CN100354671C - Integrated optical transceiver and related methods - Google Patents
Integrated optical transceiver and related methods Download PDFInfo
- Publication number
- CN100354671C CN100354671C CNB018061753A CN01806175A CN100354671C CN 100354671 C CN100354671 C CN 100354671C CN B018061753 A CNB018061753 A CN B018061753A CN 01806175 A CN01806175 A CN 01806175A CN 100354671 C CN100354671 C CN 100354671C
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- Prior art keywords
- light source
- detecting device
- wafer
- optical
- pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000010354 integration Effects 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 18
- 239000013307 optical fiber Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
An optical transceiver includes at least one light source and at least one detector mounted on the same surface of the same substrate. At least one of the light source and the detector is mounted on the surface. An optics block having optical elements for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.
Description
Technical field
The present invention relates to a kind of integrated optical transceiver and correlation technique thereof.
Background technology
What adopt when being integrated in transceiver on the chip in the past is method for integrating monolithic, and active component wherein all forms on substrate, so they are all made with commaterial.In this case, detector array and array of source can not reach optimum performance simultaneously.
Other is attempted active component, and for example light source and detecting device are produced on the different substrates.But so increased the complexity of system, because number of elements has increased, the difficulty of aligning has also increased.
Summary of the invention
Therefore, the objective of the invention is to make a kind of integrated optical transceiver, it can overcome one or more difficulty that limitation in the related art and shortcoming are brought basically.
For these purposes and other purpose, the invention provides a kind of optical transceiver, it is included in first lip-deep at least one light source on the substrate, at first lip-deep at least one detecting device of this substrate, in this at least one light source and at least one detecting device at least one is installed on this substrate, this at least one detecting device is used for receiving the light from beyond at least one light source, and this has optical element above optical module.This at least one light source and at least one detecting device all have optical element.This optical module is attached on this substrate; And a pad between substrate and optical module, described pad surround fully optical module, at least one light source and at least one detecting device around.
Described at least one light source can adopt different materials with at least one detecting device.One in this at least one light source and at least one detecting device can be single chip integrated on substrate.The optical element of this at least one at least one detecting device of light source and this has identical design.Can on the relative one side of the optical element that forms at least one detecting device, form the optical element of at least one light source.This at least one light source can be a vertical cavity surface emitting laser.Can on first surface of the substrate of at least one light source and at least one detecting device, provide interconnection device.These interconnection devices can be on first surperficial the same side of the substrate of at least one light source and this at least one detecting device, also can be on its a relative side; Described pad is included in the silicon chip that wherein has etched hole.
Described at least one light source can be an array of source, and described at least one detecting device can be a detector array.Array of source can be parallel with detector array, also can form straight line.
Above purpose and other purpose can realize with a kind of method, this method is used to form an optical transceiver, this method is included on first surface of first wafer a plurality of detecting devices is provided, on first surface of first wafer, provide a plurality of light sources, in a plurality of detecting devices and these a plurality of light sources at least one is installed on first wafer, and provide electrical interconnection in each and a plurality of detecting devices in first lip-deep a plurality of light sources of first wafer each, an optical module is provided, for in each and a plurality of light sources in a plurality of detecting devices each, this optical module has at least one optical element, between this optical module and first wafer, provide the pad that has a plurality of holes on it, with this optical spacer, this optical module and this first wafer adhere to mutually, and the sidewall in each hole in the pad surrounds each optical module fully, around light source and the detecting device, first wafer and pad are separated into a plurality of transceivers, each transceiver all has at least one light source and at least one detecting device, and pad surrounds each optical module fully, around light source and the detecting device.
The providing of this optical module is included on second substrate in each and a plurality of light sources in a plurality of detecting devices each and forms at least one optical element, before separately, second substrate and first substrate are adhered to, just can carry out electrical interconnection by this connection.The providing of vertical pad can be included on the pad wafer to each transceiver forms vertical pad, before separating this pad wafer is connected with first substrate, just separates like this and can carry out electrical interconnection.The providing of optical module can be included on second substrate in each and a plurality of light sources in a plurality of detecting devices each and form at least one optical element, before separating, second substrate and pad wafer are coupled together with first substrate, just separate like this and can carry out electrical interconnection.This connection can comprise second substrate directly is connected with the pad wafer.Provide one in a plurality of light sources and a plurality of detecting device can comprise that being integrated into first substrate with the monolithic integration mode gets on.For same mask is all adopted in each interconnection that provides electrical interconnection can be included as detecting device and light source in each and a plurality of light sources in a plurality of detecting devices.
