CH719817A2 - Iridescent article and its manufacturing process - Google Patents
Iridescent article and its manufacturing process Download PDFInfo
- Publication number
- CH719817A2 CH719817A2 CH000765/2022A CH7652022A CH719817A2 CH 719817 A2 CH719817 A2 CH 719817A2 CH 000765/2022 A CH000765/2022 A CH 000765/2022A CH 7652022 A CH7652022 A CH 7652022A CH 719817 A2 CH719817 A2 CH 719817A2
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000010410 layer Substances 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000002356 single layer Substances 0.000 claims abstract description 18
- 230000000694 effects Effects 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 230000008021 deposition Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- 150000002222 fluorine compounds Chemical class 0.000 claims description 2
- 238000010147 laser engraving Methods 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910052681 coesite Inorganic materials 0.000 claims 3
- 229910052906 cristobalite Inorganic materials 0.000 claims 3
- 229910052682 stishovite Inorganic materials 0.000 claims 3
- 229910052905 tridymite Inorganic materials 0.000 claims 3
- 150000002739 metals Chemical class 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 12
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- 239000010437 gem Substances 0.000 description 2
- 229910001751 gemstone Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910003864 HfC Inorganic materials 0.000 description 1
- 229910004542 HfN Inorganic materials 0.000 description 1
- -1 Se2O3 Chemical compound 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
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- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B45/00—Time pieces of which the indicating means or cases provoke special effects, e.g. aesthetic effects
- G04B45/0015—Light-, colour-, line- or spot-effects caused by or on stationary parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
- B05D5/065—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects having colour interferences or colour shifts or opalescent looking, flip-flop, two tones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44F—SPECIAL DESIGNS OR PICTURES
- B44F1/00—Designs or pictures characterised by special or unusual light effects
- B44F1/08—Designs or pictures characterised by special or unusual light effects characterised by colour effects
- B44F1/14—Iridescent effects
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/06—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/285—Interference filters comprising deposited thin solid films
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/285—Interference filters comprising deposited thin solid films
- G02B5/286—Interference filters comprising deposited thin solid films having four or fewer layers, e.g. for achieving a colour effect
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
L'invention concerne un article avec une couleur irisée obtenue par effet interférentiel, ledit article comprenant un substrat (2) recouvert d'une seule couche ou d'un empilement (3) de couches avec au moins deux couches, ladite seule couche ou ledit empilement (3) ayant une épaisseur variable donnant cette couleur irisée. La présente invention se rapporte également au procédé de fabrication dudit article.The invention relates to an article with an iridescent color obtained by interference effect, said article comprising a substrate (2) covered with a single layer or a stack (3) of layers with at least two layers, said single layer or said stack (3) having a variable thickness giving this iridescent color. The present invention also relates to the method of manufacturing said article.
Description
Domaine technique de l'inventionTechnical field of the invention
[0001] La présente invention se rapporte à un article et notamment à un composant horloger d'habillage ou du mouvement, présentant un effet irisé. Elle se rapporte également au procédé de fabrication dudit article. [0001] The present invention relates to an article and in particular to a watch component covering or the movement, presenting an iridescent effect. It also relates to the manufacturing process of said article.
Arrière-plan technologiqueTechnology background
[0002] La création de couleurs par interférence de la lumière réfléchie sur des structures multicouches est connue. Dans l'art antérieur, on connait plusieurs documents utilisant l'effet interférentiel pour réaliser un article dans une couleur donnée. On peut par exemple citer le document EP 3 608 728 qui divulgue un ressort spiral thermocompensé et coloré pour pièce d'horlogerie comprenant une âme en silicium avec sur au moins une face destinée à être visible après assemblage au sein de la pièce d'horlogerie une couche interférentielle en oxyde de silicium, la couche interférentielle ayant une épaisseur inférieure ou égale à 1 µm conférant à ladite face une couleur par effet interférentiel. The creation of colors by interference of light reflected on multilayer structures is known. In the prior art, several documents are known using the interference effect to produce an article in a given color. We can for example cite document EP 3 608 728 which discloses a thermocompensated and colored spiral spring for a timepiece comprising a silicon core with on at least one face intended to be visible after assembly within the timepiece a interference layer made of silicon oxide, the interference layer having a thickness less than or equal to 1 µm giving said face a color by interference effect.
