CN100363277C - Heat glass modelling thermal pressure transfering plate - Google Patents
Heat glass modelling thermal pressure transfering plate Download PDFInfo
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- CN100363277C CN100363277C CNB2004100803105A CN200410080310A CN100363277C CN 100363277 C CN100363277 C CN 100363277C CN B2004100803105 A CNB2004100803105 A CN B2004100803105A CN 200410080310 A CN200410080310 A CN 200410080310A CN 100363277 C CN100363277 C CN 100363277C
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Abstract
The present invention relates to a heat conducting press plate which has high-temperature stability and is used for the molding of glass. The heat conducting press plate comprises a base material having a work surface, an intermediate layer arranged on the work surface of the base material and a protective layer arranged on the intermediate layer. The present invention uses a high-temperature stability surface having the advantages of high temperature resistance and oxidation temperature between 600 DEG C and 800 DEG C to protect a plating layer, which greatly reduces the oxidation phenomenon of the existing heat conducting press plates and ensures the stability of the manufacturing process of molding glass. Thereby, high-temperature oxidation, surface damage and scratches can be avoided when the heat conducting press plate heats and pressurizes a mold set which is used for molding glass, which improves the stability of the manufacturing process of molding glass, lowers unqualified rate of product, and prolongs the service life of the heat conducting press plate at molding temperature and thereby, the purpose of the present invention is achieved.
Description
Technical field
The present invention relates to the process apparatus that a kind of glass moulding is used, particularly about a kind of heat glass modelling thermal pressure transfering plate of tool high-temperature stability.
Background technology
Known opticglass model processing procedure, shown in Fig. 1, device has the mold forming of glass nitre material to place with set of molds 100 and has the height planeness and include permanent seat 105, cooling unit 102b, heating unit 103b and hot pressure transmission plate 200 are formed on the load bearing seat of tool heating function, during shaping, have the height planeness and include movable pressing mechanism 101, cooling unit 102a, pressure foot moves down on heating unit 103a and tool that hot pressure transmission plate 200 is formed heating and the pressurization function, and be close proximity to mold forming with on the set of molds 100, to its heating, after the pressurization, above-mentioned going up on the pressure foot moved, pass conveyer (not illustrating) with one again mold forming is towed on hot pressure transmission plate 200 with set of molds 100, and be transported to next pressurization of tool similar means, heating station (not illustrating).
Wherein, hot pressure transmission plate 200 is unique direct assembly that contacts with set of molds 100 with model in the above-mentioned mold forming system, known technology is made with the cemented tungsten carbide superhard alloy, its stereographic map as shown in Figure 2, and be provided with a hole, Shen 201 in its four corner, in order to hot pressure transmission plate 200 is fixed on heating unit 103a, the 103b.
In above-mentioned mold forming system, the hot pressure transmission plate 200 that known cemented tungsten carbide superhard alloy is made is as conducting heat and the media that pressurizes.So in the processing procedure of glass moulding, hot pressure transmission plate 200 can be in high pressure and the pyritous environment for a long time.Therefore as shown in Figure 3, under the effect of high temperature oxidation, the surface of hot pressure transmission plate 200 can produce oxygenizement derivative 202, and the surface that the hot pressure transmission plate 200 of surface oxidation contacts with set of molds 100 will form the annular surface damage 203 that is caused by high pressure and high temperature oxidation, set of molds 100 be towed the effect that adds high temperature oxidation in hot pressure transmission plate 200 handovers then form scratch 204.So will cause detrimentally affect to the planeness and the thermal conductivity on hot pressure transmission plate 200 surfaces.When serious, set of molds 100 rocked because of the unfairness on hot pressure transmission plate 200 surfaces, and the precision of its output object moulded glass is offset, use will cause the raising of fraction defective for a long time.Simultaneously, general with the made hot pressure transmission plate of cemented tungsten carbide superhard alloy, usually under 500～700 ℃ model temperature, its work-ing life about model number of times 500 times with interior some inevitable process variation that promptly can produce.
Summary of the invention
Main purpose of the present invention provides a kind of heat glass modelling thermal pressure transfering plate, can improve the glass moulding processing procedure stability, reduce the fraction defective of product and improve its work-ing life under the model temperature, thereby reduce production costs.
For reaching above-mentioned purpose of the present invention, the invention provides a kind of heat glass modelling thermal pressure transfering plate, comprising: a ground has a working-surface; A middle layer is on the working-surface of this ground; And a protective layer, on this middle layer;
This ground is wolfram varbide, molybdenum, silicon carbide or tungsten;
This middle layer comprises Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination;
This protective layer comprises the nitride or the carbide in this middle layer.
