CH719605A1 - Flexible multilayer structure and method of manufacturing such structure. - Google Patents
Flexible multilayer structure and method of manufacturing such structure. Download PDFInfo
- Publication number
- CH719605A1 CH719605A1 CH000440/2022A CH4402022A CH719605A1 CH 719605 A1 CH719605 A1 CH 719605A1 CH 000440/2022 A CH000440/2022 A CH 000440/2022A CH 4402022 A CH4402022 A CH 4402022A CH 719605 A1 CH719605 A1 CH 719605A1
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- Switzerland
- Prior art keywords
- layer
- passivation
- polyamide
- adherent
- substrate
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000002161 passivation Methods 0.000 claims abstract description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000001464 adherent effect Effects 0.000 claims abstract description 16
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 6
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 6
- 239000001257 hydrogen Substances 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 239000001301 oxygen Substances 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 5
- -1 polydimethylsiloxane Polymers 0.000 claims description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229920000299 Nylon 12 Polymers 0.000 claims description 4
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920002292 Nylon 6 Polymers 0.000 claims description 2
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 229920006018 co-polyamide Polymers 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000007791 liquid phase Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000011859 microparticle Substances 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 claims 1
- 239000002077 nanosphere Substances 0.000 claims 1
- 239000002071 nanotube Substances 0.000 claims 1
- 239000002070 nanowire Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 42
- 239000002904 solvent Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 239000013047 polymeric layer Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
- H05B3/36—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
- H05B3/36—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
- H05B3/38—Powder conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/28—Multiple coating on one surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/58—Cuttability
- B32B2307/581—Resistant to cut
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/584—Scratch resistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2313/00—Elements other than metals
- B32B2313/04—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2204/00—Structure or properties of graphene
- C01B2204/20—Graphene characterized by its properties
- C01B2204/22—Electronic properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/011—Heaters using laterally extending conductive material as connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
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- Engineering & Computer Science (AREA)
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- Plasma & Fusion (AREA)
- Nanotechnology (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
Abstract
L'invention concerne une structure multicouche (100), flexible, planaire, et comportant au moins un ensemble électronique (140). L'ensemble électronique (140) comprend une couche électronique (130) comportant du graphène et au moins un électrode (145). Le graphène de la couche électronique (130) est en contact électrique avec l'électrode (145). La couche électronique (140) est encapsulée entre un substrat (101) comportant au moins une couche polymérique de substrat (110) et une passivation (102) comportant au moins une polymérique de passivation (120). Le substrat (101) et la passivation (102) sont collés, chacun à une face respective de l'ensemble électronique (140), et chacun par une couche adhérente (198) comportant du carbone, du silicium, de l'oxygène et de l'hydrogène. L'invention concerne également un procéde de fabrication d'une telle structure multicouche dans lequel les couches adhérentes (198) sont déposées par un procédé de dépôt chimique en phase vapeur activé par plasma dans un environnement sous pression atmosphérique.The invention relates to a multilayer structure (100), flexible, planar, and comprising at least one electronic assembly (140). The electronic assembly (140) comprises an electronic layer (130) comprising graphene and at least one electrode (145). The graphene of the electronic layer (130) is in electrical contact with the electrode (145). The electronic layer (140) is encapsulated between a substrate (101) comprising at least one polymeric substrate layer (110) and a passivation (102) comprising at least one passivation polymer (120). The substrate (101) and the passivation (102) are bonded, each to a respective face of the electronic assembly (140), and each by an adherent layer (198) comprising carbon, silicon, oxygen and hydrogen. The invention also relates to a method of manufacturing such a multilayer structure in which the adherent layers (198) are deposited by a plasma-activated chemical vapor deposition process in an atmospheric pressure environment.
Description
DOMAINE TECHNIQUETECHNICAL AREA
[0001] La présente invention porte sur des films flexibles comportant des matériaux électroniques ou électriques. Plus particulièrement, l'invention concerne un procédé de fabrication d'une structure électronique multicouches flexible dans lequel une partie électronique est montée sur une base isolante et recouvert d'une passivation isolante. [0001] The present invention relates to flexible films comprising electronic or electrical materials. More particularly, the invention relates to a method of manufacturing a flexible multilayer electronic structure in which an electronic part is mounted on an insulating base and covered with an insulating passivation.