[0003] Aucun de ces documents connus ne propose un article multicolore. [0003] None of these known documents proposes a multicolor article.
Résumé de l'inventionSummary of the invention
[0004] La présente invention a ainsi pour objet de proposer un article multicolore. Plus précisément, elle se rapporte à un article présentant une couleur irisée par effet interférentiel. On entend par l'adjectif irisé ou par le nom irisation que l'article a un reflet rappelant les couleurs de l'arc en ciel. [0004] The present invention therefore aims to provide a multi-colored article. More precisely, it relates to an article presenting an iridescent color due to interference effect. By the adjective iridescent or by the noun iridescence we mean that the article has a reflection reminiscent of the colors of the rainbow.
[0005] Plus spécifiquement, la présente invention se rapporte à un article avec une couleur irisée obtenue par effet interférentiel, ledit article comprenant un substrat recouvert d'une seule couche ou d'un empilement de couches avec au moins deux couches, ladite seule couche ou ledit empilement ayant une épaisseur variable donnant cette couleur irisée. [0005] More specifically, the present invention relates to an article with an iridescent color obtained by interference effect, said article comprising a substrate covered with a single layer or a stack of layers with at least two layers, said single layer or said stack having a variable thickness giving this iridescent color.
[0006] En effet, afin de créer un effet d'irisation, il faut que le chemin parcouru par la lumière dans la matière soit différent. C'est le cas par exemple lors de l'utilisation d'un prisme pour décomposer la lumière en différentes couleurs. La différence de chemin due à l'indice de réfraction permet de décomposer la lumière en bleu à rouge. En déposant des couches minces transparentes sur le substrat avec un empilement des couches d'épaisseur non constante, il est possible d'obtenir une couleur interférentielle différente selon la position en regard de l'empilement. Pour obtenir cet effet, le procédé doit être maîtrisé afin de reproduire ces variations d'épaisseur d'un article à un autre ou au contraire de créer des pièces uniques. [0006] Indeed, in order to create an iridescence effect, the path traveled by the light in the material must be different. This is the case, for example, when using a prism to break up light into different colors. The difference in path due to the refractive index allows light to be broken down into blue to red. By depositing thin transparent layers on the substrate with a stack of layers of non-constant thickness, it is possible to obtain a different interference color depending on the position opposite the stack. To obtain this effect, the process must be mastered in order to reproduce these variations in thickness from one item to another or, on the contrary, to create unique pieces.
[0007] La présente invention se rapporte ainsi également au procédé de fabrication dudit article. Selon une variante, l'épaisseur variable de la seule couche ou de l'empilement est obtenue lors du dépôt en utilisant un cache ou un masque pour cacher un ou plusieurs endroits lors du dépôt de chaque couche ou de certaines couches de l'empilement ou en posant le substrat sur un support non plan. Selon une autre variante, la seule couche ou l'empilement de couches obtenu à l'issue de l'étape de dépôt a une épaisseur sensiblement constante, et la variation d'épaisseur est réalisée en structurant ultérieurement la seule couche ou l'empilement de couches. [0007] The present invention thus also relates to the method of manufacturing said article. According to a variant, the variable thickness of the single layer or the stack is obtained during deposition by using a cache or a mask to hide one or more locations during the deposition of each layer or certain layers of the stack or by placing the substrate on a non-planar support. According to another variant, the single layer or the stack of layers obtained at the end of the deposition step has a substantially constant thickness, and the variation in thickness is achieved by subsequently structuring the single layer or the stack of layers. layers.
