CH718925A2 - Flame retardant polyamides with high light transmission. - Google Patents

Abstract

The present invention relates to flame-retardant polyamides with high light transmission, which comprise the polyamide units AB/AC/AD/EB/EC/ED/F, where at least the polyamide units AB must be present, the polyamide units AC, AD, EB, EC, ED and F are optional and the monomer units A, B, C, D, E and F are derived from the following molecules which are amidically bound in the polyamide X: A: cycloaliphatic diamines; B: Phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3 C: Aliphatic dicarboxylic acids; D: Aromatic phosphorus-free dicarboxylic acids; E: Acyclic aliphatic diamines; F: α,ω-aminocarboxylic acids, lactams. The invention also relates to flame-retardant molding compositions based on the flame-retardant polyamides and moldings formed from the inventive polyamides or polyamide molding compositions.

Description

The present invention relates to flame-retardant polyamides with high light transmission based on cycloaliphatic diamines and phosphorus-containing aromatic dicarboxylic acids and optionally other polyamide-forming components. The invention also relates to flame-retardant molding compositions based on flame-retardant polyamides. Both the polyamides and the molding materials made from them have very good flame retardancy and good mechanical and thermal properties. These molding compounds are suitable for the production of, in particular, translucent or transparent, flame-retardant moldings for the electrical and electronics industry and for the field of optics, such as housings, housing components or containers. The invention also relates to the use of the polyamides and polyamide molding compounds according to the invention for the production of moldings, in particular components for the electrical and electronics industry, for the automotive industry and for the optics sector, in particular in the field of security and surveillance.

[0002] Flame retardant, halogen-free moldings with a V0 classification according to the UL-94 specification of the Underwriter Laboratories are of particular interest for the electrical and electronics industry. The transparency of such moldings is an important property.

In addition to plastics that are flame-retardant per se (= inherent flame retardancy) and plastics coated with a flame retardant, plastics with a reactive flame retardant are also used, i.e. the flame retardant is part of the plastic and was chemically bonded to it during polymerization. Another way to make plastics flame-retardant is to compound them with flame-retardant additives. Common additives include nitrogen-based compounds such as melamine and urea, brominated polystyrenes, and organophosphorus compounds.

Another important requirement for plastics is good mechanical and thermal properties, such as rigidity, impact properties or heat resistance. Particularly with regard to the transparent polyamides, it is important to ensure that the glass transition temperature is not reduced too much by the flame retardant used.

It is also important that the flame-retardant polyamides and polyamide molding compositions can be easily processed, e.g.

As flame retardant additives for polymers, especially for polyamides, the well-known prior art includes melamine compounds, especially melamine cyanurate or melamine polyphosphate, cyanoguanidine, thiourea, magnesium and aluminum hydroxide, halogenated, especially brominated, organic compounds, especially in combination with heavy metal salts, phosphorus alone and in combination with halogen-containing compounds or organic phosphorus compounds, in particular alkylphosphinic acids or their salts. These additives are unsuitable for polyamides and copolyamides with high light transmittance, since they adversely affect transparency. In addition, the mechanical and physical properties of the polyamides also change in an unfavorable manner with increasing amounts of additive.

[0007] EP 0 659 816 A2 relates to flame-retardant polyamides and moldings produced therefrom. A trimethylpropanol ester of a methylphosphoric acid is proposed as a flame retardant, which apparently affects the transparency of the polyamides only slightly and shows no pronounced deposit formation during processing or use. However, these flame retardants, which are not entirely harmless to health, can be dissolved or washed out of the molded parts when they come into contact with media such as water, alcohols or other organic solvents. Furthermore, the proposed flame retardants are low-molecular compounds which are present in solution in the transparent polyamide and, thanks to their plasticizing effect, considerably reduce the glass transition temperature even when used in small quantities. Therefore, such flame-retardant molding compounds are characterized by a low heat resistance, which significantly limits their area of use.

CN 101 735 455 A describes a process for the preparation of aromatic polyoxadiazoles from terephthalic acid, hydrazine and modified isophthalic acid in a solvent and wet-spun, flame-resistant, high-temperature-resistant fibers therefrom. The modified isophthalic acid has chloro, bromo, or diphenylphosphine oxide or diphenylphosphine sulfide substituents.

US Pat. No. 4,837,394 relates to electrostatic toner particles based on a polyester resin which, as a monomer, contains, inter alia, a dimethyl isophthalate provided with a phosphonium substituent. The quaternary phosphonium groups act as charge carriers in the toner particles. Due to the homogeneous distribution of the charge carriers, a very low content of quaternary phosphonium groups in the range from 10 -9 to 10 -4 mol/g is already sufficient to implement an electrostatographic imaging process. However, the amounts of phosphorus are too small to ensure adequate flame retardancy for the underlying polyester resins.

US Pat. No. 3,108,991 discloses linear polyamides based on bis(aminoalkyl)alkylphosphines and aliphatic or aromatic dicarboxylic acids and aliphatic diamines and bis(carboxyalkyl)alkylphosphine oxides. The polyamides described are soluble in cold or warm water and have low softening points.

[0011] US Pat. No. 2,646,420 relates to oriented fibers based on linear condensation polymers containing phosphorus in the polymer chain. In addition to good dyeability, the fibers also have good mechanical properties, in particular high green strength and good resilience. In the examples, the phosphorus-containing monomer used is bis(carboxyphenyl)methylphosphine oxide, which is condensed with various glycols or decanediamine.

[0012] The field of textile fibers is also related to document US Pat. No. 4,032,517 B, which comprises copolyamides containing 0.5 to 7.5% by weight of phosphorus as an integral part of the polymer chains. Bis(carboxyethyl)alkylphosphine oxides, which are polycondensed with hexanediamine and adipic acid, are proposed as phosphorus-containing dicarboxylic acids. The fibers should be permanently antistatic, moisture-regulating and flame-resistant.

WO 2018 071790 A1 discloses flame-retardant polyamides that contain phosphorus in the polymer chain. The bis(4-methoxycarbonylphenoxy)phenylphosphine oxide used as the phosphorus-containing monomer is prepared from methylparaben and phenylphosphonic acid dichloride. The reaction of this phosphorus-containing dicarboxylic acid with m-xylylenediamine (MXDA) and adipic acid is described. Such a polyamide with 5 wt. JP11286545A describes phosphorus-containing copolyamides with a high glass transition temperature, which can be prepared by polycondensation in an inert solvent at temperatures of 50 to 200.degree. 2,5-dicarboxyphenylphosphonic acid, 3,5-dicarboxyphenylphosphinic acid and derivatives thereof are mentioned as phosphorus-carrying monomers. The copolyamides worked in the examples based on the dicarboxyphenylphosphinic acids mentioned and the diamine 4,4'-oxydianiline and isophthalic acid as a further dicarboxylic acid have glass transition temperatures in the range from 240 to 276° C. and cannot be polycondensed in the melt.

The inherently flame-retardant polyamides described above in the prior art, which contain phosphorus in the polymer chain, have poor chemical resistance, are largely even soluble in cold or warm water, contain "weak" C-P or C-O-P bonds in the polymer chain and generally have low softening temperatures, in particular low glass transition temperatures. In addition, the proposed polyamide molding compounds have too high a haze and too little transparency. In contrast, dissolved low-molecular-weight compounds show a pronounced plasticizing effect, greatly reduce the glass transition temperatures and lead to molding compositions with a low heat resistance.

PRESENTATION OF THE INVENTION

Among other things, it is an object of the present invention to avoid these disadvantages known from the prior art and to provide inherently flame-retardant polyamides and polyamide molding compositions produced therefrom which are characterized by good mechanical and thermal properties, a high surface quality, are characterized by high heat resistance, good flame retardancy and, in particular, excellent transparency. The aim is preferably for the polyamides and polyamide molding compounds according to the invention to have a fire protection classification V0 according to UL94 for specimens with a thickness of 0.35-3.2 mm, in particular 0.5 mm and/or a light transmission of at least 85% and a haze of at most 7%, determined according to ASTM D 1003-13 (2013) on panels with a thickness of 2 mm.

This object is achieved according to the invention on the one hand by a polyamide X according to claim 1, which comprises the polyamide units AB/AC/AD/EB/EC/ED/F, where at least the polyamide units AB must be present Polyamide units AC, AD, EB, EC, ED and F are optional and the monomer units A, B, C, D, E and F are derived from the following molecules, which are amidically bound in the polyamide X:

A: Cycloaliphatic diamines;

B: Phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1-C8-alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl , F, Cl, Br or P(R1)(R2)O;

C: Aliphatic dicarboxylic acids;

D: Aromatic phosphorus-free dicarboxylic acids;

E: acyclic aliphatic diamines;

F: F: α,ω-aminocarboxylic acids, lactams.

The aromatic dicarboxylic acids of component B are different from the dicarboxylic acids of component C, in particular they are free of phosphorus. The polyamide units mentioned above, e.g. the polyamide units AB, are to be understood as repeating units in the polyamide X. In the simplest case, the polyamide X is therefore a homopolyamide AB, which has only the repeating units AB, or a copolyamide AB, which has at least two different repeating units AB. In the latter case, at least two different cycloaliphatic diamines A or at least two different phosphorus-containing, aromatic dicarboxylic acids B were used in the production of polyamide X.

