CN100343677C - Contact film probe and manufacturing method thereof - Google Patents
Contact film probe and manufacturing method thereof Download PDFInfo
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- CN100343677C CN100343677C CNB2005100552385A CN200510055238A CN100343677C CN 100343677 C CN100343677 C CN 100343677C CN B2005100552385 A CNB2005100552385 A CN B2005100552385A CN 200510055238 A CN200510055238 A CN 200510055238A CN 100343677 C CN100343677 C CN 100343677C
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- conductive layer
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Abstract
The present invention relates to a contact type film probe and a manufacturing method thereof. A plurality of signal conducting layers are arranged on one side of a high molecular base material, and the regional areas of all the signal conducting layers are respectively provided with a contact conducting layers; a buffer layer is arranged between each contact conducting layer and the base material in an overlapping mode, and an insulation layer is covered on the part of each signal conducting layer, which is not provided with a contact conducting layer. The buffer layers can be used for buffering to enable the contact conducting layers to be completely and uniformly forced, and because the buffer layers contact lines of a liquid crystal display, the force of the contact conducting layers directly contacting the liquid crystal display can be reduced. Thus, the efficacy of extending the service life can be reached.
Description
Technical field
The present invention relates to the film probe technical field of testing liquid crystal display, refer to that especially a kind of cushion of setting up is used as buffering, to reduce the power that contact conductive layer directly contacts, can increase the contact film probe and the manufacture method thereof in serviceable life.
Background technology
Press, the structure of traditional contact flexible film probe, it is circuit distribution according to LCD, directly make the film probe of one to one vertical element, and with its device on a specific tool, this probe directly directly contacts with the circuit of LCD, and contact back signal membership probe is imported and the primer fluid crystal display, more to differentiate quality by the situation of its demonstration.
The structure of existing contact flexible film probe is as Fig. 7 and shown in Figure 8, it mainly is to distribute according to the circuit of LCD in the one side of the base material 81 of a plastic cement system most bar signal conductive layers 82 are set, and one contact conductive layer 83 is set respectively and forms probe, and in the part that each signal conductive layer 82 is not provided with contact conductive layer 83 insulation course 84 that is covered in each signal conductive layer 82 1 end.
Because each layer thickness of structure of film probe is all in micron grade, its whole thickness is still considerably thin, therefore when contacting the circuit of LCD with film probe, as shown in Figure 9, need exert pressure and all can contact really with the circuit 91 of LCD 9 in the hope of each contact conductive layer 83 that makes slim probe.But contact conductive layer 83 is normally made with the Copper Foil material, therefore in the contact process of exerting pressure, the corner of the circuit 91 of LCD 9 produces local excessive abrasion to each contact conductive layer 83 and each signal conductive layer 82 easily, even cut-out contact conductive layer 83 and signal conductive layer 82, cause making signal can't normally be sent to the circuit of LCD, and take place to show or to show bad problem, and then influence is to the test effect of LCD, moreover each contact conductive layer 83 is worn away or also can be reduced its serviceable life by being fractureed, and increases use cost.
In view of the above, aforesaid film probe structure is real in addition improved necessity.
Summary of the invention
The purpose of this invention is to provide a kind of contact film probe and manufacture method thereof, it mainly sets up a cushion between base material and contact conductive layer, and can provide buffer action by cushion, reduce the directly power of contact of contact conductive layer and contact conductive layer can evenly stressedly comprehensively be contacted with the circuit of LCD, and can reach the effect that promotes serviceable life.
For reaching aforesaid purpose, contact film probe of the present invention comprises:
One base material is made by macromolecular material, and this base material has a faying face;
Plural number signal conductive layer is to distribute to be arranged at this faying face of this base material;
The plural number contact conductive layer is to be arranged at respectively this signal conductive layer respectively with respect to the local location of the one side of base material, and each contact conductive layer is to electrically connect with corresponding respectively this signal conductive layer respectively;
The plural number insulation course is to be arranged at the local location that each signal conductive layer is not provided with contact conductive layer respectively;
The plural number cushion is to be set at respectively respectively between this contact conductive layer and this base material, can provide buffer action by those cushions when making those contact conductive layer pressurizeds.