The roughness Ra value of the working-surface described in the heat glass modelling thermal pressure transfering plate of the present invention is not more than 5nm.
The thickness in the middle layer described in the heat glass modelling thermal pressure transfering plate of the present invention is 50～250nm.
Protective layer described in the heat glass modelling thermal pressure transfering plate of the present invention comprises the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination.
The thickness of the protective layer described in the heat glass modelling thermal pressure transfering plate of the present invention is 0.50～3.0 μ m.
The heat-resisting oxidizing temperature of the protective layer described in the heat glass modelling thermal pressure transfering plate of the present invention is greater than 600 ℃.
The present invention provides a kind of heat glass modelling thermal pressure transfering plate again, comprising: a ground has a working-surface; One first middle layer is on the working-surface of this ground; One second middle layer is on this first middle layer; And a protective layer, on this second middle layer; This ground is wolfram varbide, molybdenum, silicon carbide or tungsten;
This first middle layer comprises Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination;
This second middle layer comprises the nitride or the carbide in this first middle layer;
This protective layer comprises the carbonitride in this first middle layer.
The roughness Ra value of the working-surface described in the foregoing invention heat glass modelling thermal pressure transfering plate is not more than 5nm.
The thickness in this first middle layer is 50～250nm.
Second middle layer described in the foregoing invention heat glass modelling thermal pressure transfering plate comprises the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination.
The thickness in this second middle layer is 50～350nm.
Second middle layer described in the foregoing invention heat glass modelling thermal pressure transfering plate comprises the carbonitride of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination.
The thickness of the protective layer described in the foregoing invention heat glass modelling thermal pressure transfering plate is 0.50～3.0 μ m.
The heat-resisting oxidizing temperature of the protective layer described in the foregoing invention heat glass modelling thermal pressure transfering plate is greater than 600 ℃.
The invention is characterized in and utilize high temperature resistant, oxidizing temperature to reach 600～800 ℃ high thermal stability surface protection coating, significantly reduce the oxidative phenomena of existing hot pressure transmission plate, guarantee the stability of glass moulding processing procedure.
Description of drawings
Fig. 1 is a synoptic diagram, has shown known opticglass moulding device.
Fig. 2 is a stereographic map, has shown known heat glass modelling thermal pressure transfering plate.
Fig. 3 is a stereographic map, has shown that known heat glass modelling thermal pressure transfering plate is under the High Temperature High Pressure surface oxidation that is produced and surface damage.
Fig. 4 is a sectional view, has shown the structure of the heat glass modelling thermal pressure transfering plate of first embodiment of the invention.
Fig. 5 is a sectional view, has shown the structure of the heat glass modelling thermal pressure transfering plate of second embodiment of the invention.
Nomenclature
100: mold forming set of molds 101: movable pressing mechanism
102a: cooling unit 102b: cooling unit
103a: heating unit 103b: heating unit
105: permanent seat 200: hot pressure transmission plate
201: a hole, Shen 202: oxygenizement derivative
203: annular surface damage 204: scratch
402: ground 402a: working-surface
403: middle layer 404: protective layer
502: ground 502a: working-surface
504: the second middle layers, 503: the first middle layers
505: protective layer
Embodiment
Please refer to Fig. 4, is a sectional view, is the structure that shows heat glass modelling thermal pressure transfering plate of the present invention.Its structure comprise stacked in regular turn ground 402, middle layer 403, with protective layer 404, its stereographic map is then identical with cardinal principle shown in Figure 2, so omitted.
Be formed on the protective layer 404 on the middle layer 403; be preferably tool inactivity, low-friction coefficient, with the material of high rigidity; can avoid using heat glass modelling thermal pressure transfering plate of the present invention heat in set of molds to moulded glass, when pressurizeing; high temperature oxidation, surface damage, and scratch take place, with the stability that improves the glass moulding processing procedure, reduce the fraction defective of product and prolong the work-ing life of hot pressure transmission plate under the model temperature.As mentioned above, protective layer 404 is preferably nitride or carbide, for example is the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination; Protective layer 404 is the nitride or the carbide in middle layer 403 more preferably, to improve the sticking power between middle layer 403 and the protective layer 404.Thus, ground 402, middle layer 403, can closely combine, can increase the work-ing life of heat glass modelling thermal pressure transfering plate of the present invention, and reduce the cost of processing procedure with protective layer 404.
