CN100356642C - C-MgxZn1-xO/MgO multi-quantum sink heterogeneous structural materials and producing process thereof - Google Patents
C-MgxZn1-xO/MgO multi-quantum sink heterogeneous structural materials and producing process thereof Download PDFInfo
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- CN100356642C CN100356642C CNB2005100492755A CN200510049275A CN100356642C CN 100356642 C CN100356642 C CN 100356642C CN B2005100492755 A CNB2005100492755 A CN B2005100492755A CN 200510049275 A CN200510049275 A CN 200510049275A CN 100356642 C CN100356642 C CN 100356642C
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- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 5
- 229910001882 dioxygen Inorganic materials 0.000 claims description 5
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Abstract
The present invention relates to a C-Mg<x>Zn<1-x>O/MgO multi-quantum sink heterogeneous structural material. The structural characteristics of the present invention lie in that the present invention is composed of 6 to 25 C-Mg<x>Zn<1-x>O/MgO 'potential well/potential barrier' periods, MgO materials are used as potential barrier layers, C-Mg<x>Zn<1-x>O (namely cubic Mg<x>Zn<1-x>O) materials are used as potential well layers, the thickness of the barrier layer in each 'potential well/potential barrier' period is 20 to 30 nanometers, and the thickness of the well layer is 2 to 3 nanometers. The preparation process characteristics of the present invention lie in that the present invention causes high-energy focused electron beams to bombard alternatively ceramic MgO targets and ceramic (MgO)x(ZnO)<1-x> targets with the cathode beam reactive evaporation method, so that ultrathin MgO potential barrier layers and ultrathin C-Mg<x>Zn<1-x>O potential well layers generate alternatively on the surface of the substrate to obtain the C-Mg<x>Zn<1-x>O/MgO multi-quantum sink heterogeneous structural material product.
Description
Technical field
The invention belongs to the vapour phase epitaxy preparing technical field of oxide crystal film and multilayer hetero-structure thereof, be specifically related to a kind of obtain in the single crystalline substrate superficial growth, cube phase Mg with the strong luminescence feature of ultraviolet-deep ultraviolet
xZn
1-xO/MgO (is c-Mg
xZn
1-xO/MgO) Multiple Quantum Well heterostructure product and utilize the grow technology of preparing of this product of electric beam evaporation method.
Technical background
In recent years, photoelectric devices such as blue light, UV-light luminous material and light-emitting diode thereof, laser diode, ultraviolet light detector become current research focus with its potential huge applications market, and wherein ZnO series is the same with GaN series is one of important materials.ZnO is a kind of broad-band gap (energy gap 3.37eV under the room temperature) semi-conducting material, have low-k, big photoelectricity coupling coefficient, high chemical stability and good photoelectricity, piezoelectric property, and fusing point height, exciton bind energy big (60meV) has important application in fields such as device for non-linear optical, luminescent device, ultraviolet detector device, surface acoustic wave device and solar cells.On the other hand, in above-mentioned photoelectric device, often adopt heterostructure (comprising heterostructures such as quantum well, superlattice) improving the performance of device, as the photoelectric conversion efficiency that improves device, improve the spectral response characteristic of device etc.Ternary system Mg
xZn
1-xThe O alloy is to be dissolved each other by the certain mol proportion example by ZnO and two kinds of materials of MgO to form, and it has two kinds of crystal structures, is respectively wurtzite structure (the six side phase Mgs consistent with ZnO
xZn
1-xO, i.e. h-Mg
xZn
1-xO) with NaCl structure (cube phase Mg consistent with MgO
xZn
1-xO, i.e. c-Mg
xZn
1-xO).Change Mg
xZn
1-xThe content of Mg can realize that its optical band gap is adjustable continuously in 3.37eV～7.7eV (the room temperature band gap of MgO is 7.7eV) scope in the O material, its crystal structure also with Mg content in the film high and low present the cubic structure consistent with MgO or with the hexagonal structure of ZnO unanimity, and the lattice constant of these two kinds of different structure films is very close with MgO or ZnO respectively, be fit to make the semiconductor heterostructure device, as ZnO/h-Mg with ZnO or MgO combination of materials
xZn
1-xO or c-Mg
xZn
1-xThe O/MgO multiple quantum well devices.Up to now, existing much about ZnO/h-Mg
xZn
1-xThe report of O Multiple Quantum Well heterogeneous structure material and photoelectric device development thereof, the material preparation method of employing mainly contains molecular beam epitaxy (MBE) and pulsed laser deposition (PLD); But do not see adopting process as yet and realize that more simply and easily the electric beam evaporation technology of large area deposition prepares the report of Multiple Quantum Well heterogeneous structure material relatively, do not see relevant c-Mg yet
xZn
1-xThe report of O/MgO Multiple Quantum Well heterogeneous structure material and related device development.