And the manufacture method of aforementioned contact film probe comprises the following steps:
Get the raw materials ready:
Take one by the made base material of macromolecular material;
Form cushion:
One cushion is set on this base material;
Form the signal conductive layer:
On this cushion and this base material, lay plural metal level, with respectively as a signal conductive layer;
Form contact conductive layer:
The part that corresponding respectively this signal conductive layer is coated on the cushion covers a contact conductive layer, and each contact conductive layer is to electrically connect with corresponding respectively this signal conductive layer;
Form insulation course:
The local location that contact conductive layer is not set in each the signal conductive layer insulation course that is covered.
By this, must in contact film probe, form cushion, and can reach aforesaid purpose.
Description of drawings
Fig. 1 is the sectional structure synoptic diagram of first embodiment of the invention.
Fig. 2 is the sectional structure synoptic diagram of another angle of first embodiment of the invention.
Fig. 3 is the schematic flow sheet of manufacture method of the present invention.
Fig. 4 is the sectional structure synoptic diagram of second embodiment of the invention.
Fig. 5 is the schematic flow sheet of second embodiment of the invention manufacture method.
Fig. 6 is the another kind of schematic flow sheet that forms cushion of the present invention.
Fig. 7 is the structural representation of existing contact flexible film probe.
Fig. 8 is the sectional structure synoptic diagram of existing contact flexible film probe.
Fig. 9 is the user mode synoptic diagram of existing contact flexible film probe.
Embodiment
See also Fig. 1, shown in Figure 2, the contact film probe of present embodiment comprises:
One base material 1 is made by macromolecular material, and has a faying face 11.
Plural number signal conductive layer 21 is to distribute to be arranged at the faying face 11 of this base material 1, and each signal conductive layer 21 be respectively by a first metal layer 211 and one second metal level 212 electrically connect form, and it is to combine with base material 1 with the first metal layer 211.
Plural number contact conductive layer 23 is to be arranged at the position of each signal conductive layer 21 relative (opposite) in corresponding each cushion 22 of the one side of base material respectively, and each contact conductive layer 23 is to form electric connections with corresponding respectively this signal conductive layer 21 respectively.
At least one insulation course 24 is to be arranged at the local location that this signal conductive layer 21 respectively is not provided with contact conductive layer 23.
Can provide buffer action by cushion 22 when by this, making each contact conductive layer 23 pressurized.
And the manufacture method of aforesaid contact film probe is as shown in Figure 3, in present embodiment be with photoresist as cushion 22, it comprises the following steps:
A gets the raw materials ready:
Take one by the made base material 1 of macromolecular material, this base material 1 can select for use wherein a kind of materials such as Polyimide (polyimide), poly-terephthaldehyde's diethylester (PET), polycarbonate (PC), polymethylmethacrylate (PMMA) or polysulfones made, and the faying face 11 of this base material 1 has set in advance a plurality of the first metal layers 211, and each the first metal layer 211 is to be made by any materials such as gold, silver, copper, nickel or aluminium.
B forms cushion:
The step that forms cushion is to comprise follow procedure:
The coating photoresistance:
Coating one photoresist layer 31 on each the first metal layer 211, this photoresist layer be eurymeric photoresistance and minus photoresistance one of them.
Exposure:
Take a light shield 32, this light shield 32 has the pattern that corresponding each the first metal layer 211 is provided with, and then hides in photoresist layer 31 tops with light shield 32 and exposes.
Develop:
C forms the signal conductive layer:
On cushion 22 with each the first metal layer 211 in folded respectively one second metal level 212 of establishing of the local location of this cushion periphery, each the first metal layer 211 and each second metal level 212 are to electrically connect and form this signal conductive layer 21.
D forms contact conductive layer:
Forming in the step of contact conductive layer is in second metal level, 212 surfaces of this signal conductive layer 21 respectively a contact conductive layer 23 to be set, and each contact conductive layer 23 is and corresponding respectively this signal conductive layer 21 electrically connects.