When middle layer 403 is Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, during the alloy of B or above-mentioned combination, its formation aspect, ground after cleaning 402 can be inserted in the plated film reaction chamber (not illustrating), under 250～450 ℃ temperature, feed argon gas, and provide Si according to desirable ingredients, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, wherein one or more target in the B target, select plated film power at each target according to required composition ratio, and, be coated with middle layer 403 on the working-surface 402a of ground 402 according to the selected plated film time of required film thickness.Wherein, the thickness in middle layer 403 is preferably 50～250nm.
Aspect the formation of protective layer 404; it is the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination; or when the nitride in middle layer 403 or carbide, can use for example mode of sputter, be coated with middle layer 403 and protective layer 404 continuously.For example after finishing being coated with of middle layer 403, the plated film power of above-mentioned target is roughly remained unchanged, additionally feed nitrogen or C
2H
2Gas and with the reaction formula sputter, forms protective layer 404 on middle layer 403, and finishes the making of heat glass modelling thermal pressure transfering plate of the present invention in above-mentioned plated film reaction chamber.Wherein, the thickness scope of protective layer 404 is preferably 500～3000nm.
Please refer to Fig. 5 in addition, is a sectional view, is the structure that shows heat glass modelling thermal pressure transfering plate of the present invention.Its structure comprise stacked in regular turn ground 502, first middle layer 503, second middle layer 504, with protective layer 505, its stereographic map is then identical substantially with that shown in Figure 2, so omitted.
And second middle layer 504 is preferably nitride or carbide; for example be the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination; the more preferably nitride in first middle layer 503 or carbide; with as the transition layer between first middle layer 503 and the protective layer 505, improve the sticking power between the three.
Thus, ground 502, first middle layer 503, second middle layer 504, can closely combine, can increase the work-ing life of heat glass modelling thermal pressure transfering plate of the present invention, and reduce the cost of fraction defective and processing procedure with protective layer 505.
When first middle layer 503 is Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B, or during the alloy of above-mentioned combination, its formation aspect, ground after cleaning 502 can be inserted in the plated film reaction chamber (not illustrating), under 250～450 ℃ temperature, feed argon gas, and provide Si according to desirable ingredients, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, wherein one or more target in the B target, select plated film power at each target according to required composition ratio, and, be coated with middle layer 503 on the working-surface 402a of ground 502 according to the selected plated film time of required film thickness.Wherein, the thickness in middle layer 503 is preferably 50～250nm.
Aspect the formation in second middle layer 504, it is the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination, or when the nitride in middle layer 403 or carbide, the for example mode of sputter be can use, first middle layer 503 and second middle layer 504 are coated with continuously.For example after finishing being coated with of first middle layer 503, the plated film power of above-mentioned target is roughly remained unchanged, additionally feed nitrogen or C
2H
2Gas and with the reaction formula sputter, forms second middle layer 504 on first middle layer 503 in above-mentioned plated film reaction chamber.
Aspect the formation of protective layer 505; it is the carbonitride of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination; or first during the carbonitride in middle layer 503; can use for example mode of sputter, be coated with continuously first middle layer 503, second middle layer 504, with protective layer 505.For example after finishing being coated with of second middle layer 504, the plated film power of above-mentioned target is roughly remained unchanged, feed argon gas, nitrogen and C
2H
2Gas and with the reaction formula sputter, forms protective layer 505 on second middle layer 504, and finishes the making of heat glass modelling thermal pressure transfering plate of the present invention in above-mentioned plated film reaction chamber.Wherein, the thickness scope of protective layer 505 is preferably 500～3000nm.
For above and other objects of the present invention, feature and advantage can be become apparent, 2 preferred embodiments cited below particularly, and cooperate appended icon, be described in detail below:
The every process parameter, the condition that provide follow-up are be provided, for example the selection of composition, thickness, wear rate etc. is to be used for illustrating, should not become restriction of the present invention, being familiar with this skill person can be according to the process conditions of itself, under the situation that does not break away from spirit of the present invention, make conspicuous distortion.
Embodiment 1
Use thermal expansivity 4 * 10
-6/ K～9 * 10
-6The cemented tungsten carbide superhard alloy of/K is as ground 402, and elder generation makes its surface roughness Ra value be not more than 5nm working-surface 402a grinding, the polishing of ground 402.