By reading following detailed description, can understand these purposes of the present invention and other purpose more.But should be understood that, these that the preferred embodiments of the present invention are described describe in detail and instantiation only is that the present invention will be described, because those of skill in the art can obtain belonging to various changes and improvements within the spirit and scope of the present invention from these detailed descriptions.
Description of drawings
Describe above-mentioned purpose and other purpose, above-mentioned aspect and advantage below with reference to the accompanying drawings in detail, wherein:
Fig. 1 is a decomposing schematic representation seeing an optical transceiver of the present invention from above;
Fig. 2 is a synoptic diagram seeing another optical transceiver of the present invention from the side;
Fig. 3 is a vertical view of the another kind of structure of light source and detecting device on the same substrate;
Fig. 4 is a side-looking schematic diagram according to a plurality of transceivers of generation of the present invention;
Fig. 5 is the decomposition diagram of an interface seeing that from above optical fiber is connected with transceiver of the present invention in casing.
Embodiment
In the following description,, provided detail, so that intactly understand the present invention in order to describe rather than to limit.But for those of skill in the art, the present invention obviously can realize by enough other embodiment that is different from these details.In other situation, saved the detailed description of known devices and method, in order to avoid obscure.
Do not utilize single slice integration technique, still can be by on the same surface of a substrate, providing array of source and detector array, for array of source and the detector array that is integrated in wherein provides an optical module with optical element, obtain many advantages of integrated technology.
On October 18th, 2000 submitted to, sequence number is 09/690763, title is " optical fiber interface that comprises parallel array, power-monitoring and/or difference modes compensation of delay " unsettled relevant U.S. Provisional Patent Application, has described a same on-chip laser array and a detector array.In this previous application, detector array is used to the power of monitoring laser device, and a part of outgoing laser beam is directed to detecting device.According to of the present invention open, an array of source and a detector array are integrated on the same substrate, still, and illustrated in figures 1 and 2 as the application, these detecting devices are used for a position received signal from afar, rather than are used to monitor this array of source.Certainly, also can provide another array that monitors detecting device to monitor the output of light source.
In Fig. 1, optical transceiver 100 comprises an array of source 102, it is drawn as a vertical cavity side emitting laser (VCSELr) array here, also comprises detector array 104, and it is integrated on the silicon wafer 106.Silicon interconnect line 108 is that active component 102,106 provides electric power, and solder joint 110 makes detector signal to be read out.
The integrated optical element 122,124 of this array of source and detector array can be included in the optical element that forms on surface of optical module 120 or two surfaces.Because the optical element of array of source and detector array all aligns simultaneously, needed assembling of generation transceiver and alignment procedures have therefore been reduced.In addition, this transceiver is littler after integrating, and parts still less.Material according to substrate adopts can be integrated in detector array or array of source wherein with the monolithic integration mode.
The bonding good later structures of the transceiver 200 of in Fig. 2, having drawn.Be not optical module 120 all around around a pad 130, but placed the shim elements 230 that separates in four corners of optical module.Also have, the optical element 222 of light source 202 is on another surface on the surface, optical element 224 place that is different from detecting device 204 on the optical module 220.These optical elements of light source and detecting device may have identical structure.On same substrate 206, one in the middle of them can be integrated in wherein with the monolithic integration mode again for light source 202 and detecting device 204.Be used to active component that electric power is provided and from the silicon line 208 of active component received signal and solder joint 208 also on this substrate.
Fig. 3 is a vertical view of the transceiver 300 of another embodiment of the present invention.In Fig. 3, not to allow active component 102,104 be arranged in parallel array, but allow these active components line up a linear array.In example shown in Figure 3, four light sources 102 and four detecting devices 104 are arranged in a line.Space between them can reduce crosstalking between the active component.Corresponding optical element 122,124 also point-blank.Adopt this structure to be connected with this transceiver with regard to 1 * 12 fiber array of the enough standards of energy.All interconnection of adopting this structure allow to need are all in the same side of substrate 106, thereby allow optical module 120 and substrate 106 shared edges, do the manufacturing process that can make things convenient for the wafer one-level like this.