The flame-retardant polyamides X are characterized by high transparency, preferably at least 85% light transmission, and low turbidity (haze) of at most 7%. The flame retardant used is an integral part of the polyamides according to the invention, it is chemically bonded to the polymer backbone, which means that migration or washing-out phenomena can be ruled out. Macroscopically, the flame retardant is homogeneously distributed throughout the polymer, so that even small amounts are sufficient to ensure good flame retardancy. Since the flame retardant according to the invention, component B, is chemically bound in polyamide X, there is also no pronounced plasticizer effect, which means that high glass transition temperatures and thus sufficiently high heat distortion temperatures for most applications can be achieved.

The object is also achieved by a process for producing the polyamides according to the invention according to claim 9. Furthermore, the object is achieved by providing a polyamide molding composition FM according to claim 10, containing the polyamide X described above, and at least one filler and / or at least one additive and / or at least one of the polyamide X different polyamide Y. This object is further achieved by the moldings according to claim 13, which are formed at least partially from a polyamide X or the molding composition FM. Finally, this object is achieved by using the polyamides X according to the invention and by using the polyamide molding compounds FM according to the invention to produce the moldings according to claim 15.

DEFINITIONS OF TERMS

For the purposes of the present invention, the term “polyamide” (abbreviation PA) is understood to be a generic term which includes homopolyamides and copolyamides. The chosen spellings and abbreviations for polyamides and their monomers correspond to those specified in ISO standard 16396-1 (2015(D)). The abbreviations used therein are used in the following synonyms for the IUPAC names of the monomers, in particular the following abbreviations for monomers occur: T or TPS for terephthalic acid, I or IPS for isophthalic acid, MACM for bis(4-amino-3-methyl-cyclohexyl) methane (also referred to as 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, CAS # 6864-37-5), PACM for bis(4-aminocyclohexyl)methane (also referred to as 4,4'-diaminodicyclohexylmethane, CAS # 1761-71-3), TMDC for Bis(4-amino-3,5-dimethylcyclohexyl)methane (also referred to as 3,3',5,5'-Tetramethyl-4,4'-diaminodicyclohexylmethane , CAS No. 65962-45-0). The abbreviation HMDA is used below for 1,6-hexanediamine (also referred to as hexamethylenediamine). Compared to semi-crystalline polyamides, amorphous polyamides have no heat of fusion or only a very low, barely detectable heat of fusion. In dynamic differential calorimetry (DSC) according to ISO 11357 (2013) at a heating rate of 20 K/min, the amorphous polyamides preferably show a heat of fusion of less than 5 J/g, particularly preferably a maximum of 3 J /g, most preferably from 0 to 1 J/g. Amorphous polyamides do not have a melting point due to their amorphous nature. In addition to a glass transition temperature, microcrystalline polyamides also have a melting point. However, they have a morphology in which the crystallites have such small dimensions that a plate made from them with a thickness of 2 mm is still transparent, i.e. their light transmission is at least 85% and their haze is at most 7%, measured according to ASTM D 1003 -13 (2013). In differential scanning calorimetry (DSC) according to ISO 11357 (2013), microcrystalline polyamides preferably show a heat of fusion of 5 to 20 J/g at a heating rate of 20 K/min. In comparison, partially crystalline polyamides show a distinct melting peak in the DSC and have a heat of fusion of more than 20 J/g.

For the purposes of the present invention, a transparent polyamide is present if its light transmission, measured according to ASTM D 1003-13 (2013) on plates with a thickness of 2 mm, is at least 85% and its haze is at most 7%. When transparent polyamides are mentioned below, this always means amorphous or microcrystalline polyamides that meet the above definitions with regard to transparency and heat of fusion.

With regard to the polyamide X according to the invention, the monomers of the dicarboxylic acid and diamine components and any aminocarboxylic acids, lactams or monofunctional regulators used form, through the condensation, repeating units or end groups in the form of amides, which are derived from the respective monomers are. These generally make up at least 95 mol %, in particular at least 99 mol %, of all the repeating units and end groups present in the polyamide. In addition, the polyamide can also contain small amounts of other repeating units, which can result from degradation or side reactions of the monomers, for example the diamines.

The polyamide according to the invention is a polyamide X with the polyamide units AB/AC/AD/EB/EC/ED/F, where at least the polyamide units AB must be present. This means that the polyamide units AC, AD, EB, EC, ED and F are optional and, in the simplest case, the polyamide X exclusively comprises the polyamide units AB. The monomer units A, B, C, D, E and F are derived from the following bifunctional molecules, also referred to below as monomers, which are present in the polyamide X as amidic bonds.

The monomers for the production of the polyamides X comprise at least the following components A and B, which form the polyamide units AB, and optionally the components C, D, E and F: A: cycloaliphatic diamines; B phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1 - C8-alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, are Cl, Br or P(R1)(R2)O; C: Aliphatic dicarboxylic acids; D: Aromatic, phosphorus-free dicarboxylic acids; E: Acyclic aliphatic diamines; F: α,ω-aminocarboxylic acids, lactams.

If only a single cycloaliphatic diamine A and a single phosphorus-containing, aromatic dicarboxylic acid B are selected as monomers, the polyamide X is composed of only one polyamide unit AB as repeating units. If two or more different diamines A and/or at least two different dicarboxylic acids B are selected, then the polyamide X contains two or more different polyamide units AB. The polyamide units are to be understood as repeating units in polyamide X. It is preferred here if the total diamines used and the total dicarboxylic acids used in the polyamide X are in a molar ratio of from 1.05:1 to 1:1.05, particularly preferably from 1.03:1 to 1:1.03 and particularly preferably in a molar ratio of 1:1 present in the polyamide X.

A preferred embodiment of the present invention provides that the cycloaliphatic diamines A are selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4-amino-3,5-dimethylcyclohexyl)methane (TMDC), 2,2-bis(4-aminocyclohexyl)propane, 2,2-bis(4-amino-3-methylcyclohexyl)propane, bis- (4-amino-3-ethylcyclohexyl)methane (EACM), isophoronediamine (5-amino-1,3,3-trimethylcyclohexanemethanamine), 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 1,3-bis-(aminomethyl) cyclohexane (BAC), 1,4-bis(aminomethyl)cyclohexane, 2,5-bis(aminomethyl)norbornane, 2,6-bis(aminomethyl)norbornane, 2,5-diaminonorbornane, 2,6-diaminonorbornane, m-xylylenediamine (MXDA), p-xylylenediamine (PXDA) and mixtures thereof. The diamines A are particularly preferably selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4-amino-3,5- dimethylcyclohexyl)methane (TMDC) and mixtures thereof. It is particularly preferred if these diamines have a high bio content, i.e. are based on renewable raw materials.

According to a further preferred embodiment, the phosphorus-containing, aromatic dicarboxylic acid Baus is selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, 2,4-dicarboxyphenyldiphenylphosphine oxide, 2,4 -dicarboxyphenyldimethylphosphine oxide, 2,4-dicarboxyphenyldiethylphosphine oxide. In particular, as the dicarboxylic acid B, 3,5-dicarboxyphenyldiphenylphosphine oxide is preferred. 3,5-dicarboxyphenyldiphenylphosphine oxide is a dicarboxylic acid according to formula 1, where the substituents R1 and R2 are phenyl and the substituents R3, R4 and R5 are hydrogen.

Another preferred embodiment of the present invention provides that the aliphatic dicarboxylic acids C are selected from the group consisting of cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, adipic acid, 1,7-heptanedioic acid, 1,8-octanedioic acid, 1 ,9-nonanedioic acid, 1,10-decanedioic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,13-tridecanedioic acid, 1,14-tetradecanedioic acid, 1,15-pentadecanedioic acid, 1,16-hexadecanedioic acid, 1,17 -heptadecanedioic acid, 1,18-octadecanedioic acid, and mixtures thereof. The aliphatic dicarboxylic acids C are particularly preferably selected from the group consisting of dicarboxylic acids having 6 to 16 carbon atoms, in particular adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3 -dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid and mixtures thereof.

Aromatic dicarboxylic acids are preferably selected as component D from the group consisting of terephthalic acid, isophthalic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 3,3'-diphenyldicarboxylic acid, 4,4'-diphenyletherdicarboxylic acid , 4,4'-diphenylmethanedicarboxylic acid, 4,4'-diphenylsulfonedicarboxylic acid, 4,4'-diphenylisopropylidonedicarboxylic acid, 1,2-bis(phenoxy)ethane-4,4'-dicarboxylic acid, 2,5-anthracenedicarboxylic acid, 4,4 '-p-Terphenylenedicarboxylic acid and 2,5-pyridinedicarboxylic acid are used. Terephthalic acid, isophthalic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid and mixtures thereof are particularly preferred as component D. The aromatic dicarboxylic acids D are particularly preferably selected as a mixture of isophthalic acid and terephthalic acid, the molar ratio of isophthalic acid to terephthalic acid preferably being in the range from 0.5 to 3.0, particularly preferably in the range from 0.8 to 2.5 and particularly preferably in the range from 0.9 to 2.0 is.