Summary of the invention
The present invention adopts a kind of comparatively simple electric beam evaporation method, with polycrystalline MgO ceramic target and polycrystalline (MgO)
x(ZnO)
1-xCeramic target is respectively as growth MgO epitaxial loayer and c-Mg
xZn
1-xThe evaporation source material of O epitaxial loayer is at the MgO and the c-Mg of substrate surface alternating growth good uniformity
xZn
1-xO Ultra Thin Epitaxial layer is prepared high-quality c-Mg
xZn
1-xThe O/MgO multi-quantum pit structure.The barrier layer of this multi-quantum pit structure (MgO layer) THICKNESS CONTROL is at 20nm～30nm, potential well layer (c-Mg
xZn
1-xThe O layer) THICKNESS CONTROL is at 2nm～3nm.Each multi-quantum pit structure sample comprises 6 couples～30 couples c-Mg
xZn
1-xThe O/MgO cycle.This multi-quantum pit structure material detects through the light fluorescence spectrum, shows the deep UV (ultraviolet light) characteristics of luminescence that has the very strong ultraviolet light that is positioned at 395nm～405nm wave band and be positioned at 285nm～290nm wave band.
C-Mg with the strong luminescence feature of ultraviolet-deep ultraviolet of the present invention
xZn
1-xO/MgO multi-quantum pit structure material adopts the electric beam evaporation method to obtain, and its concrete processing step is as follows:
(1) clean substrate and being encased in the substrate holder growth room in, the MgO target that will suppress respectively and cross through 1200 ℃ of sintering with (MgO)
x(ZnO)
1-xTarget places two crucibles, puts two crucibles in a rotating tripod, isolates target and substrate with baffle plate.
(2) take out the reative cell vacuum to≤3 * 10 with vacuum pump
-3The vacuum degree of Pa.
(3) heated substrate is to suitable temperature.
(4) charge into high purity oxygen gas (O with suitable flow (a certain value between 10～20sccm)
2, purity 99.99%), make reative cell vacuum degree reach 3 * 10
-2Pa also keeps constant, and being grown under the excess oxygen of oxide epitaxial layer carried out, to reduce oxygen vacancy defect density.
(5) earlier high-power electron beam is aimed at the MgO target, regulate the electron beam line to a certain value between 25mA～35mA; According to the different requirements of growth rate speed, by regulating the parameters such as scanning frequency of electron beam spot, the vapour pressure of MgO target is controlled at 2.0 * 10
-2Pa～5.0 * 10
-2A certain value between the Pa makes stable, the evaporation equably of MgO target; Open baffle plate, 1 layer of MgO barrier layer of growth regulation, a certain value of layer thickness control between 20nm～30nm.Grown behind the 1st layer of MgO barrier layer, closed baffle plate.
(6) rotating crucible frame makes high-power electron beam aim at (MgO)
x(ZnO)
1-xTarget; Regulate the electron beam line to a certain value between 30mA～40mA; Regulate the scanning frequency of beam spot, make (MgO)
x(ZnO)
1-xThe vapour pressure of target is controlled at 5.0 * 10
-2Pa～8.0 * 10
-2A certain value between the Pa makes (MgO)
x(ZnO)
1-xStable, the evaporation equably of target; Open baffle plate, 1 layer of c-Mg of growth regulation
xZn
1-xO potential well layer, the layer thickness control a certain value between 2nm～3nm.The 1st layer of c-Mg grown
xZn
1-xBehind the O potential well layer, close baffle plate, the rotating crucible frame makes electron beam alignment MgO target again.
(7) same step (5), by demarcating good 2 layers of MgO barrier layer of MgO outer layer growth speed growth regulation, its thickness is consistent with the 1st layer of MgO barrier layer.Like this, through step (6) and (7) afterwards, just the 1st couple of c-Mg got well in growth
xZn
1-xO/MgO " potential well/potential barrier " cycle.
