CH683759A5 - Assembly module for PCB for connection of screened conductors - Google Patents

Assembly module for PCB for connection of screened conductors Download PDF

Info

Publication number
CH683759A5
CH683759A5 CH240692A CH240692A CH683759A5 CH 683759 A5 CH683759 A5 CH 683759A5 CH 240692 A CH240692 A CH 240692A CH 240692 A CH240692 A CH 240692A CH 683759 A5 CH683759 A5 CH 683759A5
Authority
CH
Switzerland
Prior art keywords
printed circuit
circuit board
connection
predetermined breaking
modular
Prior art date
Application number
CH240692A
Other languages
German (de)
Inventor
Hans Reichle
Original Assignee
Reichle & De Massari Fa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reichle & De Massari Fa filed Critical Reichle & De Massari Fa
Priority to CH240692A priority Critical patent/CH683759A5/en
Priority to EP93111518A priority patent/EP0586841A1/en
Priority to US08/093,673 priority patent/US5402315A/en
Priority to CA002101038A priority patent/CA2101038A1/en
Priority to TW082105964A priority patent/TW255090B/zh
Priority to KR1019930014510A priority patent/KR940006440A/en
Priority to CN93109190A priority patent/CN1086948A/en
Priority to AU44331/93A priority patent/AU4433193A/en
Publication of CH683759A5 publication Critical patent/CH683759A5/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Abstract

The printed circuit board has a multi-modular arrangement of modular connection and switching limits (2, 3), next to one another. The printed circuit board (1) has one rated breakage point (4) each between adjacent modules of connection and switching units (2, 3) so as to obtain single module printed circuit boards by breaking.The assembly module for the printed circuit board has a grounding pad (1) which may be connected with the printed circuit board in a fixed manner. On the pad at least one spring clamp (2, 2') has an approximately shell-shaped conductor accommodating area (3) and is intended for detachably enclosing at least one conductor is supported in a conductive way.

Description

1 1

CH 683 759 A5 CH 683 759 A5

2 2nd

Beschreibung description

Die vorliegende Erfindung betrifft eine Printplatte. The present invention relates to a printed circuit board.

in vielen Bereichen der Installationstechnik, insbesondere bei Schwachstromanlagen für Telefonie und Datenübertragung finden Printplatten immer häufiger Anwendung. In many areas of installation technology, especially in low-voltage systems for telephony and data transmission, printed circuit boards are being used more and more frequently.

Problematisch ist hierbei allerdings, dass ein Bedarf an modularen wie auch mehrfach-modularen Printplatten mit unterschiedlicher Anzahl von Modulen besteht und der Aufbau der betreffenden Anlagen ständigen Änderungen unterworfen ist, die den Einsatz weiterer oder weniger Printplatten der vorgegebenen Art verlangen. The problem here, however, is that there is a need for modular as well as multi-modular print plates with different numbers of modules, and the structure of the systems in question is subject to constant changes that require the use of more or fewer print plates of the specified type.

Dies alles bedarf einer grossen Anzahl modularer Printplatten der gleichen Bestückung pro Anlage in der Lagerhaltung, was aufwendig und teuer ist. All of this requires a large number of modular printed circuit boards of the same configuration per system in storage, which is complex and expensive.

Aufgabe der vorliegenden Erfindung ist deshalb die Schaffung einer Printplatte, welche den gestellten Anforderungen nach Mehrfach- resp. Einfach-Modulität gerecht wird. The object of the present invention is therefore to create a printed circuit board which meets the requirements for multiple or. Simple modularity is enough.

Dies wird erfindungsgemäss zunächst erreicht durch eine mehrfach-modulare Anordnung von modularen Anschluss- und Schaltungsmitteln nebeneinander, wobei die Printplatte jeweils zwischen benachbarten Modulen von Anschluss- und Schaltungsmitteln eine Sollbruchstelle aufweist zur Herstellung von Einzel-Modul-Printplatten durch Abbrechen. According to the invention, this is first achieved by a multiple-modular arrangement of modular connection and circuit means next to one another, the printed circuit board each having a predetermined breaking point between adjacent modules of connection and circuit means for the production of single-module printed circuit boards by breaking off.