According to a preferred embodiment, the acyclic aliphatic diamine E is selected from the group consisting of 2-methyl-1,5-pentanediamine, hexanediamine, in particular 1,6-hexanediamine, 2,2,4-trimethyl-1,6-hexamethylenediamine, 2,4,4-trimethyl-1,6-hexamethylenediamine, nonanediamine, especially 1,9-nonanediamine, 2-methyl-1,8-octanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine and mixtures thereof. Particular preference is given to the acyclic, aliphatic diamines E selected from the group consisting of diamines having 6 to 10 carbon atoms, in particular 1,6-hexanediamine, 1,9-nonanediamine, 1,10-decanediamine and mixtures thereof.

According to a further preferred embodiment of the present invention, the α,ω-aminocarboxylic acids or the lactams F are selected from the group consisting of caprolactam, undecanolactam, laurolactam, α,ω-aminocaproic acid, α,ω-aminoheptanoic acid, α,ω-aminooctanoic acid, α,ω-aminononanoic acid, α,ω-aminodecanoic acid, α,ω-aminoundecanoic acid (AUA) and α,ω-aminododecanoic acid (ADA), particular preference being given to α,ω-aminoundecanoic acid, caprolactam and laurolactam and mixtures thereof.

Furthermore, the polyamides X can contain at least one monofunctional carboxylic acid G1 or monofunctional amine G2 as monofunctional regulator G in copolymerized form. The monofunctional regulators G are used for the end-capping of the polyamides produced according to the invention. In principle, all monocarboxylic acids G1 which are capable of reacting with at least some of the available amino groups under the reaction conditions of the polyamide condensation are suitable. Suitable monocarboxylic acids G1 are aliphatic monocarboxylic acids, alicyclic monocarboxylic acids and aromatic monocarboxylic acids. These include formic acid, acetic acid, propionic acid, n-, iso- or tert-butyric acid, valeric acid, trimethylacetic acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, undecanoic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, cyclohexanecarboxylic acid, benzoic acid , methylbenzoic acids, α-naphthoic acid, β-naphthoic acid, phenylacetic acid, oleic acid, ricinoleic acid, linoleic acid, linolenic acid, erucic acid, acrylic acid, methacrylic acid, and mixtures thereof. The monocarboxylic acid G1 is particularly preferably selected from acetic acid, propionic acid, benzoic acid, stearic acid and mixtures thereof. In a special embodiment, the aliphatic polyamides X contain exclusively acetic acid in copolymerized form as the monocarboxylic acid G1.

The polyamides X can contain at least one monoamine G2 in copolymerized form. The monoamines G2 are used for the end-capping of the polyamides produced according to the invention. In principle, all monoamines which are capable of reacting with at least some of the available carboxylic acid groups under the reaction conditions of the polyamide condensation are suitable. Preferred monoamines G2 are aliphatic monoamines. These include methylamine, ethylamine, propylamine, butylamine, hexylamine, heptylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, dibutylamine, cyclohexylamine, dicyclohexylamine, and mixtures thereof.

The content of the polyamide units AB or the sum of the contents of the polyamide units AB and EB is preferably 1 to 100 mol%, more preferably 10 to 90 mol% and particularly preferably 20 to 80 mol%, respectively based on a polyamide X with the polyamide units AB/AC/AE/DB/DC/DE/F. The concentration specification of 100 mol % applies to cases in which the phosphorus-containing dicarboxylic acid B is contained exclusively in the polyamide units AB or exclusively in polyamide units AB and EB.

Preference is also given to a polyamide X in which, with regard to components A to F, at least one of the selection groups mentioned below is selected, preferably the selection groups for components A and B are selected, particularly preferably the selection groups for components A, B, C and D are selected and particularly preferably all selection groups are selected simultaneously: A: the cycloaliphatic diamines are selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane ( PACM), bis(4-amino-3,5-dimethylcyclohexyl)methane (TMDC), and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, 2,4-dicarboxyphenyldiphenylphosphine oxide, 2,4-dicarboxyphenyldimethylphosphine oxide, 2,4-dicarboxyphenyldiethylphosphine oxide, preferably selected as 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide or 3,5-dicarboxyphenyldiethylphosphine oxide, particularly preferably selected as 3,5-dicarboxyphenyldiphenylphosphine oxide; C: the aliphatic dicarboxylic acids are selected from the group consisting of adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1, 4-dicarboxylic acid and mixtures thereof; D: the aromatic non-phosphorus dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably selected as a mixture of terephthalic acid and isophthalic acid; E: the acyclic aliphatic diamines are selected from the group consisting of 1,6-hexanediamine, 1,9-nonanediamine, 1,10-decanediamine, preferably selected as 1,6-hexanediamine or 1,10-decanediamine; F: the α,ω-aminocarboxylic acids or the lactams F are selected from the group consisting of α,ω-aminoundecanoic acid, caprolactam and laurolactam and mixtures thereof.

In a preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB and AC or at least the polyamide units AB and AD or at least the polyamide units AB, AC and AD. In a particularly preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB and AC and the monomer units A, B and C are derived from the following molecules which are present in the polyamide X in amidic bonds : A: the cycloaliphatic diamines are selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4-amino-3,5). -dimethylcyclohexyl)methane (TMDC) and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, particularly preferably selected as 3,5-dicarboxyphenyldiphenylphosphine oxide; C: the aliphatic dicarboxylic acids are selected from the group consisting of 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid and mixtures thereof.

In a likewise particularly preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB and AD and the monomer units A, B and D are derived from the following molecules which are present in the polyamide X are amidically bound: A: the cycloaliphatic diamines are selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis(4- amino-3,5-dimethylcyclohexyl)-methane (TMDC) and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, particularly preferably selected as 3,5-dicarboxyphenyldiphenylphosphine oxide; D: the aromatic phosphorus-free dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably selected as a mixture of terephthalic acid and isophthalic acid.

In a likewise particularly preferred embodiment, the polyamide X is a polyamide which comprises at least the polyamide units AB, AC and AD and the monomer units A, B, C and D are derived from the following molecules Which are amidically bound in the polyamide X: A: the cycloaliphatic diamines are selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis -(4-amino-3,5-dimethylcyclohexyl)-methane (TMDC) and mixtures thereof; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, particularly preferably selected as 3,5-dicarboxyphenyldiphenylphosphine oxide; C: the aliphatic dicarboxylic acids are selected from the group consisting of 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, and mixtures thereof; D: the aromatic dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably selected as a mixture of terephthalic acid and isophthalic acid.

A polyamide X is preferred in which the polyamide units AC are selected from the group consisting of the polyamide units MACM10, MACM12, MACM14, MACM16, MACM18, PACM10, PACM12, PACM14, PACM16, PACM18, TMDC10, TMDC12 , TMDC14, TMDC16 and TMDC18.

Also preferred is a polyamide X in which the polyamide units AD are selected from the group consisting of the polyamide units MACMI, MACMT, PACMI, PACMT, TMDCI and TMDCT.

Among other things, preference is given to a polyamide X which comprises at least the polyamide units AB and AC and/or AD. The polyamide X is therefore the systems AB/AC, AB/AD and AB/AC/AD, which can also contain diamines E, aminocarboxylic acids/lactams F and/or monofunctional regulators G as further components. The content of the polyamide units AB is 1 to 99 mol %, preferably 10 to 90 mol %, particularly preferably 20 to 80 mol %, and the content of the polyamide units AC or AD or the sum of AC and AD is 1 to 99 mol %, preferably 10 to 90 mol %, particularly preferably 20 to 80 mol %, based in each case on the sum of the polyamide units AB, AC and AD.

It is also preferred if the polyamide X consists exclusively of the polyamide units AB and AC or AB, AC and F. The polyamide X is therefore the systems AB/AC or AB/AC/F, which can also contain monofunctional regulators G as further components. The content of polyamide units AB is preferably 1 to 99 mol %, particularly preferably 10 to 90 mol % and particularly preferably 20 to 80 mol %, and the content of polyamide units AC is preferably 1 to 99 mol %. , particularly preferably 10 to 90 mol% and particularly preferably 20 to 80 mol% and the content of polyamide units F preferably 0 to 50 mol%, particularly preferably 0 to 45 mol% and particularly preferably 10 to 40 mol% %, based on the sum of the polyamide units AB and AC or AB, AC and F.

It is also preferred if the polyamide X consists exclusively of the polyamide units AB and AD or AB, AD and F. The polyamide X is therefore the systems AB/AD or AB/AD/F, which can also contain monofunctional regulators G as further components. The content of polyamide units AB is preferably 1 to 99 mol %, particularly preferably 10 to 90 mol % and particularly preferably 20 to 80 mol %, and the content of polyamide units AD is preferably 1 to 99 mol %. , particularly preferably 10 to 90 mol% and particularly preferably 20 to 80 mol% and the content of polyamide units F preferably 0 to 50 mol%, particularly preferably 0 to 45 mol% and particularly preferably 10 to 40 mol% %, based on the sum of the polyamide units AB and AD or AB, AD and F.

