graphene oxide |
| CN101727010B (en) * | 2009-12-03 | 2011-11-09 | 吉林大学 | Method for preparing biomimetic colour super-hydrophobic coating by multi-beam interference photoetching technology |
| CN102157361B (en) * | 2010-12-15 | 2012-03-21 | 中国科学院半导体研究所 | Method for preparing semiconductor T-shaped gate electrode by utilizing photon beam super-diffraction technology |
| CN103092004A (en) * | 2013-01-18 | 2013-05-08 | 厦门大学 | Holographic system for manufacturing three-dimensional closely-arrayed photonic crystal array structure |
| CN108627894B (en) * | 2017-03-16 | 2020-01-07 | 厦门大学 | Large-area nano lens type array and preparation method thereof |
| CN106842377A (en) * | 2017-04-13 | 2017-06-13 | 中原工学院 | A kind of method for making three-dimensional photon lattice or photon quasi-crystalline substance |
| CN106842378A (en) * | 2017-04-13 | 2017-06-13 | 中原工学院 | A kind of method for making large area photon crystal |
Citations (6)
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| JP2003215361A (en) * | 2002-01-21 | 2003-07-30 | Matsushita Electric Works Ltd | Optical functional element and method for producing the same |
| JP2004271944A (en) * | 2003-03-10 | 2004-09-30 | Japan Aviation Electronics Industry Ltd | Method for manufacturing three-dimensional photonic crystal |
| US6826233B1 (en) * | 1999-12-28 | 2004-11-30 | Kabushiki Kaisha Toshiba | Apparatus and method for data transmission |
| CN1556444A (en) * | 2004-01-09 | 2004-12-22 | 厦门大学 | Preparation method of three dimensional photon crystal and its device |
| CN1602569A (en) * | 2002-02-08 | 2005-03-30 | 松下电器产业株式会社 | Semiconductor light-emitting device and its manufacturing method |
| CN2824296Y (en) * | 2005-06-10 | 2006-10-04 | 厦门大学 | Apparatus for preparing LED photon crystal |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6826233B1 (en) * | 1999-12-28 | 2004-11-30 | Kabushiki Kaisha Toshiba | Apparatus and method for data transmission |
| JP2003215361A (en) * | 2002-01-21 | 2003-07-30 | Matsushita Electric Works Ltd | Optical functional element and method for producing the same |
| CN1602569A (en) * | 2002-02-08 | 2005-03-30 | 松下电器产业株式会社 | Semiconductor light-emitting device and its manufacturing method |
| JP2004271944A (en) * | 2003-03-10 | 2004-09-30 | Japan Aviation Electronics Industry Ltd | Method for manufacturing three-dimensional photonic crystal |
| CN1556444A (en) * | 2004-01-09 | 2004-12-22 | 厦门大学 | Preparation method of three dimensional photon crystal and its device |
| CN2824296Y (en) * | 2005-06-10 | 2006-10-04 | 厦门大学 | Apparatus for preparing LED photon crystal |
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