Durch diese Massnahmen ist es nunmehr möglich, mehrfach-modulare Printplatten mit beliebiger Anzahl Module aufzubauen, die dann geeignet sind, davon einfach-modulare oder mehrfach-modulare Teilplatten geringerer Modulanzahl durch einfaches Brechen zu gewinnen, was sowohl Fabrikation als auch Lagerhaltung wesentlich vereinfacht. Through these measures, it is now possible to build multi-modular print plates with any number of modules, which are then suitable to obtain single-modular or multi-modular sub-plates with a smaller number of modules by simple breaking, which considerably simplifies both production and warehousing.

Sind die Printplatten für den Anschluss elektrischer Leiter, die gegen störende äussere elektrische Felder durch eine sehr gut leitende metallische Umhüllung abgeschirmt sind, wird eine bevorzugte Ausgestaltung der erfindungsgemässen Printplatte erreicht durch eine, sich über die ganze Länge der Printplatte erstreckende metallische Erdungsplatte, welche jeweils in der Erstreckung der Sollbruchstellen der Printplatte eine Sollbruchstelle aufweist zur gemeinsamen Vereinzelung von Printplatte und Erdungsplatte durch Abbrechen. If the printed circuit boards for the connection of electrical conductors, which are shielded from disturbing external electrical fields by a highly conductive metallic sheath, a preferred embodiment of the printed circuit board according to the invention is achieved by a metallic grounding plate which extends over the entire length of the printed circuit board and which is in each case in the extension of the predetermined breaking points of the printed circuit board has a predetermined breaking point for the individual separation of the printed circuit board and the grounding plate by breaking off.

Hierbei ist es von Vorteil, wenn die metallische Erdungsplatte als Mehrfach-Modul ausgebildet ist und nebeneinander angeordnet eine Mehrzahl, zum lösbaren Umschliessen eines abgemantelten Leiterbereiches eines abgeschirmten Leiters bestimmte Feder-Klammern o.dgl. aufweist, wobei sich jeweils zwischen zwei benachbarten Feder-Klammern eine Sollbruchstelle erstreckt. It is advantageous here if the metallic grounding plate is designed as a multiple module and a plurality of spring clips or the like are arranged next to one another and are intended for releasably enclosing a stripped conductor area of a shielded conductor. has, wherein a predetermined breaking point extends between two adjacent spring clips.

Eine beispielsweise Ausführungsform des Erfindungsgegenstandes ist nachfolgend anhand der Zeichnung, welche die erfindungsgemässe Printplatte in schaubildartiger Darstellung zeigt, näher erläutert. An example embodiment of the subject matter of the invention is explained in more detail below with reference to the drawing, which shows the printed circuit board according to the invention in a diagram-like representation.

Die erfindungsgemässe Printplatte 1 ist hier mehr-modular mit nebeneinander angeordneten Verbindungsmodulen aus u.a. Steckmitteln 3 und Aderanschlussmitteln 2 o.dgl. ausgebildet und weist innerhalb des Verbindungsmoduls eine hier nicht näher gezeigte, anwendungskonforme gedruckte Schaltung auf. The printed circuit board 1 according to the invention is here multi-modular with connection modules arranged next to one another made of Plug means 3 and wire connection means 2 or the like. formed and has an application-conforming printed circuit, not shown here, within the connection module.

Erfindungsgemäss weist diese mehrfachmoduiare Printplatte 1 zwischen den Modulen 2, 3 und in vorgegebenen Abständen parallele Rillungen o.dgl. auf, welche Sollbruchstellen 4 zur Herstellung von Einzel-Modulen durch Abbrechen bilden. According to the invention, this multi-module printed circuit board 1 has parallel grooves or the like between the modules 2, 3 and at predetermined intervals. on which predetermined breaking points 4 form for producing individual modules by breaking off.