E forms insulation course:
The local location that contact conductive layer 23 is not set in each signal conductive layer 21 insulation course 24 that is covered.
Because each cushion 22 is formed by the rubber-like photoresistance, therefore exerting pressure when each contact conductive layer 23 is contacted with the circuit of LCD, can form buffer action by each cushion 22 stress deformation, buffer action makes each contact conductive layer 23 evenly stressed comprehensively by this, avoiding each contact conductive layer 23 to produce the excessively problem of abrasion greatly, and can reach the effect in the serviceable life of lifting contact film probe because of the direct contact force of part.
Certainly, still there are many examples in the present invention, and it asks the variation on the details only.See also Fig. 4, it is the second embodiment of the present invention, wherein each cushion 22A is arranged at respectively between each signal conductive layer 21A and the base material 1A, on each signal conductive layer 21A, fold respectively again and establish contact conductive layer 23A, so can provide the effect of buffering by cushion 22A equally, and reach identical effect with aforementioned first embodiment.
The manufacture method of second embodiment of the invention is as shown in Figure 5, in present embodiment be with photoresist as cushion 22, it comprises the following steps:
A gets the raw materials ready:
Take one by the made base material 1A of macromolecular material.
B forms cushion:
One cushion 22A is set on base material 1A, comprises follow procedure:
The coating photoresistance:
Go up coating one photoresist layer 31A in base material 1A.
Exposure:
Take a light shield 32A, this light shield 32A is provided with pattern, then hides in photoresist layer 31A top with light shield 32A and exposes.
Develop:
C forms the signal conductive layer:
Go up to lay plural number in base material 1A and be coated on metal level on the cushion 22A, with respectively as a signal conductive layer 21A.
D forms contact conductive layer:
The part that corresponding respectively this signal conductive layer 21A is coated on the cushion 22A covers a contact conductive layer 23A, and each contact conductive layer 23A electrically connects with corresponding respectively this signal conductive layer 21A.
E forms insulation course:
The local location that contact conductive layer 23A is not set in this signal conductive layer 21A respectively insulation course 24A that is covered.
Can make as shown in Figure 4 contact film probe structure via above-mentioned steps, and reach identical effect with aforementioned first embodiment.
And the step of formation cushion except aforesaid program, can also adopt program as shown in Figure 6 to finish, and comprising:
The coating photoresistance:
In respectively being coated with a photoresist layer 31B on this signal conductive layer 21B.
Exposure:
Take a light shield 32B, this light shield 32B has the pattern that corresponding each signal conductive layer 21B is provided with, and then hides with light shield 32B and exposes, develops in photoresist layer 31B top and form plural recess C.
Etching:
Each recess C to the back of exposing carries out etching, and forms an etched part D in each signal conductive layer 21B.
Fill fender:
In formed each the recess C of etching, each etched part D, fill padded coaming, with as aforesaid cushion 22B: and padded coaming can select for use epoxy resin, phenolics, polyvinyl acetate (PVA) latex (PAC) resin, acryl resin, tert-butoxy acyl group (t-BOC) resin, polycarboxylated styrene (PHS) resin, cycloolefin/maleic anhydride fluoropolymer resin, cyclenes hydrogen (Cyclic Olefin) resin or Polyimide (polyimide) to wait any elastic plastic material.
Remove photoresistance:
The photoresistance 31B on each signal conductive layer 21B surface is removed, make each cushion 22B protrude from each signal conductive layer surface.
This step that forms cushion also can be applied on the first metal layer among aforementioned first embodiment except being applied to signal conductive layer 21B, forms the cushion step with the B in the manufacture method that replaces first embodiment, and reaches identical effect.
After finishing cushion via said procedure, can cooperate aforesaid manufacture method to continue and finish follow-up work, and make contact film probe with cushion, and can provide effective buffer action equally by the cushion that elastic plastic material is made, and reach identical effect with aforementioned first embodiment.
Moreover employed photoresistance is to select eurymeric photoresistance or minus photoresistance for use in the manufacture method of aforementioned each embodiment, and the effect of its gained is the same.