Be equally in Fig. 3, except surround optical module 120 around, pad 130 also has an isolated part 132 between two kinds of electrooptic cells 102,104.This isolated part 132 can plate layer of metal, so that further reduce crosstalking between these electrooptic cells.These electrooptic cells are near more, isolate just important more.Also can in other any one structure, provide isolated part 132.
In any one structure of above structure, these elements can adopt the wafer-to wafer adhering technique to couple together, and are illustrated as No. 6096155 of common transfer and No. 6104690 United States Patent (USP), here they all are incorporated herein by reference.Adopt above structure just can aim at the optical element of transmitter section and receiver section simultaneously.Here the term wafer of Cai Yonging refers to have and will separate the just any general structure of the last more than one element that uses.
As shown in Figure 4 be a particular instance of the wafer that all three substrates is bonded together before separately.By for example on silicon, corroding according to diagramatic way, for being each transceiver between optical element 122,124 and between pad 130, each transceiver forms pad 340, the realization of can coming in 106 minutes by substrate of each transceiver at suitable name a person for a particular job light source 102 and detecting device 304.As shown in Figure 4, with the monolithic integration mode detecting device 304 is integrated in the substrate 106 and goes.The active component with higher yield that forms on substrate is preferably with the integrated element of monolithic integration mode, because can not be replaced with the integrated element of monolithic integration mode.In addition, on this substrate with the needed metallization of electrical connection of the integrated element of single chip mode and other active component with form that the monolithic integrated component is the same all to be made with same mask.So just can guarantee accurate aligning,, for example utilize the scolder autoregistration because the active component that will install can utilize its metallization to aim at.Can before installing, test then being installed in on-chip active component.After installing, can before adhering wafers, test again, just change if desired them.
Used here bonding can be adhering to of any type, comprise and utilize jointing material, surface tension or directly on same substrate, form.Equally here separately can comprise and make all means that discrete component adopted, for example cut open.In addition, making separates the example of wafer and can also submit to simultaneously with the application when having the module of electrooptic cell, case number is DOC.072P, title is to find in the common pending application of common transfer of " separating method of electric light integration module and the structure that forms in this way ", and here the content with it all is incorporated herein by reference.
The input port and the delivery outlet of the aligning particular importance, particularly optical fiber of active component input port and delivery outlet are all the more so.Fig. 5 has provided and has guaranteed a kind of structure that can correctly aim between transceiver and the optical fiber.As shown in Figure 5, multifiber 410 is inserted in the cover 412.The active component that will communicate with optical fiber 410 among the present invention here is a linear structure shown in Figure 3, preferably is made on the silicon platform or on the erecting bed 416, corresponding to common substrate shown in Figure 3 106.During this time, this silicon platform 416 is preferably on substrate 418.Optical module 420 provides an optical element at least between each electrooptical device of erecting bed 416 and corresponding optical fiber 410.The most handy pad 415 separates optical module 420 and photoelectric device.These optical elements preferably include the element with optical registration, focusing, homogenising or other connection light.Because optical module has two surfaces, so two optical elements can be arranged on it.In addition, if desired can also be on optical module 420 bonding more optical module, and separate, obtaining more surface, as what do in the transceiver architecture of front any one with optical module 420.
The optical module 420 that mechanical interface 422 will have been aimed at electro-optical device is aimed at optical fiber 410.This can be by providing alignment device to realize on the cover 412 of mechanical interface 422 and installation optical fiber 410.In illustrated example, these alignment devices comprise the hole on the cover 412, aim in order to overlap with other device, and these holes have been arranged, and also comprise the mating holes 426 on the mechanical interface 422.In case these mating holes 424,426 are aligned, just an alignment pins of not drawing among the figure can be inserted wherein, keep the position of aiming at.Other details of these interfaces can here all be incorporated herein by reference it for example finding in the common common unsettled U.S. Patent application of transferring the possession of 09/418022 " optical module ".
Though describe the time of the present invention with reference to the illustrative embodiment of application-specific, should be understood that this is not limited to these embodiment clearly.Those of skill in the art can find other improvement, application and embodiment according to the technology of instruction here, can also find and can utilize other field of the present invention, but they belong to scope of the present invention.Therefore, scope of the present invention should be provided by following claim and their legal effectiveness, rather than is provided by the example that has provided.
Claims (21)
1. optical transceiver comprises:
First lip-deep at least one light source at a substrate;
At first lip-deep at least one detecting device of described substrate, at least one in described at least one light source and at least one detecting device is installed on the described substrate, and described at least one detecting device is used for receiving light beyond this at least one light source;
An optical module that has optical element thereon, described at least one light source and at least one detecting device all have described optical element, and this optical module is attached on the described substrate; And
A pad between substrate and optical module, described pad surround fully optical module, at least one light source and at least one detecting device around.