[0008] D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui va suivre, en référence aux dessins annexés. Other characteristics and advantages of the invention will appear on reading the detailed description which follows, with reference to the appended drawings.
Brève description des figuresBrief description of the figures
[0009] La figure 1 représente schématiquement l'empilement de couches avec une épaisseur variable pour obtenir l'effet irisé selon l'invention. [0009] Figure 1 schematically represents the stack of layers with a variable thickness to obtain the iridescent effect according to the invention.
[0010] La figure 2 représente une vue schématique de l'étape de dépôt des couches pour former un empilement. [0010] Figure 2 shows a schematic view of the step of depositing the layers to form a stack.
[0011] La figure 3 représente schématiquement une étape de dépôt des couches avec un cache ou un masque pour faire varier l'épaisseur de la couche déposée. [0011] Figure 3 schematically represents a layer deposition step with a cover or a mask to vary the thickness of the deposited layer.
[0012] La figure 4 est une autre variante avec le positionnement du substrat sur un support incliné pour faire varier l'épaisseur de la couche. Figure 4 is another variant with the positioning of the substrate on an inclined support to vary the thickness of the layer.
[0013] La figure 5 représente une lunette irisée réalisée avec le procédé selon l'invention. [0013] Figure 5 represents an iridescent glasses produced with the method according to the invention.
Description détaillée de l'inventionDetailed description of the invention
[0014] La présente invention se rapporte à un article avec une couleur irisée obtenue par effet interférentiel. Concernant l'article, il peut s'agir d'un élément constitutif de montres, bijoux, bracelets, etc. ou plus généralement d'une partie externe d'un élément portable comme une coque d'un téléphone mobile. Dans le domaine horloger, cet article peut être un composant d'habillage tel qu'une carrure, un fond, une lunette, un poussoir, un maillon de bracelet, un cadran, une aiguille, un index de cadran, etc. De préférence, il s'agit d'une lunette transparente qui présente cet effet irisé. A titre illustratif, une lunette 1 avec une couleur irisée selon l'invention est représentée schématiquement à la figure 5. Il peut également s'agir d'un composant du mouvement tel qu'une platine, une masse oscillante ou un ressort spiral. The present invention relates to an article with an iridescent color obtained by interference effect. Regarding the item, it may be a constituent element of watches, jewelry, bracelets, etc. or more generally of an external part of a portable element such as a shell of a mobile telephone. In the watchmaking field, this article can be a trim component such as a caseband, a back, a bezel, a pusher, a bracelet link, a dial, a hand, a dial index, etc. Preferably, it is a transparent bezel that has this iridescent effect. As an illustration, a bezel 1 with an iridescent color according to the invention is shown schematically in Figure 5. It can also be a component of the movement such as a plate, an oscillating mass or a spiral spring.
[0015] Selon l'invention, l'article est muni d'un substrat 2 sur lequel est déposée au moins une couche 4. L'ensemble des couches 4 forme un empilement 3. Par extension, ci-dessous, on parlera d'empilement même s'il y a une seule couche. Selon l'invention, cet empilement a une épaisseur variable tel que schématisé à la figure 1. On s'attachera ici plus à définir l'invention en fonction de l'épaisseur de l'empilement plutôt que de l'épaisseur de chaque couche. En effet, il pourrait s'avérer complexe sur le produit final de déterminer l'épaisseur, voire l'épaisseur moyenne, pour chaque couche individuelle ou encore la composition de chaque couche. Cela nécessite des techniques telles que le Tof-SIMS, le SEM avec une spectroscopie de rayons X à dispersion de longueur d'onde ou 'Wavelength Dispersive spectroscopy' (WDS) pour analyser chaque couche en coupe. [0015] According to the invention, the article is provided with a substrate 2 on which at least one layer 4 is deposited. All of the layers 4 form a stack 3. By extension, below, we will speak of stacking even if there is only one layer. According to the invention, this stack has a variable thickness as shown schematically in Figure 1. Here we will focus more on defining the invention as a function of the thickness of the stack rather than the thickness of each layer. Indeed, it could prove complex on the final product to determine the thickness, or even the average thickness, for each individual layer or even the composition of each layer. This requires techniques such as Tof-SIMS, SEM with Wavelength Dispersive Spectroscopy (WDS) to analyze each layer in cross-section.