(8) same step (6) and (7), 2 layers of c-Mg of growth regulation respectively
xZn
1-xO potential well layer and the 3rd layer of MgO barrier layer have just formed the 2nd couple of c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle.
(9) same step (8), 3 pairs, the 4th pair, the 5th pair of growth regulation ..., n is to c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle.
(10) when having grown n to c-Mg altogether
xZn
1-xThe all after dates of O/MgO " potential well/potential barrier " close the electron gun high pressure, finish growth.
(11) treat that underlayer temperature reduces to room temperature, gas amplifies in the growth room, takes out sample.
The substrate that processing step of the present invention (1) is mentioned is single crystalline Si polished silicon wafer or monocrystalline sapphire polished silicon wafer.
(MgO) that processing step of the present invention (1) is mentioned
x(ZnO)
1-xTarget is to be that 99.99% MgO and ZnO powder evenly mix by certain quality percentage by purity, and repressed and 1200 ℃ of high temperature sinterings form; Mass percent x is 5% or 10%.
The suitable underlayer temperature that processing step of the present invention (3) is mentioned is 200 ℃～250 ℃.
Processing step of the present invention (5) and (6) are mentioned MgO epitaxial loayer and c-Mg respectively
xZn
1-xThe demarcation of the growth rate of O epitaxial loayer, wherein:
The demarcating steps of MgO outer layer growth speed is:
I) clean the substrate and the substrate holder of packing into, put the MgO target in crucible, isolate target and substrate with baffle plate;
II) take out the reative cell vacuum to≤3 * 10 with vacuum pump
-3The vacuum degree of Pa;
III) a certain temperature between the heated substrate to 200 ℃～250 ℃;
IV) charging into purity with suitable flow (a certain value between 10sccm～20sccm) is 99.99% high purity oxygen gas, makes reative cell vacuum degree reach 3x10
-2Pa also keeps constant;
V) regulate the electron beam line to a certain value between 25mA～35mA, make MgO target start vaporizer; According to the different requirements of growth rate speed, by regulating the parameters such as scanning frequency of beam spot, the vapour pressure of MgO target is controlled at 2.0 * 10
-2Pa～5.0 * 10
-2A certain value between the Pa makes stable, the evaporation equably of MgO target; Open the baffle plate MgO epitaxial loayer that begins to grow;
VI) experience certain hour when the MgO outer layer growth, closed baffle plate, closed electron beam source, finished growth;
VII) treat that underlayer temperature reduces to room temperature, gas amplifies in the growth room, takes out sample.
VIII) measure the thickness of MgO epitaxial loayer, and by formula " thickness/growth time of growth rate=epitaxial loayer " calculates the growth rate of MgO epitaxial loayer.
(I)～(VIII) carries out repeatedly repeated experiment by above step, and the growth rate that finally calibrates the MgO epitaxial loayer is with electronic beam current and the isoparametric change curve of target partial pressure.For example, be that the partial pressure of 30mA and MgO target is 2.0 * 10 at the electron beam line
-2Under the condition of Pa, the growth rate of MgO epitaxial loayer is 10 /s through demarcation; And be that the partial pressure of 35mA and MgO target is 5.0 * 10 at electronic beam current
-2Under the condition of Pa, the growth rate of MgO epitaxial loayer is 34 /s through demarcation.
C-Mg
xZn
1-xThe demarcating steps of the growth rate of O epitaxial loayer is:
A) clean the substrate and the substrate holder of packing into, put (MgO)
x(ZnO)
1-xTarget is isolated target and substrate with baffle plate in crucible;
B) take out the reative cell vacuum to≤3 * 10 with vacuum pump
-3The vacuum degree of Pa;
C) a certain temperature between the heated substrate to 200 ℃～300 ℃;
D) charging into purity with suitable flow (a certain value between 10sccm～20sccm) is 99.99% high purity oxygen gas, makes the vacuum degree in the reative cell reach 3 * 10
-2Pa also keeps constant;
E) regulate the electron beam line to a certain value between 30mA～40mA, make (MgO)
x(ZnO)
1-xStable, the evaporation equably of target; By regulating the parameters such as scanning frequency of electron beam spot, with (MgO)
x(ZnO)
1-xThe vapour pressure of target is controlled at 5.0 * 10
-2Pa～8.0 * 10
-2A certain value between the Pa; Open baffle plate and begin the c-Mg that grows
xZn
1-xThe O epitaxial loayer;
F) as (MgO)
x(ZnO)
1-xOuter layer growth has experienced certain hour, closes baffle plate, closes electron beam source, finishes growth;
G) treat that underlayer temperature reduces to room temperature, gas amplifies in the growth room, takes out sample.