2. optical transceiver as claimed in claim 1, wherein at least one light source and at least one detecting device are made of different materials.
3. optical transceiver as claimed in claim 1, wherein at least one light source and at least one detecting device is to be integrated in on-chip with the monolithic integration mode.
4. optical transceiver as claimed in claim 1, at least one light source wherein are array of source, and at least one detecting device is a detector array.
5. optical transceiver as claimed in claim 1, wherein said pad is included in the silicon chip that wherein has etched hole.
6. optical transceiver as claimed in claim 1, the optical element that wherein is used at least one light source and at least one detecting device has identical design.
7. optical transceiver as claimed in claim 1, the optical element that wherein is used at least one light source are to form on an opposite face of the optical element that forms described at least one detecting device on the optical module.
8. optical transceiver as claimed in claim 1, wherein said at least one light source are vertical cavity surface emitting lasers.
9. optical transceiver as claimed in claim 1 also is included in the interconnection device of at least one light source on the substrate first surface and at least one detecting device.
10. optical transceiver as claimed in claim 9, wherein said interconnection device is on the same side of the first surface of the substrate of described at least one light source and at least one detecting device.
11. optical transceiver as claimed in claim 9, wherein said interconnection device is at described at least one light source with at least as on the opposite flank of the first surface of the substrate of a detecting device.
12. optical transceiver as claimed in claim 4, wherein said array of source is parallel with detector array.
13. optical transceiver as claimed in claim 4, wherein said array of source and detector array form straight line.
14. a method that forms optical transceiver comprises:
A plurality of detecting devices are provided on the first surface of first wafer;
A plurality of light sources are provided on the first surface of first wafer, and at least one in a plurality of detecting devices and a plurality of light source is installed on first wafer;
On first surface of first wafer, provide electrical interconnection for each of each and a plurality of light sources in a plurality of detecting devices;
An optical module with at least one optical element is provided in each and a plurality of light sources in a plurality of detecting devices each;
Between optical module and first wafer, provide the pad that has a plurality of holes on it;
Pad, optical module and first wafer are attached together mutually, and the sidewall in each hole in the pad surround fully each optical module, light source and detecting device around; With
First wafer and pad are divided into a plurality of transceivers, and each transceiver has at least one light source and at least one detecting device, and pad surround fully each optical module, light source and detecting device around.
15. method as claimed in claim 14, the providing of wherein said optical module is included on second wafer in each and a plurality of light sources in a plurality of detecting devices each and forms at least one optical element, before carrying out described division step with second die attach on first wafer, carry out describedly just can carrying out described electrical interconnection after separately.
16. method as claimed in claim 14, wherein said division step allow to carry out described electrical interconnection.
17. method as claimed in claim 14, the providing of wherein said optical module is included on second wafer in each and a plurality of light sources in a plurality of detecting devices each and forms at least one optical element, before carrying out described division step with second die attach on pad wafer and first wafer, just can carry out described electrical interconnection after having separated.
18. method as claimed in claim 17, wherein said adhering to comprises second wafer is attached directly on the pad wafer.
19. method as claimed in claim 14, one provide and comprise with the monolithic integration mode and being integrated on first wafer in wherein said a plurality of light sources and the described a plurality of detecting device.
20. method as claimed in claim 14 wherein all adopts same mask in each and a plurality of light sources in a plurality of detecting devices each provides electrical interconnection to comprise to the interconnection of detecting device and light source.