It is also preferred if the polyamide X consists exclusively of the polyamide units AB, AC and AD or AB, AC, AD and F. The polyamide X is therefore the systems AB/AC/AD or AB/AC/AD/F, which can also contain monofunctional regulators G as further components. The content of polyamide units AB is preferably 1 to 99 mol %, particularly preferably 10 to 90 mol % and particularly preferably 20 to 80 mol %, the content of polyamide units AC is preferably 1 to 98 mol %, particularly preferably 10 to 90 mol % and particularly preferably 20 to 80 mol %, the content of polyamide units AD preferably 1 to 99 mol %, particularly preferably 10 to 90 mol % and particularly preferably 20 to 80 mol % and the content of polyamide units F is preferably 0 to 50 mol %, particularly preferably 0 to 45 mol % and particularly preferably 10 to 40 mol %, based in each case on the sum of the polyamide units AB, AC and AD or AB, AC, AD and F

A polyamide X which exclusively comprises the polyamide units AB and AC or exclusively the polyamide units AB and AD or exclusively the polyamide units AB, AC and AD or exclusively the polyamide units AB is particularly preferred.

Also particularly preferred is a polyamide X which exclusively comprises the polyamide units AB and AC or exclusively the polyamide units AB and AD or exclusively the polyamide units AB, AC and AD or exclusively the polyamide units AB, and where the cycloaliphatic diamines A are selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane (MACM) and bis(4-aminocyclohexyl)methane (PACM) and mixtures thereof which contain phosphorus, aromatic dicarboxylic acid B is selected as 3,5-dicarboxyphenyldiphenylphosphine oxide, the aliphatic dicarboxylic acids C are selected from the group consisting of 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid and mixtures thereof and the aromatic dicarboxylic acids D are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof.

The polyamides according to the invention are notable for excellent transparency and low haze. Thus, it is preferable that the transparency of a sheet made of the polyamide X having a thickness of 2 mm is equal to or higher than 90%, particularly preferably at least 92% and the haze is at most 5%, particularly preferably at most 3%, respectively determined according to the ASTM D1003:2013 method with the CIE-C illuminant. The plates used preferably have a high-gloss surface, with the arithmetic mean roughness value Ra preferably being in the range from 0.01 to 0.08 mm and/or the surface roughness Rz preferably being in the range from 0.05 to 1.0 mm, determined in each case according to DIN EN ISO 4287:2010.

The polyamides X are preferably amorphous or microcrystalline, ie have a melting enthalpy of preferably less than or equal to 20 J/g, particularly preferably in the range from 0 to 20 J/g and particularly preferably less than 5 J/g.

The polyamide X preferably has a solution viscosity ηrel, determined using a solution of 0.5 g of polymer granules in 100 ml of m-cresol at 20° C. according to ISO 307:2007, in the range from 1.4 to 2.5, preferably in the range from 1.4 to 2.0 , especially in the range from 1.45 to 1.85.

The polyamides X preferably have a phosphorus content of at least 1.0% by weight, particularly preferably a phosphorus content in the range from 1.5 to 7% by weight and particularly preferably in the range from 1.7 to 4.0% by weight.

The inventive polyamides have good flame retardancy and preferably have a V0 flame retardancy classification, determined according to UL94 (“Tests for Flammability of Plastic Materials for Parts in Devices and Applications” from Underwriters Laboratories) on test specimens measuring 127×12.7×0.35 mm , 127 × 12.7 × 0.5 mm, 127 × 12.7 × 0.75 mm, 127 × 12.7 × 1.5 mm and 127 × 12.7 × 3.0 mm, previously conditioned for 48 h in standard climate (23 °C / 50% relative humidity) or 7 days at 70 °C in a convection oven. The polyamides X preferably have a glass transition temperature of from 130 to 230.degree. C., particularly preferably from 140 to 200.degree. C. and particularly preferably from 150 to 190.degree.

The preparation of the polyamides X according to the invention preferably comprises a polycondensation reaction between at least one phosphorus-containing, aromatic dicarboxylic acid B according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1-C8-alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O, and at least one cycloaliphatic diamine A and optionally further monomers C, D, E and F, optionally in Presence of monofunctional regulators G and/or process auxiliaries.

Preferred process auxiliaries are inorganic and organic stabilizers, catalysts and defoamers. Preferred catalysts are phosphorus compounds such as phosphoric acid, phosphorous acid, hypophosphorous acid, phenylphosphonic acid, phenylphosphinic acid and/or their salts with monovalent to trivalent cations such as Na, K, Mg, Ca, Zn or Al, and/or their esters , such as B. triphenyl phosphate, triphenyl phosphite or tris (nonylphenyl) phosphite. Hypophosphorous acid and its salts, such as sodium hypophosphite, are particularly preferred as catalysts.

The process for producing polyamide X, which comprises at least the polyamide units AB, is preferably carried out in pressure vessels, after mixing components A and B and optionally other components C, D, E, F, G and optional Process auxiliaries, a pressure phase at 220 °C to 330 °C with subsequent relaxation at 220 °C to 320 °C, with subsequent degassing at 220 °C to 320 °C and discharge of the polyamide in strand form, cooling, granulating and drying of the granules, takes place.

Furthermore, the invention also includes the provision of a polyamide molding compound FM containing the polyamide X, and at least one filler and/or at least one additive and/or at least one polyamide Y different from polyamide X.

In a preferred embodiment, the polyamide molding compound FM contains the following components or preferably consists of the following components: 20 to 99.99% by weight of polyamide X 0 to 60% by weight of at least one filler T; 0.01 to 60% by weight of at least one additive S different from X and T; where components S, T and X together add up to 100% by weight.

In a particularly preferred embodiment of the invention, the polyamide molding compound FM contains the following components or preferably consists of the following components: 20 to 100% by weight of a polymer mixture P containing or preferably consisting of 10 to 90% by weight of polyamide X and 10 to 90% by weight of polyamide Y different from polyamide X, preferably selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6/12 or mixtures thereof, where the sum of X and Y is 100% by weight of the polymer mixture P; 0 to 60% by weight of at least one filler T; 0 to 60% by weight of at least one additive S different from X, Y and T; where the components P, S and T together add up to 100% by weight.

The polymer mixture P particularly preferably consists exclusively of components X and Y.

The polyamide Y is a polyamide which is free of polyamide units AB and EB, ie component B does not contain. Polyamide Y preferably contains at least one of the polyamide units AC, AD, EC, ED, F. In a preferred embodiment, the polyamide Y contains only polyamide units EC and/or F, i.e. it is an aliphatic polyamide. It is particularly preferred here if the polyamide Y is selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6/12 or mixtures thereof.

The polyamide molding compounds FM according to the present invention contain the components X and S or X, T and S or P or P and S or P, T and S or preferably consist exclusively of the components X and S or X, T, S or P or P and S or P, T and S, with the proviso that the components X, T, S or P, T, S add up to 100% by weight. The specified ranges of the quantities for the individual components X, T, S or P, T, S are to be understood in such a way that an arbitrary quantity for each of the individual components can be selected within the specified ranges, provided that the strict requirement is met that the sum of all components X, T, S or P, T, S is 100% by weight.

The phosphorus content of the polymer mixture P is preferably in the range from 0.8 to 6.0% by weight, particularly preferably in the range from 1.2 to 4.5% by weight and particularly preferably in the range from 1.5 to 3.5% by weight.

Component T is a filler which is present in the polyamide molding compound FM at 0 to 70% by weight. The fillers can be present either in fibrous form or in particulate form, individually or as a mixture. Component T can therefore contain fibrous fillers (reinforcing agents) or particulate fillers or else a mixture of reinforcing agents and particulate fillers.

According to a preferred embodiment of the present invention, component T is present in the polyamide molding composition FM at 10 to 60% by weight, more preferably at 20 to 55% by weight and particularly preferably at 25 to 50% by weight , where these quantities relate to the sum of components X, T, S or the sum of components P, T, S or the total weight of the polyamide molding compound FM.

It is particularly preferred if component T consists exclusively of reinforcing agents selected from the group consisting of glass fibers, carbon fibers, boron fibers, aramid fibers, basalt fibers and mixtures thereof. According to a preferred embodiment of the polyamide molding compound according to the invention, component T is formed entirely from glass fibers.

The glass fibers used have a cross-sectional area that is either circular (or synonymously round) or non-circular (or synonymously flat), in which case the dimensional ratio of the major cross-sectional axis to the minor cross-sectional axis is at least 2, preferably im range from 2 to 6.