H) measure c-Mg
xZn
1-xThe thickness of O epitaxial loayer, and by formula " thickness/growth time of growth rate=epitaxial loayer " calculates c-Mg
xZn
1-xThe growth rate of O epitaxial loayer.
(a)～(h) carries out repeatedly repeated experiment by above step, finally calibrates c-Mg
xZn
1-xThe growth rate of O epitaxial loayer is with electronic beam current and the isoparametric change curve of target partial pressure.For example, be that 30mA reaches (MgO) at the electron beam line
x(ZnO)
1-xThe partial pressure of target is 5.0 * 10
-2Under the condition of Pa, c-Mg
xZn
1-xThe growth rate of O epitaxial loayer is 2 /s through demarcation.
Processing step of the present invention (10) is mentioned the long n of symbiosis to c-Mg
xZn
1-xIn O/MgO " potential well/potential barrier " cycle, wherein n is 6 pairs～25 pairs.
C-Mg of the present invention
xZn
1-xThe technology of preparing of O/MgO multi-quantum pit structure realizes in electron beam evaporation-gas-phase reaction depositing system, utilizes the high-energy focusing electron beam of electron gun emission alternately to bombard MgO and (MgO)
x(ZnO)
1-xTarget, the kinetic energy of electron beam becomes heat energy, makes the target molecule or the atom of thermal evaporation leave target material surface, and scattering also deposits to the substrate surface that has heated, by a series of molecule, atomic power process, alternately generates MgO, c-Mg at substrate surface
xZn
1-xO, MgO, c-Mg
xZn
1-xO, MgO ... multilayer Ultra Thin Epitaxial layer promptly forms c-Mg
xZn
1-xThe O/MgO multi-quantum pit structure.
Major technique advantage of the present invention is:
Preparation technology is easy to control, growth temperature low (200～250 ℃), advantages of nontoxic raw materials side effect and be easy to obtain, be applicable to the preparation of large tracts of land crystal film, the problems such as processing again that do not have exhaust emissions or byproduct, so preparation cost is low, helps large-scale production.
Finished product advantage of the present invention is:
Prepared c-Mg
xZn
1-xPotential well layer (the c-Mg of O/MgO Multiple Quantum Well heterostructure
xZn
1-xThe O layer) thickness≤3nm, this yardstick can with c-Mg
xZn
1-xThe effective Bohr radius of the exciton of O material is comparable, thereby has quantum limitation effect.To prepared c-Mg
xZn
1-xThe light fluorescence spectrum test shows of O/MgO Multiple Quantum Well heterostructure, it has the strong luminescence feature of ultraviolet-deep ultraviolet, and being expected to has important application in photoelectric device fields such as short-wave long light-emitting diode, laser diodes.
Description of drawings
Fig. 1 is single crystalline Si base c-Mg according to a preferred embodiment of the present invention
xZn
1-xThe schematic diagram of O/MgO Multiple Quantum Well heterostructure is by 22 couples of c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle constitutes, wherein each c-Mg
xZn
1-xThe thickness of O potential well layer is 3nm, and the thickness of each MgO barrier layer is 30nm.Prepare two targets that this Multiple Quantum Well heterostructure adopted and be respectively MgO target and (MgO)
0.05(ZnO)
0.95Target.
Fig. 2 is single crystalline Si base c-Mg according to a preferred embodiment of the present invention
xZn
1-xThe light at room temperature fluorescence spectrum of O/MgO Multiple Quantum Well heterostructure has a strong ultra-violet light-emitting peak at about 398nm wavelength place, at about 287nm place a deep-UV light-emitting peak is arranged.The excitation source of this fluorescence spectrum is the 240nm spectral line of Xe lamp.This fluorescence spectrum exists because the spectral modulation phenomenon that interference effect caused.