Next use the TiAl alloy firm as middle layer 403, be formed on the working-surface 402a of ground 402.With grind, after ground 402 after the polishing cleans, place in the above-mentioned plated film reaction chamber, utilize Ti, Al ratio TiAl alloy target material, under the RF of 250～450 ℃ temperature, 500W sputter power for 50/50atom%, the ground bias voltage is 120V, and the feeding argon gas makes and reaches 2 * 10
-1The operating pressure of Pa goes up the TiAl alloy firm of the about 80nm of deposition one layer thickness as middle layer 403 in the working-surface 402a of ground 402.
Use TiAlN ternary alloy film as protective layer 404 at last, be formed on the middle layer 403.In same plated film reaction chamber, utilize Ti, Al ratio TiAl alloy target material for 50/50atom%, under the RF of 250～450 ℃ temperature, 500W sputter power, the ground bias voltage is 120V, feeds argon gas and makes and reach 2 * 10
-1The operating pressure of Pa feeds nitrogen again and makes and reach 3 * 10
-1The operating pressure of Pa is carried out the reaction formula sputter, and the TiAlN ternary alloy film of the about 1000nm of deposition one layer thickness is as protective layer 404 on middle layer 403.
So can constitute a hot pressure transmission plate that contains the TiAlN protective layer of low-stress, high tack and tool high thermal stability, the high temperature oxidation resisting temperature is more than 800 ℃, and than high about 2 times of the thermal stability of traditional hot pressure transmission plate, can be increased to more than 50000 times work-ing life.
Embodiment 2
Use thermal expansivity 4 * 10
-6/ K～9 * 10
-6The cemented tungsten carbide superhard alloy of/K is as ground 502, and elder generation makes its surface roughness Ra value be not more than 5nm working-surface 502a grinding, the polishing of ground 502.
Next use the TiAl alloy firm as first middle layer 503, be formed on the working-surface 502a of ground 502.With grind, after ground 502 after the polishing cleans, place in the above-mentioned plated film reaction chamber, utilize Ti, Al ratio TiAl alloy target material, under the RF of 250～450 ℃ temperature, 500W sputter power for 50/50atom%, the ground bias voltage is 120V, and the feeding argon gas makes and reaches 2 * 10
-1The operating pressure of Pa goes up the TiAl alloy firm of the about 80nm of deposition one layer thickness as first middle layer 503 in the working-surface 502a of ground 502.
Next use TiAlN ternary alloy film as second middle layer 504, be formed on first middle layer 503.In same plated film reaction chamber, utilize Ti, the Al ratio TiAl alloy target material for 50/50atom%, under the RF of 250～450 ℃ temperature, 500W sputter power, the ground bias voltage is 120V, feed argon gas and make the operating pressure that reaches 2 * 10Pa, feed nitrogen again and make and reach 3 * 10
-1The operating pressure of Pa is carried out the reaction formula sputter, and the TiAlN ternary alloy film of the about 100nm of deposition one layer thickness is as second middle layer 504 on first middle layer 503.
Use TiAlCN quad alloy film as protective layer 505 at last, be formed on second middle layer 504.In same plated film reaction chamber, utilize Ti, Al ratio TiAl alloy target material for 50/50atom%, under the RF of 250～450 ℃ temperature, 500W sputter power, the ground bias voltage is 120V, feeds argon gas and makes and reach 2 * 10
-1The operating pressure of Pa, feeding nitrogen make and reach 3 * 10
-1The operating pressure of Pa feeds C again
2H
2Make and reach 3.5 * 10
-1The operating pressure of Pa is carried out the reaction formula sputter, and the TiAlCN quad alloy film of the about 1000nm of deposition one layer thickness is as protective layer 505 on second middle layer 504.
So can constitute a hot pressure transmission plate that contains the TiAlCN protective layer of low-stress, high tack and tool high thermal stability; frictional coefficient is in 0.2; the high temperature oxidation resisting temperature is more than 800 ℃, and than high about 2 times of the thermal stability of traditional hot pressure transmission plate, can be increased to more than 50000 times work-ing life.
As mentioned above; the present invention is high temperature resistant by utilizing, oxidizing temperature reaches 600～800 ℃ high thermal stability surface protection coating; significantly reduce the oxidative phenomena of existing hot pressure transmission plate; guarantee the stability of glass moulding processing procedure; thereby can avoid using hot pressure transmission plate heat in set of molds to moulded glass, when pressurizeing; high temperature oxidation, surface damage take place, reach scratch; with the stability that improves the glass moulding processing procedure, reduce the fraction defective of product and improve the work-ing life of hot pressure transmission plate under the model temperature, thereby reach purpose of the present invention.