The reinforcement with glass fibers can be done with short fibers (e.g. chopped glass with a length of 2 to 50 mm) or endless fibers (long glass or rovings). In a preferred embodiment, the glass fibers used according to the invention are short glass fibers with a diameter in the range from 6 to 20 μm and preferably from 9 to 12 μm. The glass fibers are in the form of chopped glass with a length of 2 to 50 mm. In particular, E and/or S glass fibers are used according to the invention. However, all other types of glass fiber, such as e.g. B. A, C, D, M, R glass fibers or any mixtures thereof or mixtures with E and / or S glass fibers can be used. The sizings customary for polyamide, such as various aminosilane sizings, are used, with preference being given to sizings that are stable at high temperatures.

In the case of the flat glass fibers, i.e. glass fibers with a non-circular cross-sectional area, those with a dimensional ratio of the main cross-sectional axis to the secondary cross-sectional axis perpendicular thereto of at least 2, preferably from 2.5 to 4.5, in particular from 3 to 4, are preferably used. These so-called flat glass fibers have an oval, elliptical, elliptical (so-called cocoon or cocoon fibre) provided with constriction(s), polygonal, rectangular or almost rectangular cross-sectional area. Another characteristic feature of the flat glass fibers used is that the length of the main cross-sectional axis is preferably in the range from 6 to 40 µm, in particular in the range from 15 to 30 µm, and the length of the secondary cross-sectional axis in the range from 3 to 20 µm, in particular in the range from 4 to 10 µm.

Mixtures of glass fibers with a circular and non-circular cross-section can also be used to reinforce the molding compositions according to the invention, the proportion of flat glass fibers preferably predominating, i.e. making up more than 50% by weight of the total mass of the fibers. The glass fibers can be provided with a size suitable for thermoplastics, in particular for polyamide, containing an adhesion promoter based on an amino or epoxy silane compound.

The flat glass fibers of component T are preferably selected as E-glass fibers according to ASTM D578-00 with a non-circular cross-section, preferably with a composition of 52 to 62% silicon dioxide, 12 to 16% aluminum oxide, 16 to 25% calcium oxide, 0 to 10% borax, 0 to 5% magnesium oxide, 0 to 2% alkali oxides, 0 to 1.5% titanium dioxide and 0 to 0.3% iron oxide. The glass fibers of component (T), preferably as flat E-glass fibers, have a density of 2.54 to 2.62 g/cm 3 , a tensile modulus of elasticity of 70 to 75 GPa, a tensile strength of 3000 to 3500 MPa and an elongation at break of 4.5 to 4.8%, with the mechanical properties being determined on individual fibers with a diameter of 10 µm and a length of 12.7 mm at 23 °C and a relative humidity of 50%. Component T can also contain particulate fillers, optionally in surface-treated form, selected from the following group: kaolin, calcined kaolin, aluminum oxide, talcum, talc, mica, silicate, quartz, wollastonite, amorphous silicic acids, magnesium carbonate, magnesium hydroxide, chalk, lime , feldspar, solid or hollow glass beads or ground glass, in particular ground glass fibers, and mixtures of elements from this group. Glass microspheres with an average diameter in the range from 5 to 100 μm are particularly preferred as filler, since these tend to give the molded part isotropic properties and thus allow the production of molded parts with low warpage.

According to a preferred embodiment of the present invention, component T consists exclusively of a glass filler selected from the group consisting of glass fibers, ground glass fibers, glass particles, glass flakes, glass spheres, hollow glass spheres or combinations of the aforementioned. If glass spheres or glass particles are selected as component T, their average diameter is from 0.3 to 100 μm, preferably from 0.7 to 30 μm, particularly preferably from 1 to 10 μm.

Another preferred embodiment of the present invention provides that the glass type of component T is selected from the group consisting of E glass, ECR glass, S glass, A glass, AR glass and R glass, in particular E and S glass, as well as mixtures of these types of glass.

According to a preferred embodiment, component T is a high-strength glass fiber or so-called S-glass fiber. This is preferably based on the ternary system silica-alumina-magnesia or on the quaternary system silica-alumina-magnesia-calcia, with a composition of 58 to 70% by weight silica (SiO2), 15 to 30% by weight alumina ( Al2O3), 5 to 15% by weight magnesium oxide (MgO), 0 to 10% by weight calcium oxide (CaO) and 0 to 2% by weight other oxides such as zirconium dioxide (ZrO2), boron oxide (B2O3), titanium dioxide (TiO2), iron oxide (Fe2O3), sodium oxide, potassium oxide or lithium oxide (Li2O) is preferred.

It is particularly preferred if the high-strength glass fiber has the following composition: 62 to 66% by weight silicon dioxide (SiO2), 22 to 27% by weight aluminum oxide (Al2O3), 8 to 12% by weight magnesium oxide ( MgO), 0 to 5% by weight calcium oxide (CaO), 0 to 1% by weight other oxides such as zirconium dioxide (ZrO2), boron oxide (B2O3), titanium dioxide (TiO2), iron oxide (Fe2O3), sodium oxide, potassium oxide and lithium oxide (Li2O).

The high-strength glass fibers (S-glass fibers) preferably have a tensile strength of at least 3700 MPa, preferably at least 3800 or 4000 MPa, and/or an elongation at break of at least 4.8%, preferably at least 4.9 or 5.0% and/or a tensile strength E modulus of more than 75 GPa, preferably more than 78 or 80 GPa, these glass properties being measured on single fibers (pristine single filaments) with a diameter of 10 µm and a length of 12.7 mm at a temperature of 23 °C and a relative humidity of 50% are to be determined.

The polyamide molding composition (FM) according to the invention contains 0 to 50% by weight of at least one additive as component S, which is different from component X, T and Y.

According to a preferred embodiment, the inventive polyamide molding composition (FM) contains 0.01 to 50% by weight or 0.01 to 30% by weight and particularly preferably 0.02 to 20% by weight of at least one additive as component S, with these amounts relate to the total of components X, T, S or the total of components P, T, S or the total weight of the polyamide molding composition FM.

According to a preferred embodiment, component S is selected from the group consisting of lubricants, heat stabilizers, processing stabilizers, processing aids, viscosity modifiers, antioxidants, agents against thermal decomposition and decomposition by ultraviolet light, UV blockers, lubricants and mold release agents, coloring agents, in particular dyes , inorganic pigments, organic pigments, plasticizers, flame retardants, impact modifiers and mixtures thereof.

To improve the flame retardant properties, the polyamide molding compositions FM can also contain flame retardants as additives, the flame retardant additives preferably being halogen-free. Preferred flame retardant additives are phosphinic acid salts and/or diphosphinic acid salts, which are preferably used together with a synergist, in particular a nitrogen-containing synergist and/or a nitrogen- and phosphorus-containing flame retardant, preferably melamine or condensation products of melamine, such as particularly preferably selected from the group: melem, melam, melon , reaction products of melamine with polyphosphoric acid, such as melamine polyphosphate, reaction products of condensation products of melamine with polyphosphoric acid, or mixtures thereof.

In a further embodiment, the synergist is preferably selected as an oxygen-, nitrogen- or sulfur-containing metal compound. Preferred metals are aluminum, calcium, magnesium, barium, sodium, potassium and zinc. Suitable compounds are selected from the group consisting of oxides, hydroxides, carbonates, silicates, borates, phosphates, stannates, alkoxides, carboxylates and combinations or mixtures of these compounds, such as oxide-hydroxydes or oxide-hydroxycarbonates. Examples are magnesium oxide, calcium oxide, aluminum oxide, zinc oxide, barium carbonate, magnesium hydroxide, aluminum hydroxide, boehmite, pseudoboehmite, dihydrotalcite, hydrocalumite, calcium hydroxide, calcium hydroxyapatite, tin oxide hydrate, zinc hydroxide, zinc borate, zinc sulfide, zinc phosphate, sodium carbonate, calcium carbonate, calcium phosphate, magnesium carbonate, basic zinc silicate, zinc stannate . Also possible are systems such as calcium stearate, zinc stearate, magnesium stearate, barium stearate, potassium palmitate, magnesium behenate.

Examples of suitable phosphinic acids for preparing the phosphinic acid salts according to the invention are dimethylphosphinic acid, ethylmethylphosphinic acid, diethylphosphinic acid, methyl-n-propylphosphinic acid, methanedi(methylphosphinic acid), ethane-1,2-di(methylphosphinic acid), hexane-1,6-di (methylphosphinic acid), benzene-1,4-di(methylphosphinic acid), methyl-phenylphosphinic acid, diphenylphosphinic acid. The phosphinic acid salts can be produced, for example, by reacting the phosphinic acid salts in aqueous solution with metal carbonates, metal hydroxides or metal oxides, with essentially monomeric phosphinic acid salts being formed, but depending on the reaction conditions, polymeric phosphinic acid salts may also be formed. The content of these halogen-free flame retardant additives in component S is preferably at most 10% by weight, particularly preferably at most 5% by weight, based in each case on the entire molding compound FM, and the molding compound FM is particularly preferably free of flame retardant additives S.