To sum up, structure of the present invention can reach the effect in the serviceable life that promotes film probe really.
Claims (15)
1, a kind of contact film probe is characterized in that, it comprises:
One base material is made by macromolecular material, and this base material has a faying face;
Plural number signal conductive layer is arranged in this faying face of this base material;
The plural number contact conductive layer is to be arranged at respectively this signal conductive layer respectively with respect to the local location of the one side of this base material, and respectively this contact conductive layer is to electrically connect with corresponding respectively this signal conductive layer respectively; And
The plural number cushion is to be set at respectively respectively between this contact conductive layer and this base material, can provide buffer action by those cushions when making those contact conductive layer pressurizeds.
2, contact film probe as claimed in claim 1, it is characterized in that, wherein respectively this signal conductive layer is to comprise a first metal layer and one second metal level respectively, this the first metal layer and this second metal level are to fold to establish and electrically connect, and this cushion is to be set between this first metal layer and this second metal level.
3, contact film probe as claimed in claim 1 is characterized in that, wherein respectively this cushion is to be arranged at respectively respectively between this signal conductive layer and this base material.
4, contact film probe as claimed in claim 1 is characterized in that, wherein this base material is made by Polyimide, poly-terephthaldehyde's diethylester, polycarbonate, polymethylmethacrylate or wherein a kind of material of polysulfones.
5, contact film probe as claimed in claim 1 is characterized in that, wherein each signal conductive layer is to be gold, silver, copper, nickel or aluminium material.
6, contact film probe as claimed in claim 1; it is characterized in that, wherein each cushion be for photoresist, epoxy resin, phenolics, polyvinyl acetate (PVA) latex resin, acryl resin, tert-butoxy acyl group resin, polyhydroxystyrene resin, cycloolefin/maleic anhydride fluoropolymer resin, cyclenes hydrogen resin or Polyimide elastic plastic material made.
7, contact film probe as claimed in claim 1 is characterized in that, wherein more comprises at least one insulation course, is to be coated on the part that those signal conductive layers are not provided with contact conductive layer.
8, contact film probe as claimed in claim 1 is characterized in that, wherein more comprises at least one insulation course, is to be arranged at the local location that each signal conductive layer is not provided with contact conductive layer respectively.
9, a kind of manufacture method of contact film probe, it comprises the following steps: at least
Get the raw materials ready:
Take one by the made base material of macromolecular material;
Form cushion:
One cushion is set on this base material;
Form the signal conductive layer:
On this cushion and this base material, lay plural metal level, with respectively as a signal conductive layer;
Form contact conductive layer:
The part that corresponding respectively this signal conductive layer is coated on the cushion covers a contact conductive layer, and each contact conductive layer is to electrically connect with corresponding respectively this signal conductive layer;
Form insulation course:
The local location that contact conductive layer is not set in each the signal conductive layer insulation course that is covered.
10, the manufacture method of contact film probe as claimed in claim 9 is characterized in that, the step that wherein forms this cushion is to comprise follow procedure:
The coating photoresistance:
Coating one photoresist layer on base material;
Exposure:
Take a light shield, this light shield is provided with pattern, then hides in this photoresist layer top with this light shield and exposes;
Develop:
This photoresist layer after the exposure is developed, and on this base material, stay plural number section photoresist layer as cushion.
11, the manufacture method of contact film probe as claimed in claim 10 is characterized in that, wherein this photoresist layer be eurymeric photoresistance and minus photoresistance one of them.
12, a kind of manufacture method of contact film probe, it comprises the following steps: at least
Get the raw materials ready:
Take one by the made base material of macromolecular material, and the one side of this base material is folded is provided with plural the first metal layer;
The coating photoresistance:
Coating one photoresist layer on each the first metal layer;
Exposure imaging:
Take a light shield, this light shield has pattern, exposes, develops in photoresist layer top and form plural recess and hide with light shield;
Etching:
Each recess after the exposure is carried out etching;
Fill fender:
In formed each etched part of etching, fill padded coaming, to form a cushion respectively;
Remove photoresistance:
The photoresistance on each the first metal layer surface is removed, made each cushion protrude from each the first metal layer surface;
Form the signal conductive layer:
Folded respectively one second metal level of establishing in this cushion and each the first metal layer surface, each the first metal layer and each second metal level are electric connections and form a signal conductive layer;
Form contact conductive layer:
The part that corresponding each signal conductive layer is coated on the cushion covers a contact conductive layer, and each contact conductive layer is to electrically connect with each signal conductive layer;
Form insulation course:
The local location that contact conductive layer is not set in each the signal conductive layer insulation course that is covered.