ÉTAT DE LA TECHNIQUESTATE OF THE TECHNIQUE
[0002] Il existe des films chauffants comportant une couche électrothermique entre deux couches isolantes. Ces films utilisent souvent de l'encre conductrice. Si la couche d'encre doit être déposée sur une couche polymérique, une couche de primer, ou apprêt, est souvent nécessaire. La couche d'encre doit ensuite être sèche avant d'ajouter une couche comprenant des électrodes pour inclure l'encre conductrice dans un circuit électrique. En séchant l'encre, des solvants peuvent être relâchés dans l'environnement. Pour coller Is couche comprenant les électrodes à une couche isolante ou pour coller deux couches isolantes entre elles, une couche d'adhésive est employée, laquelle couche peut relâcher des solvants dans l'atmosphère pendant le reste du procédé de fabrication du film chauffant. Un but de la présente invention est d'améliorer et de simplifier un tel procédé, par exemple en le rendant plus rapide, et / ou en relâchant moins de solvants dans l'atmosphère, et / ou en assurant un meilleur contact électrique entre la couche électrothermique et la couche comprenant les électrodes. [0002] There are heating films comprising an electrothermal layer between two insulating layers. These films often use conductive ink. If the ink layer is to be deposited on a polymeric layer, a primer layer is often necessary. The ink layer must then be dry before adding a layer including electrodes to include the conductive ink in an electrical circuit. As the ink dries, solvents can be released into the environment. To bond the layer comprising the electrodes to an insulating layer or to bond two insulating layers together, an adhesive layer is used, which layer can release solvents into the atmosphere during the remainder of the heating film manufacturing process. An aim of the present invention is to improve and simplify such a process, for example by making it faster, and/or by releasing fewer solvents into the atmosphere, and/or by ensuring better electrical contact between the layer electrothermal and the layer comprising the electrodes.
RÉSUMÉ DE L'INVENTIONSUMMARY OF THE INVENTION
[0003] Le but de la présente invention est de définir un procédé de fabrication de différents types de structures électroniques multicouches flexibles qui soit efficace et facile à réaliser et qui ait moins d'impact sur notre environnement. [0003] The aim of the present invention is to define a process for manufacturing different types of flexible multilayer electronic structures which is efficient and easy to produce and which has less impact on our environment.
[0004] Selon un premier aspect, une structure multicouche, flexible, sensiblement planaire, comportant au moins un ensemble électronique est proposée, ledit ensemble électronique comprenant : une couche électrothermique comportant du graphène ; et au moins un électrode ; ledit graphène de la couche électrothermique étant en contact électrique avec l'électrode ; ladite couche électronique étant encapsulée entre un substrat comportant au moins une couche polymérique de substrat et une passivation comportant au moins une couche polymérique de passivation ; caractérisée en ce que : le substrat et la passivation sont collés, chacun à une face respective de l'ensemble électronique, chacun par une couche adhérente comportant du carbone, du silicium, de l'oxygène et de l'hydrogène.[0004] According to a first aspect, a multilayer, flexible, substantially planar structure, comprising at least one electronic assembly is proposed, said electronic assembly comprising: an electrothermal layer comprising graphene; and at least one electrode; said graphene of the electrothermal layer being in electrical contact with the electrode; said electronic layer being encapsulated between a substrate comprising at least one polymeric substrate layer and a passivation comprising at least one polymeric passivation layer; characterized in that: the substrate and the passivation are bonded, each to a respective face of the electronic assembly, each by an adherent layer comprising carbon, silicon, oxygen and hydrogen.
[0005] Selon un deuxième aspect, une feuille chauffante comportant la structure décrit dessus est proposée. [0005] According to a second aspect, a heating sheet comprising the structure described above is proposed.
[0006] Selon un troisième aspect, un procédé de fabrication de la structure multicouches décrit plus haut est proposé, dans lequel les couches adhérentes sont déposées par un procédé de dépôt chimique en phase vapeur activé par plasma dans un environnement sous pression atmosphérique. [0006] According to a third aspect, a method of manufacturing the multilayer structure described above is proposed, in which the adherent layers are deposited by a plasma-activated chemical vapor deposition process in an environment under atmospheric pressure.
[0007] Ainsi, le même procédé peut être employé pour coller l'encre conductrice à la couche polymérique de substrat et la couche comportant les électrodes à la couche polymérique de passivation, ainsi que pour coller deux couches polymériques ensemble. [0007] Thus, the same process can be used to bond the conductive ink to the polymeric substrate layer and the layer comprising the electrodes to the polymeric passivation layer, as well as to bond two polymeric layers together.