According to a particularly preferred embodiment, the polyamide molding composition FM contains at least one lubricant as component S, this preferably in a proportion of 0 to 2 wt .-%, particularly preferably from 0.01 to 2.0 wt .-%, particularly preferably from 0.01 to 1.5% by weight and most preferably from 0.02 to 1.0% by weight, based in each case on the total weight of components X, T, S or P, T, S or the molding composition FM. Preference is given here to Al, alkali metal, alkaline earth metal salts, esters or amides of fatty acids having 10 to 44 carbon atoms and preferably having 14 to 44 carbon atoms, the metal ions Na, Mg, Ca and Al being preferred and Ca or Mg being particularly preferred are. Particularly preferred metal salts are Ca stearate and Ca montanate as well as Al stearate. The fatty acids can be monovalent or bivalent. Examples which may be mentioned are pelargonic acid, palmitic acid, lauric acid, margaric acid, dodecanedioic acid, behenic acid and the particularly preferred stearic acid, capric acid and montanic acid (mixture of fatty acids with 30 to 40 carbon atoms).

Furthermore, aliphatic alcohols, which can be 1- to 4-valent, are preferred as lubricants. These alcohols are preferably selected from the group consisting of n-butanol, n-octanol, stearyl alcohol, ethylene glycol, propylene glycol, neopentyl glycol, glycerol, pentaerythritol and mixtures thereof, glycerol and pentaerythritol being preferred. In addition, aliphatic amines, which can be mono- to tri-valent, are preferred lubricants. Preferred amines are selected from the group consisting of stearylamine, ethylenediamine, propylenediamine, hexamethylenediamine, di(6-aminohexyl)amine and mixtures thereof, with ethylenediamine and hexamethylenediamine being particularly preferred.

Preferred esters or amides of fatty acids are selected from the group consisting of glycerol distearate, glycerol tristearate, ethylenediamine distearate, glycerol monopalmitate, glycerol trilaurate, glycerol monobehenate, pentaerythritol tetrastearate, and mixtures thereof. Furthermore, white oils or silicone oils can also be used as an alternative or in addition. According to a further preferred embodiment, the polyamide molding composition FM contains at least one heat stabilizer as component S, this preferably in a proportion of 0 to 3% by weight, particularly preferably 0.02 to 2.0% by weight, based in each case on the total weight of the Components X, T, S or P, T, S or the molding compound FM is included.

According to a preferred embodiment, the heat stabilizers are selected from the group consisting of: • Compounds of mono- or divalent copper, e.g. Salts of mono- or divalent copper with inorganic or organic acids or mono- or divalent phenols, the oxides of a - Or divalent copper, or the complex compounds of copper salts with ammonia, amines, amides, lactams, cyanides or phosphines, preferably Cu(I) or Cu(II) salts of hydrohalic acids, hydrocyanic acids or the copper salts of aliphatic carboxylic acids. The monovalent copper compounds CuCl, CuBr, CuI, CuCN and Cu2O, and the divalent copper compounds CuCl2, CuSO4, CuO, copper(II) acetate or copper(II) stearate are particularly preferred. The copper compounds are advantageously used in combination with other metal halides, in particular alkali metal halides such as NaI, KI, NaBr, KBr, or ammonium halides, the molar ratio of metal halide to copper halide being 0.5 to 20, preferably 1 to 10 and particularly preferably 3 to 7. • Lanthanide compounds selected from the group consisting of acetates, fluorides, chlorides, bromides, iodides, oxyhalides, sulfates, nitrates, phosphates, chromates, perchlorates, oxalates, the monochalcogenides of sulfur, selenium and tellurium, carbonates, hydroxides, oxides, trifluoromethanesulfonates , acetylacetonates, alcoholates, 2-ethylhexanoates of the lanthanides lanthanum, cerium, praeseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium and - hydrates of the salts mentioned and - mixtures of the said Links. Cerium or lanthanum compounds are particularly preferred, and the use of lanthanum(III) hydroxide, lanthanum(III) oxide hydroxide and cerium tetrahydroxide is particularly preferred here. Furthermore, it is preferred that the cation of the lanthanide compounds has an oxidation number of +III or +IV. The lanthanide compounds are preferably used in combination with alkali metal halides, alkaline earth metal halides and/or the copper compounds mentioned above. • Stabilizers based on secondary aromatic amines, these stabilizers preferably being present in an amount of 0.2 to 2, preferably 0.2 to 1.5% by weight, • Stabilizers based on sterically hindered phenols, these stabilizers preferably being present in an amount of 0.1 to 1.5 , preferably from 0.2 to 1.0% by weight, and • phosphites and phosphonites, and • mixtures of the aforementioned stabilizers.

Particularly preferred examples of stabilizers based on secondary aromatic amines that can be used according to the invention are adducts of phenylenediamine with acetone (Naugard A), adducts of phenylenediamine with linolene, Naugard 445, N,N'-dinaphthyl-p-phenylenediamine, N-phenyl- N'-cyclohexyl-p-phenylenediamine or mixtures of two or more thereof.

In principle, all compounds with a phenolic structure which have at least one bulky group on the phenolic ring are suitable as sterically hindered phenols. Preferred examples of stabilizers based on sterically hindered phenols which can be used according to the invention are N,N'-hexamethylenebis-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, bis-(3,3-bis- (4'-Hydroxy-3'-tert-butylphenyl)butyric acid) glycol ester, 2,1'-Thioethylbis(3-(3,5-di.tert-butyl-4-hydroxyphenyl)propionate, 4-4 '-butylidene bis (3-methyl-6-tert-butylphenol), triethylene glycol 3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate or mixtures of two or more of these stabilizers.

Preferred phosphites and phosphonites are triphenyl phosphite, diphenylalkyl phosphite, phenyldialkyl phosphite, tris(nonylphenyl) phosphite, trilauryl phosphite, trioctadecyl phosphite, distearylphentaerythritol diphosphite, tris(2,4-di-tert-butylphenyl)phosphite, diisodecylpentaerythritol diphosphite, bis(2,4-di- tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methyl-phenyl)pentaerythritol diphosphite, diisodecyloxypentaerythritol diphosphite, bis(2,4-di-tert-butyl-6-methylphenyl)pentaerythritol diphosphite, bis(2 ,4,6-tris(tert-butylphenyl))pentaerythritol diphosphite, tristearylsorbitol triphosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylenediphosphonite, 6-isooctyloxy-2,4,8,10 -tetra-tert-butyl-12H-dibenz-[d,g]-1,3,2-dioxaphosphocine, 6-Fluoro-2,4,8,10-tetra-tert-butyl-12-methyl-dibenz[d ,g]-1,3,2-dioxaphosphocin, bis(2,4-di-tert-butyl-6-methylphenyl)methyl phosphite and bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite. In particular, preferably tris[2-tert-butyl-4-thio(2'-methyl-4'-hydroxy-5'-tert-butyl)phenyl-5-methyl]phenyl phosphite and tris(2,4-di - tert -butylphenyl) phosphite (Irgafos 168).

A preferred embodiment of the heat stabilizer consists in the combination of organic heat stabilizers (in particular Irgafos 168 and Irganox 1010), a bisphenol A based epoxy (in particular Epikote 1001) and a copper stabilization based on Cul and Kl. A commercially available stabilizer mixture consisting made of organic stabilizers and epoxides is, for example, Irgatec NC66 or Recylobyk 4371. Heat stabilization based exclusively on Cul and Kl is particularly preferred mixtures thereof in concentrations of up to 1% by weight, based on the total weight of components X, T, S or P, T, S or the molding composition FM.

Various substituted resorcinols, salicylates, benzotriazoles and benzophenones may be mentioned as UV stabilizers, which are generally used in amounts of up to 2% by weight, based on the weight of the polyamide molding composition FM.

Inorganic pigments such as titanium dioxide, barium sulfate, zinc oxide, ultramarine blue, iron oxide and carbon black and/or graphite, organic pigments such as phthalocyanines, quinacridones, perylenes and dyes such as nigrosine and anthraquinones can also be added as colorants.

Component S can also include impact modifiers, preferably these are selected from the group consisting of polyolefins, polyolefin copolymers, styrene copolymers, styrene block copolymers, ionic ethylene copolymers, which can be partially neutralized by metal ions, and mixtures thereof. The impact modifiers are preferably functionalized. It is also possible to use core-shell or core-shell(1)-shell(2) impact modifiers, which preferably have a hard core based on acrylates or methacrylates and a soft, rubber-like shell. The polyamide molding compositions FM preferably contain 0 to 35% by weight, particularly preferably 5 to 20% by weight, of impact modifiers.

According to a preferred embodiment of the present invention, the impact modifiers of component S are functionalized by copolymerization and/or by grafting. A compound selected from the group consisting of unsaturated carboxylic acids, unsaturated carboxylic acid derivatives and mixtures thereof and/or unsaturated glycidyl compounds is particularly preferably used for this purpose. This is particularly preferably selected from the group consisting of unsaturated carboxylic acid esters, in particular acrylic acid esters and/or methacrylic acid esters, unsaturated carboxylic acid anhydrides, in particular maleic anhydride, glycidylacrylic acid, glycidylmethacrylic acid, α-ethylacrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, aconitic acid, tetrahydrophthalic acid, butenylsuccinic acid and mixtures thereof .