21. method as claimed in claim 14 wherein provides the step of pad to be included in a plurality of holes of etching on the silicon wafer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18703400P | 2000-03-06 | 2000-03-06 | |
| US60/187,034 | 2000-03-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1419659A CN1419659A (en) | 2003-05-21 |
| CN100354671C true CN100354671C (en) | 2007-12-12 |
Family
ID=22687346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB018061753A Expired - Fee Related CN100354671C (en) | 2000-03-06 | 2001-03-06 | Integrated optical transceiver and related methods |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1269239A2 (en) |
| JP (1) | JP2003526909A (en) |
| CN (1) | CN100354671C (en) |
| AU (1) | AU2001247286A1 (en) |
| CA (1) | CA2401976A1 (en) |
| WO (1) | WO2001067144A2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9112616B2 (en) | 2008-08-13 | 2015-08-18 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second |
| US20130110311A1 (en) * | 2011-08-29 | 2013-05-02 | Tk Holdings Inc. | System for noninvasive measurement of an analyte in a vehicle driver |
| EP3038865B1 (en) | 2013-08-27 | 2017-09-06 | Automotive Coalition for Traffic Safety, Inc. | Systems and methods for controlling vehicle ignition using biometric data |
| CA3143026A1 (en) | 2019-06-12 | 2020-12-17 | Automotive Coalition For Traffic Safety, Inc. | System for non-invasive measurement of an analyte in a vehicle driver |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871224A (en) * | 1988-03-31 | 1989-10-03 | Siemens Aktiengesellschaft | Device for optical connections of one or more optical emitters with one or more optical detectors of one or more integrated circuits |
| US5170269A (en) * | 1991-05-31 | 1992-12-08 | Texas Instruments Incorporated | Programmable optical interconnect system |
| US5638469A (en) * | 1991-11-05 | 1997-06-10 | Mcnc | Microelectronic module having optical and electrical interconnects |
| US5764832A (en) * | 1993-03-24 | 1998-06-09 | Fujitsu Limited | Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove |
| JP2000040840A (en) * | 1998-07-22 | 2000-02-08 | Canon Inc | Surface type light emitting device, driving method thereof, light transmitter/receiver employing it, optical interconnection unit and optical recorder |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5093879A (en) * | 1990-06-22 | 1992-03-03 | International Business Machines Corporation | Electro-optical connectors |
| US5266794A (en) * | 1992-01-21 | 1993-11-30 | Bandgap Technology Corporation | Vertical-cavity surface emitting laser optical interconnect technology |
| JPH08235663A (en) * | 1995-02-24 | 1996-09-13 | Sony Corp | Optical element |
| US5978401A (en) * | 1995-10-25 | 1999-11-02 | Honeywell Inc. | Monolithic vertical cavity surface emitting laser and resonant cavity photodetector transceiver |
| US5912872A (en) * | 1996-09-27 | 1999-06-15 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
| US5771218A (en) * | 1996-09-27 | 1998-06-23 | Digital Optics Corporation | Passively aligned integrated optical head including light source, detector, and optical element and methods of forming same |
| JPH10126002A (en) * | 1996-10-23 | 1998-05-15 | Matsushita Electron Corp | Optical transmission module |
| JPH11311721A (en) * | 1998-02-27 | 1999-11-09 | Oki Electric Ind Co Ltd | Optical coupling module and its manufacture |
-
2001
- 2001-03-06 AU AU2001247286A patent/AU2001247286A1/en not_active Abandoned
- 2001-03-06 WO PCT/US2001/007053 patent/WO2001067144A2/en not_active Application Discontinuation
- 2001-03-06 EP EP01920210A patent/EP1269239A2/en not_active Withdrawn
- 2001-03-06 CA CA002401976A patent/CA2401976A1/en not_active Abandoned
- 2001-03-06 CN CNB018061753A patent/CN100354671C/en not_active Expired - Fee Related
- 2001-03-06 JP JP2001566062A patent/JP2003526909A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871224A (en) * | 1988-03-31 | 1989-10-03 | Siemens Aktiengesellschaft | Device for optical connections of one or more optical emitters with one or more optical detectors of one or more integrated circuits |
| US5170269A (en) * | 1991-05-31 | 1992-12-08 | Texas Instruments Incorporated | Programmable optical interconnect system |
| US5638469A (en) * | 1991-11-05 | 1997-06-10 | Mcnc | Microelectronic module having optical and electrical interconnects |
| US5764832A (en) * | 1993-03-24 | 1998-06-09 | Fujitsu Limited | Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove |
| JP2000040840A (en) * | 1998-07-22 | 2000-02-08 | Canon Inc | Surface type light emitting device, driving method thereof, light transmitter/receiver employing it, optical interconnection unit and optical recorder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003526909A (en) | 2003-09-09 |
| CA2401976A1 (en) | 2001-09-13 |
| EP1269239A2 (en) | 2003-01-02 |
| CN1419659A (en) | 2003-05-21 |
| AU2001247286A1 (en) | 2001-09-17 |
| WO2001067144A3 (en) | 2002-08-15 |
| WO2001067144A2 (en) | 2001-09-13 |
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