DESCRIPTION SOMMAIRE DES DESSINSSUMMARY DESCRIPTION OF THE DRAWINGS
[0008] Les caractéristiques de l'invention apparaîtront plus clairement à la lecture de la description de plusieurs formes d'exécution données uniquement à titre d'exemple, nullement limitative en se référant aux figures schématiques, dans lesquelles : – La figure 1 montre les différentes couches présentes dans une structure électrothermique selon un mode de réalisation décrit dans le présent document ; et – La figure 2 montre les différentes couches présentes dans une structure électrothermique selon un autre mode de réalisation ;[0008] The characteristics of the invention will appear more clearly on reading the description of several embodiments given solely by way of example, in no way limiting with reference to the schematic figures, in which: – Figure 1 shows the different layers present in an electrothermal structure according to an embodiment described in this document; and – Figure 2 shows the different layers present in an electrothermal structure according to another embodiment;
DESCRIPTION DÉTAILLÉE DE L'INVENTIONDETAILED DESCRIPTION OF THE INVENTION
[0009] La présente invention concerne un procédé de fabrication d'une structure électronique multicouches flexible. La structure est sensiblement planaire, de préférence longiforme, s'étendant dans deux dimensions sur une longueur et une largeur, la longueur étant, de préférence, plusieurs fois plus importantes que la largeur. The present invention relates to a method of manufacturing a flexible multilayer electronic structure. The structure is substantially planar, preferably elongated, extending in two dimensions over a length and a width, the length preferably being several times greater than the width.
[0010] La structure est une structure électronique dans le sens qu'elle peut comporter des composants ou circuits électroniques, ces circuits ou composant étant soit positionnés ou déposés, soit imprimés par un procédé de sérigraphie, par exemple. Selon la fonctionnalité requise, ces circuits ou composants peuvent être des résistances, des capacités, des diodes, des selfs, des transistors ou des capteurs de différents types, par exemple. Selon un autre mode de réalisation, qui peut être combiné avec un ou plusieurs autres modes de réalisation mentionnés ici, la structure peut comporter un matériau électrothermique pour produire de la chaleur ou du froid. La structure peut comporter une couche conductrice comprenant des tracées conductrices pour lies les composants et / ou les éléments électrothermiques ensemble pour faire un ou plusieurs circuits électriques. Selon encore un autre mode de réalisation, le film, ou structure multicouche, peut être utilisé pour fabriquer des batteries. Selon un autre mode de réalisation encore, de telles structures peuvent être utilisé pour faire des films photovoltaïques. The structure is an electronic structure in the sense that it can include electronic components or circuits, these circuits or components being either positioned or deposited, or printed by a screen printing process, for example. Depending on the required functionality, these circuits or components can be resistors, capacitors, diodes, chokes, transistors or sensors of different types, for example. According to another embodiment, which can be combined with one or more other embodiments mentioned here, the structure can include an electrothermal material to produce heat or cold. The structure may include a conductive layer comprising conductive traces to bind the components and/or the electrothermal elements together to make one or more electrical circuits. According to yet another embodiment, the film, or multilayer structure, can be used to manufacture batteries. According to yet another embodiment, such structures can be used to make photovoltaic films.
[0011] La partie électronique des structures électroniques multicouches flexibles, qui sont fabricables selon un mode de la présente invention, est situé sur une ou plusieurs couches entre un substrat et une passivation, le substrat et la passivation étant des isolants électriques, par exemple un polymère. Selon un mode préféré de réalisation, la passivation et le substrat comporte chacun deux couches du polymère collées ensemble. La structure est donc l'étanche à l'air et à l'eau, électriquement isolante et résistante mécaniquement contre les griffures et / ou des coupures. Les deux couches de polymère sont collées ensemble par l'intermédiaire d'une couche d'adhésif sensible à la pression (PSA) qui comporte une couche adhérente (198) comportant du carbone, du silicium, de l'oxygène et de l'hydrogène, préférablement du PDMS. Le PDMS est préférablement déposée par un procédé de dépôt chimique en phase vapeur activé par plasma dans un environnement sous pression atmosphérique. [0011] The electronic part of the flexible multilayer electronic structures, which can be manufactured according to one embodiment of the present invention, is located on one or more layers between a substrate and a passivation, the substrate and the passivation being electrical insulators, for example a polymer. According to a preferred embodiment, the passivation and the substrate each comprise two layers of the polymer glued together. The structure is therefore airtight and watertight, electrically insulating and mechanically resistant against scratches and/or cuts. The two polymer layers are bonded together via a pressure sensitive adhesive (PSA) layer which has an adherent layer (198) comprising carbon, silicon, oxygen and hydrogen , preferably PDMS. The PDMS is preferably deposited by a plasma-activated chemical vapor deposition process in an atmospheric pressure environment.