If the impact modifiers are functionalized by copolymerization, the proportion by weight of each individual compound used for the functionalization is preferably in the range from 3 to 25% by weight, particularly preferably from 4 to 20% by weight and particularly preferably from 4.5 to 15 % by weight, in each case based on the total weight of the functionalized impact modifiers S.

If the impact modifiers are functionalized by grafting, the proportion by weight of each individual compound used for functionalization is preferably in the range from 0.3 to 2.5% by weight, particularly preferably from 0.4 to 2.0% by weight and particularly preferably from 0.5 to 1.9 % by weight, in each case based on the total weight of the functionalized impact modifiers S.

As impact modifiers are preferably selected polyolefins or polyolefin copolymers from the group consisting of polyethylene, polypropylene, polybutylene, ethylene-α-olefin copolymers, propylene-α-olefin copolymers, ethylene-propylene copolymers, ethylene-propylene Diene copolymers and mixtures thereof, the α-olefins preferably having 3 to 18 carbon atoms. Particularly preferred are the α-olefins selected from the group consisting of propene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene and mixtures thereof. Among the ethylene-α-olefin copolymers, ethylene-propylene copolymers, ethylene-1-butene copolymers or ethylene-propylene-1-butene copolymers are preferred.

The styrene copolymers are preferably styrene copolymers with a comonomer selected from the group consisting of butadiene, isoprene, acrylate and mixtures thereof. The styrene block copolymers are preferably selected from the group consisting of styrene-butadiene-styrene triblock copolymers (SBS), styrene-isoprene-styrene triblock copolymers (SIS), styrene-ethylene/butylene-styrene triblock copolymer (SEBS), styrene-ethylene / propylene styrene triblock copolymer (SEPS) and blends thereof.

The styrene-ethylene/butylene-styrene triblock copolymers are linear triblock copolymers composed of an ethylene/butylene block and two styrene blocks. The styrene-ethylene/propylene-styrene triblock copolymers are linear triblock copolymers composed of an ethylene/propylene block and two styrene blocks.

The proportion of styrene in the styrene-ethylene/butylene-styrene or styrene-ethylene/propylene-styrene triblock copolymers is preferably from 20 to 45% by weight, more preferably from 25 to 40% by weight and very particularly preferably from 25 to 35% by weight.

The ionic ethylene copolymers preferably consist of the monomers selected from the group consisting of ethylene, propylene, butylene, acrylic acid, acrylate, methacrylic acid, methacrylate and mixtures thereof, the acid groups being partially neutralized with metal ions, ethylene- Methacrylic acid copolymers or ethylene-methacrylic acid-acrylate copolymers in which the acid groups are partially neutralized with metal ions. The metal ions used for neutralization are preferably sodium, zinc, potassium, lithium, magnesium ions and mixtures thereof, sodium, zinc and magnesium ions being particularly preferred.

The present invention also includes moldings produced from the inventive polyamides X or the polyamide molding compound FM or having at least one area or a coating of a polyamide X or a polyamide molding compound FM, preferably produced by injection molding, injection blow molding, injection compression molding , pultrusion, melt spinning, extrusion or blow molding.

These shaped bodies are preferably selected from the group consisting of fibers, foils, profiles, pipes, containers, semi-finished products, finished parts or hollow bodies, spectacle parts, in particular privacy screens or window panes, housings or components for switches or fuses, sensor elements or sensor covers, components for the security area or surveillance, camera components, such as lenses, housings or covers, spectacle frames, spectacle frames or temples, in particular for safety glasses, sports goggles or ski goggles, sports equipment, in particular ski boots, touring ski boots, snowboard boots or helmets, housings, housing parts, frames, protective housings, covers or cladding elements, in particular for electrical devices, electronic devices, electro-optical devices, electro-optical components, connectors, fans, in particular fan wheels, office automation devices, entertainment electronics, portable computers, in particular laptops, notebooks oks, netbooks and tablet PCs, game consoles, navigation devices, measuring devices, personal digital assistance devices, telecommunications devices, cameras, (wrist) watches, computers, electronic storage devices, keyboards, music recorders, digital music players (e.g. CD and MP3 players), e-books, mobile phones, smartphones or drones, unpainted visible parts with or without function, in the vehicle interior or trunk, household, mechanical engineering, on electrical devices, electronic devices, household appliances, furniture, in particular fan blades, shift levers, shift paddles, Buttons, knobs, grab handles, seat adjustment controls, controls on the steering column, control levers, controls, drawers, holders for additional equipment, cup holders, luggage hooks, covers, light switches, razor heads, scissor parts, threaded rods, in particular for insulin pumps, housings and decorative elements, sanitary components, i.e with contact to cold/warm/hot media containing water or hot water or hot water, water meters, water meter housings and water meter components, including bearings, propellers, pylons, pipes, lines, pipe connectors, fittings, in particular for drinking water applications, valves, fittings, household appliances, hot water tanks riders, rice cookers, steam cookers, steam irons, parts for tea and coffee machines, shaped bodies in contact with hot water in the water supply, such as in particular hot water tanks, and in heating and cooling systems, in particular oil, gas, wood and solar heating systems as well as heat pumps and room heating systems, Headlight housing, reflectors, cornering light adjustment, gears, plug connections, connectors.

Finally, the invention also includes the use of a polyamide X according to any one of claims 1 to 8, or of a polyamide molding compound FM according to any one of claims 10 to 12, for the production of the moldings described above, especially in the form of fibers , films, profiles, pipes, containers, semi-finished products, finished parts or hollow bodies and for coating molded bodies.

WAYS TO CARRY OUT THE INVENTION

Measurement methods:

Relative viscosity (solution viscosity ηrel)

The relative viscosity was determined at 20° C. in accordance with ISO 307 (2007). For this purpose, 0.5 g of polymer granules were dissolved in 100 ml of m-cresol; the calculation of the relative viscosity (RV) according to RV = t/t0 was based on section 11 of the standard.

Haze,Transparency

Transparency and haze were measured according to ASTM D1003-13 (2013) on a Haze Gard Plus measuring device from BYK Gardner using 2 mm thick plates (60 mm×60 mm surface) with CIE illuminant C at 23° C. An injection mold in which the surfaces of the cavity were highly polished was used to produce the plates (2 mm × 60 mm × 60 mm). The plates were used in the dry state, i.e. after injection molding they were stored for at least 48 h at 23 °C in a dry environment, i.e. over silica gel.

Melting point (Tm) and enthalpy of fusion (ΔHm)

The melting point and enthalpy of fusion were determined on the granules according to ISO 11357-3 (2013). The DSC (Differential Scanning Calorimetry) measurements were carried out with a heating rate of 20 K/min.

glass transition temperature Tg

The glass transition temperature Tg was determined according to ISO 11357-2 (2013) on granules by means of differential scanning calorimetry (DSC). This was carried out for each of the two heatings at a heating rate of 20 K/min. After the initial heating, the sample was quenched in dry ice. The glass transition temperature (Tg) was determined on the second heating. The midpoint of the glass transition range, which was given as the glass transition temperature, was determined using the "Half Height" method.

Flame retardant classification

The flame retardant classification is determined according to UL94 (“Tests for Flammability of Plastic Materials for Parts in Devices and Applications” by Underwriters Laboratories) on test specimens with dimensions of 127×12.7×0.5 mm, which have previously been 48 h in a standard climate at 23° C and a relative humidity of 50%.

Examples PA-1 to PA-2

The diamine MACM (component A), the phosphorus-containing dicarboxylic acid (component B) and, in example PA-2, additional aminododecanoic acid (component F) were introduced into a 2000 ml autoclave together with 20 percent by weight of water, based on the total batch, with the individual amounts were chosen according to the composition given in Table 1 so that the total batch yielded about 1100 g. The batch was heated to a temperature of 240° C. with stirring and then kept at this temperature for one hour during the printing phase. The pressure was then released over a period of one hour and the temperature increased to 270.degree. The polycondensate formed was then discharged from the autoclave through an opening and granulated after cooling in a water bath. The granules were then dried at 90° C. and a vacuum of 30 mbar for 24 hours.