Embodiment
Embodiment:
1) clean single crystalline Si polished silicon wafer substrate and being encased in the substrate holder growth room in, the MgO target that will suppress respectively and cross through 1200 ℃ of sintering with (MgO)
0.05(ZnO)
0.95Target places two crucibles, puts two crucibles in a rotating tripod, isolates target and substrate with baffle plate;
2) take out the reative cell vacuum to≤3 * 10 with vacuum pump
-3The vacuum degree of Pa;
3) heated substrate to 200 ℃;
4) charging into purity with the flow of 20sccm is 99.99% high purity oxygen gas, makes the vacuum degree in the reative cell reach 3 * 10
-2Pa also keeps constant;
5) high-power electron beam is aimed at the MgO target; Regulate the electron beam line to 30mA, make the vapour pressure of MgO target reach 2.0 * 10 by the scanning frequency of regulating beam spot
-2Pa also keeps constant (promptly selecting the MgO outer layer growth speed through the 10 /s that demarcates); Open baffle plate then, after 30 seconds of growing, close baffle plate, promptly obtain the 1st layer of MgO barrier layer of thickness 30nm.
6) rotating crucible frame makes high-power electron beam aim at (MgO)
x(ZnO)
1-xTarget; Still keep at the electron beam line under the condition of 30mA, make (MgO) by the scanning frequency of regulating beam spot
x(ZnO)
1-xThe vapour pressure of target reaches 5.0 * 10
-2Pa also keeps constant (the i.e. c-Mg of 2 /s that selection process is demarcated
xZn
1-xO outer layer growth speed); Open baffle plate then, after 15 seconds of growing, close baffle plate, promptly obtain the 1st layer of c-Mg of thickness 3nm
xZn
1-xThe O potential well layer.
7) set by step 5), 2 layers of MgO barrier layer of growth regulation, its thickness is consistent with the 1st layer of MgO barrier layer; Like this, through step (6) and (7) afterwards, just the 1st couple of c-Mg got well in growth
xZn
1-xO/MgO " potential well/potential barrier " cycle;
8) and then, same step (6) and (7), 2 layers of c-Mg of growth regulation respectively
xZn
1-xO potential well layer and the 3rd layer of MgO barrier layer have just formed the 2nd couple of c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle;
9) similarly, same step (8), 3 pairs, the 4th pair, the 5th pair of growth regulation ..., the 22nd couple of c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle;
10) as the 22 couples of c-Mg that grown altogether
xZn
1-xThe all after dates of O/MgO " potential well/potential barrier " close the electron gun high pressure, finish growth.
11) treat that underlayer temperature reduces to room temperature, gas amplifies in the growth room, takes out sample, promptly obtains having 22 c-Mg to " potential well/potential barrier " cycle
xZn
1-xO/MgO Multiple Quantum Well heterostructure sample.This sample detects through the light fluorescence spectrum and shows at about 398nm wavelength place a strong ultra-violet light-emitting peak is arranged, and at about 287nm place a deep-UV light-emitting peak is arranged.
Claims (4)
1, a kind of c-Mg
xZn
1-xO/MgO Multiple Quantum Well heterogeneous structure material, its architectural feature is: comprise 6～25 c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle; The MgO material is done barrier layer, c-Mg
xZn
1-xThe O material is done potential well layer; Each " potential well/potential barrier " barrier layer thickness in the cycle is 20～30nm, and the trap layer thickness is 2～3nm; Adopt the electric beam evaporation method, by allowing the high-energy focusing electron beam alternately bombard MgO ceramic target and (MgO)
x(ZnO)
1-xCeramic target is at substrate surface alternating growth MgO barrier layer and c-Mg
xZn
1-xThe O potential well layer obtains c-Mg
xZn
1-xO/MgO Multiple Quantum Well heterogeneous structure material product.