[0016] Ainsi, l'empilement a une épaisseur non constante qui confère cet effet irisé à l'article. On entend par non constante une variation d'au moins 2% par rapport à l'épaisseur maximum. Ainsi, si Y est l'épaisseur maximum de la couche, l'épaisseur de la couche est considérée non constante si cette épaisseur est inférieure ou égale à 0.98*Y en un ou plusieurs endroits. Par exemple, si l'épaisseur maximum est de 10 µm, on considérera que la couche a une épaisseur non constante si elle est inférieure ou égale à 9.8 µm en un ou plusieurs points de l'empilement. Typiquement, l'empilement a une épaisseur maximum Y comprise entre 200 nm et 20 µm, entre 200 nm et 10 µm, entre 200 nm et 5 µm, entre 200 nm et 1,5 µm. De préférence, il a une épaisseur maximum Y comprise entre 500 nm et 1.5 µm. Sur toute la surface du substrat, l'empilement a une épaisseur variable comprise entre 0 et cette valeur maximale de 20 µm, 10 µm, 5 µm et 1,5 µm. En effet, il ne peut pas être exclu qu'en certains points, le substrat soit dépourvu de couches déposées. De préférence, l'empilement a une épaisseur variable comprise entre 100 nm et 20 µm. Plus préférentiellement, il a une épaisseur variable comprise entre 500 nm et 10 µm, voire 5 µm. Encore plus préférentiellement, il a une épaisseur variable comprise entre 500 nm et 1.5 µm. [0016] Thus, the stack has a non-constant thickness which gives this iridescent effect to the article. By non-constant we mean a variation of at least 2% compared to the maximum thickness. Thus, if Y is the maximum thickness of the layer, the thickness of the layer is considered non-constant if this thickness is less than or equal to 0.98*Y in one or more places. For example, if the maximum thickness is 10 µm, we will consider that the layer has a non-constant thickness if it is less than or equal to 9.8 µm at one or more points of the stack. Typically, the stack has a maximum thickness Y of between 200 nm and 20 µm, between 200 nm and 10 µm, between 200 nm and 5 µm, between 200 nm and 1.5 µm. Preferably, it has a maximum thickness Y of between 500 nm and 1.5 µm. Over the entire surface of the substrate, the stack has a variable thickness between 0 and this maximum value of 20 µm, 10 µm, 5 µm and 1.5 µm. Indeed, it cannot be excluded that at certain points, the substrate is devoid of deposited layers. Preferably, the stack has a variable thickness of between 100 nm and 20 μm. More preferably, it has a variable thickness of between 500 nm and 10 µm, or even 5 µm. Even more preferably, it has a variable thickness of between 500 nm and 1.5 µm.
[0017] De préférence, le nombre de couches au sein de l'empilement est compris entre 1 et 1000, de préférence entre 2 et 100, et plus préférentiellement entre 20 et 50. Typiquement, chaque couche a une épaisseur moyenne comprise entre 1 nm et 900 nm, de préférence entre 100 nm et 500 nm. Au sein de l'empilement, chaque couche a une épaisseur variable. Il est également envisageable que certaines couches aient une épaisseur constante pour autant que l'empilement ait au final une épaisseur variable. [0017] Preferably, the number of layers within the stack is between 1 and 1000, preferably between 2 and 100, and more preferably between 20 and 50. Typically, each layer has an average thickness of between 1 nm and 900 nm, preferably between 100 nm and 500 nm. Within the stack, each layer has a variable thickness. It is also possible for certain layers to have a constant thickness provided that the stack ultimately has a variable thickness.