Table 1. Composition and properties of polyamides PA-1 and PA-2

Component Unit MACM (component A) mol% 50 35 3,5-dicarboxyphenyldiphenylphosphine oxide (component B) mol% 50 35 aminododecanoic acid (component F) mol% 0 30 Properties Relative viscosity (ηrel) - 1.80 1.73 Glass transition temperature* °C 185 162 Melting temperature* °C - - Enthalpy of fusion* J/g < 1 < 1 Haze % 1.5 2.0 Transmission % 93 93 Phosphorus content % by weight 5.45 4.45 Fire classification UL94 Sample thickness: 0.5 mm Conditioning: 48 h, 23 °C, 50 %RH - V0 V0 * Values of the 2nd heating

Claims (15)

1. Polyamide X with the polyamide units AB/AC/AD/EB/EC/ED/F, where at least the polyamide units AB must be present, the polyamide units AC, AD, EB, EC, ED and F are optional and wherein the monomer units A, B, C, D, E and F are derived from the following molecules, which are amidically bound in the polyamide X: A: Cycloaliphatic diamines; B: Phosphorus-containing, aromatic dicarboxylic acids according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently C1 - C8-alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, are Cl, Br or P(R1)(R2)O; C: Aliphatic dicarboxylic acids; D: Aromatic phosphorus-free dicarboxylic acids; E: Acyclic aliphatic diamines; F: α,ω-aminocarboxylic acids, lactams. 2. Polyamide according to claim 1, characterized in that the content of the polyamide units AB or the sum of the contents of the polyamide units AB and EB is 1 to 100 mol%, preferably 10 to 90 mol% and particularly preferably 20 to 80 mol %, based in each case on a polyamide X with the polyamide units AB/AC/AD/EB/EC/ED/F. 3. Polyamide according to one of the preceding claims, characterized in that at least one of the following selection groups for components A to F is selected, preferably the selection groups for components A and B are selected, particularly preferably the selection groups for components A, B , C and D are selected and in particular preferably all selection groups are selected at the same time: A: The cycloaliphatic diamines are selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane, bis(4-aminocyclohexyl)methane, bis(4-amino-3,5-dimethylcyclohexyl)methane, and mixtures thereof ; B: the phosphorus-containing, aromatic dicarboxylic acids are selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, 2,4-dicarboxyphenyldiphenylphosphine oxide, 2,4-dicarboxyphenyldimethylphosphine oxide, 2,4-dicarboxyphenyldiethylphosphine oxide, preferably selected from 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide or 3,5-dicarboxyphenyldiethylphosphine oxide, particularly preferably selected from 3,5-dicarboxyphenyldiphenylphosphine oxide; C: the aliphatic dicarboxylic acids are selected from the group consisting of adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1, 4-dicarboxylic acid and mixtures thereof;. D: the aromatic phosphorus-free dicarboxylic acids are selected from the group consisting of terephthalic acid, isophthalic acid and mixtures thereof, preferably selected as a mixture of terephthalic acid and isophthalic acid; E: the acyclic aliphatic diamines are selected from the group consisting of 1,6-hexanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine, preferably selected as 1,6-hexanediamine or 1,10 -decanediamine; F: the α,ω-aminocarboxylic acids or the lactams F are selected from the group consisting of α,ω-aminoundecanoic acid, caprolactam, laurolactam and mixtures thereof. 4. Polyamide according to one of the preceding claims, characterized in that the polyamide X comprises at least the polyamide units AB and AC; or comprises at least the polyamide units AB and AD; or comprises at least the polyamide units AB, AC and AD. 5. Polyamide according to one of the preceding claims, characterized in that the polyamide units AC are selected from the group consisting of the polyamide units MACM10, MACM12, MACM14, MACM16, MACM18, PACM10, PACM12, PACM14, PACM16, PACM18, TMDC10 , TMDC12, TMDC14, TMDC16 and TMDC18; and or the polyamide units AD are selected from the group consisting of the polyamide units MACMI, MACMT, PACMI, PACMT, TMDCI and TMDCT. 6. Polyamide according to one of the preceding claims, characterized in that the polyamide comprises at least the polyamide units AB and AC and/or AD, the content of the polyamide units AB being 1 to 99 mol %, preferably 10 to 90 mol %. %, particularly preferably 20 to 80 mol % and the content of the polyamide units AC and/or AD or the sum of AC and AD 1 to 99 mol %, preferably 10 to 90 mol %, particularly preferably 20 to 80 mol %, based in each case on the sum of the polyamide units AB, AC and AD. 7. Polyamide according to one of the preceding claims, characterized in that the polyamide X exclusively consists of the polyamide units AB or AB and F; or consists of the polyamide units AB and AC or AB, AC and F; or consists of the polyamide units AB, AC and AD or AB, AC, AD and F. 8. Polyamides according to one of the preceding claims, characterized in that the polyamide X has a transparency of at least 85%, preferably at least 90%, particularly preferably at least 92% and a haze of at most 7%, preferably at most 5%, in particular preferably of a maximum of 3%, each determined according to the ASTM D1003:2013 method with the illuminant CIE-C on a plate with a thickness of 2 mm; and or the polyamide X has a solution viscosity ηrel, determined using a solution of 0.5 g of polymer granules in 100 ml of m-cresol at 20° C. according to ISO 307:2007, in the range from 1.4 to 2.5, preferably in the range from 1.4 to 2.0, in particular in the range from 1.45 to 1.85; and or the polyamide X has a flame retardant classification V0, determined according to UL94 on test specimens with the dimensions 127 × 12.7 × 0.35 mm, 127 × 12.7 × 0.5 mm, 127 × 12.7 × 0.75 mm, 127 × 12.7 × 1.5 mm and 127 × 12.7 × 3.0 mm that have previously been conditioned for 48 h in a standard climate at 23 °C and a relative humidity of 50% or stored for 7 days at 70 °C in a convection oven. 9. A process for preparing a polyamide according to any one of claims 1 to 8, characterized in that the process involves a polycondensation reaction between at least one phosphorus-containing, aromatic dicarboxylic acid B according to formula 1, 2 and/or 3, where the substituents R1, R2 are each independently of the other C1 - C8 alkyl or aryl and the substituents R3, R4, R5 are each independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O; and at least one cycloaliphatic diamine A; and optionally further monomers C, D, E and F, optionally in the presence of monofunctional regulators G and/or process auxiliaries. 10. Polyamide molding composition FM containing the polyamide X according to any one of claims 1 to 8, and at least one filler and/or at least one additive and/or a polyamide Y different from polyamide X. 11. Polyamide molding composition FM according to claim 10, characterized in that it contains the following components or preferably consists of the following components: 20 to 99.99% by weight of polyamide X 0 to 60% by weight of at least one filler T; 0.01 to 60% by weight of at least one additive S different from X and T; where components S, T and X together add up to 100% by weight. 12. Polyamide molding compound FM according to claim 10, characterized in that the polyamide molding compound FM contains the following components or preferably consists of the following components: 20 to 100% by weight of a polymer mixture P containing or preferably consisting of 10 to 90% by weight of polyamide X and 10 to 90 wt , polyamide 11, polyamide 12, polyamide 6/12 or mixtures thereof, the sum of X and Y being 100% by weight of the polymer mixture P; 0 to 50% by weight of at least one filler T; 0 to 50% by weight of at least one additive S different from X, Y and T; where the components P, S and T together add up to 100% by weight. 13. Shaped body made from a polyamide X according to any one of claims 1 to 8, or from a polyamide molding composition FM according to any one of claims 10 to 12 or having at least one region or a coating made from a polyamide X according to any one of claims 1 to 8, or from a polyamide molding composition FM according to any one of claims 10 to 12, preferably produced by injection molding, injection blow molding, injection compression molding, pultrusion, melt spinning, extrusion or blow molding. 14. Shaped body according to claim 13, characterized in that the shaped body is selected from the group consisting of fibers, films, profiles, pipes, containers, semi-finished products, finished parts or hollow bodies, spectacle parts, in particular privacy screens or window panes, housings or components for switches or fuses , sensor elements or sensor covers, components for the security area or surveillance, camera components such as e.g. Housing parts, frames, protective housings, covers or cladding elements, in particular for electrical devices, electronic devices, electro-optical devices, electro-optical components, connectors, fans, in particular fan wheels, office automation devices, consumer electronics, portable Computers, in particular laptops, notebooks, netbooks and tablet PCs, game consoles, navigation devices, measuring devices, personal digital assistance devices, telecommunications devices, cameras, clocks, watches, calculators, electronic storage devices, keyboards, music recorders, digital music players, e.g. CD and MP3 players, e-books, mobile phones, smartphones or drones, unpainted visible parts with or without function, in the vehicle interior or trunk, household, mechanical engineering, on electrical devices, electronic devices, household appliances, furniture, especially fan blades, shift levers, shift paddles, buttons , knobs, grab handles, seat adjustment controls, controls on the steering column, control levers, controls, drawers, holders for additional equipment, cup holders, luggage hooks, covers, light switches, razor heads, scissor parts, threaded rods, in particular for insulin pumps, housings and decorative elements, sanitary components, i.e. with contact with cold/was men/hot media containing water or hot water or hot water, water meters, water meter housings and water meter components, including bearings, propellers, pylons, pipes, lines, pipe connectors, fittings, in particular for drinking water applications, valves, fittings, household appliances, water heaters, rice cookers, steam cookers, steam irons , parts for tea and coffee machines, shaped bodies in contact with hot water in the water supply, such as in particular hot water storage tanks, and in heating and cooling systems, in particular oil, gas, wood and solar heating systems as well as heat pumps and room heating systems, headlight housings, reflectors, cornering light adjustment, gears , plug connections, connectors. 15. Use of a polyamide X according to any one of claims 1 to 8, or of a polyamide molding compound FM according to any one of claims 10 to 12, for the production of shaped bodies according to claims 13 and 14, in particular fibers, foils, profiles, pipes, Containers, semi-finished products, finished parts or hollow bodies and for coating molded bodies.