2, the described c-Mg of claim 1
xZn
1-xThe preparation technology of O/MgO Multiple Quantum Well heterogeneous structure material, processing step is as follows:
(1) clean substrate and being encased in the substrate holder growth room in, the MgO target that will suppress respectively and cross through 1200 ℃ of sintering with (MgO)
x(ZnO)
1-xTarget places two crucibles, puts two crucibles in a rotating tripod, isolates target and substrate with baffle plate;
(2) take out the reative cell vacuum to≤3 * 10 with vacuum pump
-3The vacuum degree of Pa;
(3) heated substrate to 200 ℃～250 ℃;
(4) with a certain value between suitable flow 10～20sccm, charge into high purity oxygen gas O
2, purity 99.99% makes reative cell vacuum degree reach 3 * 10
-2Pa also keeps constant, and being grown under the excess oxygen of oxide epitaxial layer carried out, to reduce oxygen vacancy defect density;
(5) earlier high-power electron beam is aimed at the MgO target, regulate the electron beam line,, by regulating the scanning frequency parameter of electron beam spot, the vapour pressure of MgO target is controlled at 2.0 * 10 according to the different requirements of growth rate speed to a certain value between 25mA～35mA
-2Pa～5.0 * 10
-2A certain value between the Pa makes stable, the evaporation equably of MgO target, opens baffle plate, 1 layer of MgO barrier layer of growth regulation, and a certain value of layer thickness control between 20nm～30nm behind the 1st layer of MgO barrier layer of having grown, closed baffle plate;
(6) rotating crucible frame makes high-power electron beam aim at (MgO)
x(ZnO)
1-xTarget is regulated the electron beam line to a certain value between 30mA～40mA, regulates the scanning frequency of beam spot, makes (MgO)
x(ZnO)
1-xThe vapour pressure of target is controlled at 5.0 * 10
-2Pa～8.0 * 10
-2A certain value between the Pa makes (MgO)
x(ZnO)
1-xStable, the evaporation equably of target; Open baffle plate, 1 layer of c-Mg of growth regulation
xZn
1-xO potential well layer, the layer thickness control a certain value between 2～3nm, the 1st layer of c-Mg grown
xZn
1-xBehind the O potential well layer, close baffle plate, the rotating crucible frame makes electron beam alignment MgO target again;
(7) same step (5), by demarcating good 2 layers of MgO barrier layer of MgO outer layer growth speed growth regulation, its thickness is consistent with the 1st layer of MgO barrier layer, and like this, through step (6) and (7) afterwards, just the 1st couple of c-Mg got well in growth
xZn
1-xO/MgO " potential well/potential barrier " cycle;
(8) same step (6) and (7), 2 layers of c-Mg of growth regulation respectively
xZn
1-xO potential well layer and the 3rd layer of MgO barrier layer have just formed the 2nd couple of c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle;
(9) same step (8), 3 pairs, the 4th pair, the 5th pair of growth regulation ... n is to c-Mg
xZn
1-xO/MgO " potential well/potential barrier " cycle;
(10) when having grown n to c-Mg altogether
xZn
1-xThe all after dates of O/MgO " potential well/potential barrier ", described n is 6-25, closes the electron gun high pressure, finishes growth;
(11) treat that underlayer temperature reduces to room temperature, gas amplifies in the growth room, takes out sample.
3, c-Mg according to claim 2
xZn
1-xThe preparation technology of O/MgO Multiple Quantum Well heterogeneous structure material is characterized in that: described backing material is single crystalline Si polished silicon wafer or monocrystalline sapphire polished silicon wafer.
4, c-Mg according to claim 2
xZn
1-xThe preparation technology of O/MgO Multiple Quantum Well heterogeneous structure material is characterized in that: described MgO ceramic target be by purity be 99.99% MgO powder repressed and under 1200 ℃ high temperature sintering form; Described (MgO)
x(ZnO)
1-xCeramic target is to be that 99.99% MgO powder and purity are that 99.99% ZnO powder evenly mixes by certain mass ratio by purity, and repressed back sintering under 1200 ℃ high temperature forms, and mass ratio x is 5% or 10%.
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| CN101359706B (en) * | 2008-08-22 | 2010-10-13 | 浙江大学 | ZnO based LED of multiple quantum wells |
| CN101976800A (en) * | 2010-10-09 | 2011-02-16 | 吉林大学 | ZnO and GaN-combined ZnO-based end surface transmitting laser and preparation method thereof |
| CN102263370A (en) * | 2010-10-09 | 2011-11-30 | 吉林大学 | p-ZnO and n-GaN combined multi-layer terminal emitting lasers and preparation methods |
| CN102263369A (en) * | 2010-10-09 | 2011-11-30 | 吉林大学 | p-ZnO and n-GaN combined ZnO-based terminal emitting lasers and preparation methods |
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| JP6553361B2 (en) * | 2015-01-16 | 2019-07-31 | スタンレー電気株式会社 | UV light source |
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| CN102263370B (en) * | 2010-10-09 | 2013-07-10 | 吉林大学 | p-ZnO and n-GaN combined multi-layer terminal emitting lasers and preparation methods |
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| CN1707892A (en) | 2005-12-14 |
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