[0012] Selon un mode de réalisation, le polymère comporte un matériau polymère flexible, par exemple le polyéthylène téréphtalate (PET). D'autres polymères sont également possible, par exemple le polyéthylène (PE), le polypropylène (PP), le polychlorure de vinyle (PVC), le PVC souple (PVC-P), le polystyrène (PS), le polycarbonate (PC), le polyméthacrylate de méthyle (PMMA), le polyoxyméthylène (POM), le polytéréphtalate d'éthylène (PET), le polyester, le co-polyester, la polyétheréthercétone (PEEK), le polyamide, notamment le polyamide 6 (PA6), le polyamide 12 (PA12), le polyamide 10, le polyamide 610, le polyamide 66, le polyamide à base de constituants aliphatiques et cycloaliphatiques tels que notamment MACM12 ou le co-polyamide amorphe, de préférence à base de PA12, ou des copolymères ou mélanges de ceux-ci. According to one embodiment, the polymer comprises a flexible polymer material, for example polyethylene terephthalate (PET). Other polymers are also possible, for example polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), soft PVC (PVC-P), polystyrene (PS), polycarbonate (PC) , polymethyl methacrylate (PMMA), polyoxymethylene (POM), polyethylene terephthalate (PET), polyester, co-polyester, polyetheretherketone (PEEK), polyamide, in particular polyamide 6 (PA6), polyamide 12 (PA12), polyamide 10, polyamide 610, polyamide 66, polyamide based on aliphatic and cycloaliphatic constituents such as in particular MACM12 or amorphous co-polyamide, preferably based on PA12, or copolymers or mixtures of these.
[0013] Selon un mode de réalisation, combinable avec les autres modes de réalisation mentionnés ci-dessus, la couche adhérente peut aussi être utilisé pour faire coller la couche électrothermique, soit le graphène, sur une couche de polymère, soit sur la couche polymérique de substrat, soit la couche polymérique de passivation. Ceci évite de devoir utiliser une couche d'apprêt. Selon un autre mode de réalisation, combinable avec les autres modes de réalisation mentionnés ci-dessus, la couche adhérente peut être employée pour faire coller la couche comprenant les électrodes et une couche isolante, soit une couche polymérique de substrat, soit une couche polymérique de passivation. De ce fait, le même type de procédé est utilisé pour le collage de toutes les couches qui ont besoin d'être collées ensemble. [0013] According to one embodiment, combinable with the other embodiments mentioned above, the adhesive layer can also be used to stick the electrothermal layer, either graphene, on a polymer layer, or on the polymer layer of substrate, i.e. the polymeric passivation layer. This avoids the need for a primer coat. According to another embodiment, combinable with the other embodiments mentioned above, the adhesive layer can be used to bond the layer comprising the electrodes and an insulating layer, either a polymeric substrate layer, or a polymeric layer of passivation. Therefore, the same type of process is used for bonding all layers that need to be bonded together.
[0014] Selon le type de structure électronique à faire, par exemple un film chauffant comportant une couche électrothermique, une couche photovoltaïque ou une batterie, la structure peut comporter du graphène. Cette couche peut être réalisé en déposant une encre de graphène. L'encre peut être préparée en mélangeant du graphène avec des résines et / ou des solvants. Depending on the type of electronic structure to be made, for example a heating film comprising an electrothermal layer, a photovoltaic layer or a battery, the structure may include graphene. This layer can be produced by depositing a graphene ink. The ink can be prepared by mixing graphene with resins and/or solvents.
Claims (13)
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| US20060286785A1 (en) * | 2004-06-04 | 2006-12-21 | The Board Of Trustees Of The University Of Illinois | A Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates |
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| US20060286785A1 (en) * | 2004-06-04 | 2006-12-21 | The Board Of Trustees Of The University Of Illinois | A Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates |
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