13, a kind of manufacture method of contact film probe, it comprises the following steps: at least
Get the raw materials ready:
Take one by the made base material of macromolecular material, and the one side of this base material is folded is provided with plural the first metal layer;
Form cushion:
The folded cushion of establishing on each the first metal layer;
Form the signal conductive layer:
Folded respectively one second metal level of establishing in this cushion and each the first metal layer surface, each the first metal layer and each second metal level are electric connections and form a signal conductive layer respectively;
Form contact conductive layer:
Corresponding each cushion is provided with a contact conductive layer on each signal conductive layer, and each contact conductive layer is to electrically connect with each signal conductive layer;
Form insulation course:
The local location that contact conductive layer is not set in each the signal conductive layer insulation course that is covered.
14, the manufacture method of contact film probe as claimed in claim 13 is characterized in that, the step that wherein forms cushion is to comprise follow procedure:
The coating photoresistance:
Coating one photoresist layer on each the first metal layer;
Exposure:
Take a light shield with pattern, and hide in the photoresist layer top with light shield and to expose;
Develop:
Photoresist layer after the exposure is developed, and form cushion.
15, the manufacture method of contact film probe as claimed in claim 13 is characterized in that, the step that wherein forms cushion is to comprise follow procedure:
The coating photoresistance:
Coating one photoresist layer on each the first metal layer;
Exposure:
Take a light shield with pattern, and hide with light shield and to expose, to develop in the photoresist layer top and form plural recess;
Etching:
Each recess after the exposure is carried out etching;
Fill fender:
In formed each etched part of etching, fill padded coaming, with as aforesaid cushion;
Remove photoresistance:
The photoresistance on each the first metal layer surface is removed, made each cushion protrude from each the first metal layer surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100552385A CN100343677C (en) | 2005-03-16 | 2005-03-16 | Contact film probe and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100552385A CN100343677C (en) | 2005-03-16 | 2005-03-16 | Contact film probe and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1654964A CN1654964A (en) | 2005-08-17 |
| CN100343677C true CN100343677C (en) | 2007-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100552385A Expired - Fee Related CN100343677C (en) | 2005-03-16 | 2005-03-16 | Contact film probe and manufacturing method thereof |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100955597B1 (en) * | 2009-08-11 | 2010-05-03 | (주)메리테크 | Probe manufacturing methods using semiconductor or display panel device test |
| JP2011149938A (en) * | 2010-01-22 | 2011-08-04 | Kodi-S Co Ltd | Film type probe unit, and method of manufacturing the same |
| TWI506508B (en) | 2014-04-10 | 2015-11-01 | Ind Tech Res Inst | Touch sensing structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10132854A (en) * | 1996-10-29 | 1998-05-22 | Matsushita Electron Corp | Contactor and forming method for contactor |
| JP2001324517A (en) * | 1994-02-21 | 2001-11-22 | Hitachi Ltd | Manufacturing method of semiconductor device |
| CN1431693A (en) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | Wafer class probe card and its mfg. method |
-
2005
- 2005-03-16 CN CNB2005100552385A patent/CN100343677C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001324517A (en) * | 1994-02-21 | 2001-11-22 | Hitachi Ltd | Manufacturing method of semiconductor device |
| JPH10132854A (en) * | 1996-10-29 | 1998-05-22 | Matsushita Electron Corp | Contactor and forming method for contactor |
| CN1431693A (en) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | Wafer class probe card and its mfg. method |
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| Publication number | Publication date |
|---|---|
| CN1654964A (en) | 2005-08-17 |
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