[0018] Le profil de l'empilement peut être divers. A la figure 1, il est représenté à titre illustratif avec une forme sinusoïdale. Toute forme est envisageable pour autant que l'empilement ait une épaisseur non constante. Il peut, par exemple, s'agir d'une forme avec une épaisseur variant de manière linéaire ou encore en triangle. [0018] The profile of the stack can be diverse. In Figure 1, it is shown for illustration purposes with a sinusoidal shape. Any shape is possible as long as the stack has a non-constant thickness. It can, for example, be a shape with a thickness varying linearly or even in a triangle.
[0019] Chaque couche peut être une couche transparente, translucide, ou semi-transparente. Il peut s'agir par exemple d'oxydes, de nitrures, de fluorures choisis parmi le TiO2, Ta2O5, SiO2, Al2O3, MgF2, AlN, Ta2O5, Si3N4, ZnS, ZnO, ZrO2, Cr2O3, CeO2, Y2O3, HfN, HfC, HfO2, La2O3, MgO, Sb2O3, SiO, Se2O3, SnO2et le WO3. Il pourrait également s'agir de couches métalliques avec un métal choisi, par exemple, parmi l'Au, Cr, Ti, Al et Ta ou encore d'un semi-conducteur comme le Si. [0019] Each layer can be a transparent, translucent, or semi-transparent layer. These may for example be oxides, nitrides, fluorides chosen from TiO2, Ta2O5, SiO2, Al2O3, MgF2, AlN, Ta2O5, Si3N4, ZnS, ZnO, ZrO2, Cr2O3, CeO2, Y2O3, HfN, HfC , HfO2, La2O3, MgO, Sb2O3, SiO, Se2O3, SnO2 and WO3. It could also be metallic layers with a metal chosen, for example, from Au, Cr, Ti, Al and Ta or even a semiconductor such as Si.
[0020] Préférentiellement, l'empilement alterne une couche à haut indice de réfraction, c.à.d. supérieur à 2 (pour une longueur d'onde de 550 nm), avec une couche à faible indice, c.à.d. inférieur à 1.7 (pour une longueur d'onde de 550 nm). Par exemple, il peut s'agir d'une alternance de couches de TiO2/SiO2ou de Ta2O5/SiO2. Il est également envisageable d'alterner une couche à haut indice de réfraction, c.à.d. supérieur à 2, avec une couche à indice moyen c.à.d. compris entre 1.7 et 2, avec une couche à faible indice, c.à.d. inférieur à 1.7 (toujours pour une longueur d'onde de 550 nm). Par exemple, il peut s'agir d'une alternance de couches de TiO2/Al2O3/SiO2. Preferably, the stack alternates a layer with a high refractive index, i.e. greater than 2 (for a wavelength of 550 nm), with a low index layer, i.e. less than 1.7 (for a wavelength of 550 nm). For example, it can be an alternation of layers of TiO2/SiO2 or Ta2O5/SiO2. It is also possible to alternate a layer with a high refractive index, i.e. greater than 2, with a medium index layer, i.e. between 1.7 and 2, with a low index layer, i.e. less than 1.7 (still for a wavelength of 550 nm). For example, it can be an alternation of layers of TiO2/Al2O3/SiO2.
[0021] Le substrat peut être de tout type, par ex. métallique, céramique ou polymérique. Il pourrait également s'agir d'un substrat réalisé dans une pierre précieuse ou semi-précieuse telle que le saphir. S'il est transparent, les différentes couches peuvent être directement déposées sur le substrat. L'effet irisé peut être visible sur la face où les différentes couches sont déposées ou au travers du substrat. Si le substrat est opaque, par ex. dans le cas d'une céramique ou d'un métal, il est nécessaire d'avoir une interface miroir afin de créer une réflexion de la lumière sur la surface et d'avoir les couleurs interférentielles. Typiquement, il s'agit d'une couche métallique de Ti, Cr ou Ag pour créer cette interface miroir. [0021] The substrate can be of any type, for example. metallic, ceramic or polymeric. It could also be a substrate made of a precious or semi-precious stone such as sapphire. If it is transparent, the different layers can be directly deposited on the substrate. The iridescent effect can be visible on the side where the different layers are deposited or through the substrate. If the substrate is opaque, e.g. in the case of a ceramic or a metal, it is necessary to have a mirror interface in order to create a reflection of light on the surface and to have interference colors. Typically this is a metallic layer of Ti, Cr or Ag to create this mirror interface.