In the present invention's embodiment, not limiting ground is wolfram varbide, and the heat resisting ceramic materials of other kind also can replace its use, for example, and molybdenum (Mo) plate, silicon carbide (SiC) plate, tungsten (W) plate etc.
Though the present invention with preferred embodiment openly as above; yet be not to be used for limiting the present invention, anyly be familiar with this skill person, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the scope that claims define.
Claims (14)
1. heat glass modelling thermal pressure transfering plate, it is characterized in that comprising: a ground has a working-surface; A middle layer is on the working-surface of this ground; And a protective layer, on this middle layer;
This ground is wolfram varbide, molybdenum, silicon carbide or tungsten;
This middle layer comprises Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination;
This protective layer comprises the nitride or the carbide in this middle layer.
2. heat glass modelling thermal pressure transfering plate according to claim 1 is characterized in that the roughness Ra value of this working-surface is not more than 5nm.
3. heat glass modelling thermal pressure transfering plate according to claim 1, the thickness that it is characterized in that this middle layer is 50～250nm.
4. heat glass modelling thermal pressure transfering plate according to claim 1 is characterized in that this protective layer comprises the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination.
5. heat glass modelling thermal pressure transfering plate according to claim 1, the thickness that it is characterized in that this protective layer are 0.50～3.0 μ m.
6. heat glass modelling thermal pressure transfering plate according to claim 1, the heat-resisting oxidizing temperature that it is characterized in that this protective layer is greater than 600 ℃.
7. heat glass modelling thermal pressure transfering plate, it is characterized in that comprising: a ground has a working-surface; One first middle layer is on the working-surface of this ground; One second middle layer is on this first middle layer; And a protective layer, on this second middle layer;
This ground is wolfram varbide, molybdenum, silicon carbide or tungsten;
This first middle layer comprises Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination;
This second middle layer comprises the nitride or the carbide in this first middle layer;
This protective layer comprises the carbonitride in this first middle layer.
8. heat glass modelling thermal pressure transfering plate according to claim 7 is characterized in that the roughness Ra value of this working-surface is not more than 5nm.
9. heat glass modelling thermal pressure transfering plate according to claim 7, the thickness that it is characterized in that this first middle layer is 50～250nm.
10. heat glass modelling thermal pressure transfering plate according to claim 7 is characterized in that this second middle layer comprises the nitride or the carbide of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination.
11. heat glass modelling thermal pressure transfering plate according to claim 7, the thickness that it is characterized in that this second middle layer is 50～350nm.
12. heat glass modelling thermal pressure transfering plate according to claim 7 is characterized in that this second middle layer comprises the carbonitride of Si, Ti, Al, W, Ta, Cr, Zr, V, Nb, Hf, B or above-mentioned combination.
13. heat glass modelling thermal pressure transfering plate according to claim 7, the thickness that it is characterized in that this protective layer are 0.50～3.0 μ m.
14. heat glass modelling thermal pressure transfering plate according to claim 7, the heat-resisting oxidizing temperature that it is characterized in that this protective layer is greater than 600 ℃.
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| CNB2004100803105A CN100363277C (en) | 2004-09-28 | 2004-09-28 | Heat glass modelling thermal pressure transfering plate |
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|---|---|---|---|
| CNB2004100803105A CN100363277C (en) | 2004-09-28 | 2004-09-28 | Heat glass modelling thermal pressure transfering plate |
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| CN100363277C true CN100363277C (en) | 2008-01-23 |
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| CN101468538B (en) * | 2007-12-24 | 2013-12-04 | 比亚迪股份有限公司 | Coating material and preparation method thereof |
| US8887532B2 (en) | 2010-08-24 | 2014-11-18 | Corning Incorporated | Glass-forming tools and methods |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1345267A (en) * | 1999-02-24 | 2002-04-17 | 罗克赞恩·F·怀特 | Compression molding of optical lenses |
| JP2003277078A (en) * | 2002-03-26 | 2003-10-02 | Nikon Corp | Die for glass molding and method for manufacturing the sane, method for manufacturing glass optical element, glass optical element and diffraction optical element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1345267A (en) * | 1999-02-24 | 2002-04-17 | 罗克赞恩·F·怀特 | Compression molding of optical lenses |
| JP2003277078A (en) * | 2002-03-26 | 2003-10-02 | Nikon Corp | Die for glass molding and method for manufacturing the sane, method for manufacturing glass optical element, glass optical element and diffraction optical element |
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