[0022] La déposition des couches peut être réalisée par différentes méthodes incluant le PVD (pour Physical Vapor Déposition en anglais), le CVD (pour Chemical Vapor Déposition en anglais), le sol-gel ou l'ALD (pour Atomic Layer Déposition en anglais). La variation de l'épaisseur peut être réalisée lors du dépôt ou ultérieurement par structuration de la couche lorsqu'il y a une seule couche ou des couches déposées lorsqu'il y a plusieurs couches. Selon la première variante consistant à varier l'épaisseur lors du dépôt, il y a plusieurs techniques. Une technique consiste à incliner la pièce de manière à réaliser une variation plus ou moins linéaire de l'épaisseur. Ainsi, tel que schématisé à la figure 4, le substrat 2 est déposé sur un support 6 incliné. Une autre technique consiste à utiliser un masque ou cache 5 pour obstruer certaines zones lors du dépôt (figure 3). Le masque peut être une laque, un adhésif, un film photosensible, etc. Il peut être déposé à titre d'exemple par photolithographie, stéréolithographie, impression numérique ou manuellement pour un adhésif ou film qui s'apparente alors à un cache. Une autre technique consiste à créer un ombrage du substrat lors du dépôt en utilisant un masque qui modifie la dynamique des flux de matière qui arrivent sur la surface et donc l'épaisseur. Selon la deuxième variante, plusieurs techniques peuvent être utilisées pour structurer la seule couche ou les couches déposées après le dépôt. On peut entre autres citer la gravure laser, la photolithographie. [0022] The deposition of the layers can be carried out by different methods including PVD (for Physical Vapor Deposition in English), CVD (for Chemical Vapor Deposition in English), sol-gel or ALD (for Atomic Layer Deposition in English). English). The variation in thickness can be carried out during deposition or subsequently by structuring the layer when there is a single layer or layers deposited when there are several layers. According to the first variant consisting of varying the thickness during deposition, there are several techniques. One technique consists of tilting the part so as to achieve a more or less linear variation in thickness. Thus, as shown schematically in Figure 4, the substrate 2 is deposited on an inclined support 6. Another technique consists of using a mask or cover 5 to obstruct certain areas during deposition (figure 3). The mask may be a lacquer, an adhesive, a photosensitive film, etc. For example, it can be deposited by photolithography, stereolithography, digital printing or manually for an adhesive or film which then resembles a cover. Another technique consists of creating shading of the substrate during deposition using a mask which modifies the dynamics of the material flows arriving on the surface and therefore the thickness. According to the second variant, several techniques can be used to structure the single layer or the layers deposited after deposition. We can, among others, cite laser engraving and photolithography.
[0023] Des essais ont été réalisés sur des lunettes avec un substrat en saphir. Des couches alternées de dioxyde de silicium (SiO2) et de pentoxyde de tantale (Ta2O5) ont été déposées par PVD. Le nombre de couches était compris entre 20 et 50 avec une épaisseur maximum Y de l'empilement comprise entre 800 nm et 1.5 µm. Les lunettes ainsi réalisées présentaient un très bel effet irisé. [0023] Tests were carried out on glasses with a sapphire substrate. Alternating layers of silicon dioxide (SiO2) and tantalum pentoxide (Ta2O5) were deposited by PVD. The number of layers was between 20 and 50 with a maximum thickness Y of the stack between 800 nm and 1.5 µm. The glasses thus produced had a very beautiful iridescent effect.
Claims (19)
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