Sind die Printplatten für den Anschluss elektrischer Leiter, die gegen störende äussere elektrische Felder durch eine sehr gut leitende metallische Umhüllung abgeschirmt sind, wird eine, sich über die ganze Länge der Printplatte 1 erstreckende metallische Erdungsplatte 21 aufgebracht, welche jeweils in der Erstreckung der Sollbruchstellen 4 der Printplatte 1 eine Sollbruchstelle 24 aufweist zur gemeinsamen Vereinzelung von Printplatte und Erdungsplatte durch Abbrechen. If the printed circuit boards for the connection of electrical conductors, which are shielded from disturbing external electrical fields by a highly conductive metallic sheathing, a metallic grounding plate 21, which extends over the entire length of the printed circuit board 1, is applied, each in the extension of the predetermined breaking points 4 the printed circuit board 1 has a predetermined breaking point 24 for the individual separation of the printed circuit board and the grounding plate by breaking off.

Entsprechend ist die metallische Erdungsplatte 21 als Mehrfach-Modul ausgebildet und weist nebeneinander angeordnet eine Mehrzahl, zum lösbaren Umschliessen eines abgemantelten Leiterbereiches eines abgeschirmten Leiters bestimmte Feder-Klammern 22 o.dgl. auf, wobei sich jeweils zwischen zwei benachbarten Feder-Klammern eine Sollbruchstelle 24 erstreckt. Correspondingly, the metallic grounding plate 21 is designed as a multiple module and has a plurality of spring clips 22 or the like arranged next to one another, for releasably enclosing a stripped conductor area of a shielded conductor. , with a predetermined breaking point 24 extending between two adjacent spring clips.

Der Aufbau eines Printplatten-Moduls ist an sich völlig frei, ohne dabei den Rahmen des Erfindungsgedankens zu verlassen. Wesentlich ist der mehr-fachmodule Aufbau der Printplatte etwa mit der maximalen Anzahl von nebeneinanderliegenden Modulen einer Anwendung, welche Printplatte sich dann nach Bedarf vereinzeln lässt, wofür lediglich ein Abbrechen entlang der Sollbruchstelle erforderlich ist. The construction of a printed circuit board module is completely free in itself, without leaving the scope of the inventive concept. What is essential is the multi-module structure of the printed circuit board, for example with the maximum number of modules of an application lying next to one another, which printed circuit board can then be separated as required, for which purpose it is only necessary to break off along the predetermined breaking point.

Claims (3)

PatentansprücheClaims 1. Printplatte, gekennzeichnet durch eine mehr-fach-modulare Anordnung von modularen Anschluss- und Schaltungsmitteln (2, 3) nebeneinander, wobei die Printplatte (1) jeweils zwischen benachbarten Modulen von Anschluss- und Schaltungsmitteln (2, 3) eine Sollbruchstelle (4) aufweist zur Herstellung von Einzel-Modul-Printplatten durch Abbrechen.1. printed circuit board, characterized by a multiple modular arrangement of modular connection and circuit means (2, 3) next to one another, the printed circuit board (1) in each case between adjacent modules of connection and circuit means (2, 3) a predetermined breaking point (4 ) for the production of single module printed boards by canceling. 2. Printplatte nach Anspruch 1 für den Anschluss abgeschirmter Leiter, gekennzeichnet durch eine, sich über die ganze Länge der Printplatte (1) erstreckende metallische Erdungsplatte (21), welche jeweils in der Erstreckung der Sollbruchstellen (4) der Printplatte (1) eine Sollbruchstelle (24) aufweist zur gemeinsamen Vereinzelung von Printplatte und Erdungsplatte durch Abbrechen.2. Printed circuit board according to claim 1 for the connection of shielded conductors, characterized by a, over the entire length of the printed circuit board (1) extending metal grounding plate (21), each in the extension of the predetermined breaking points (4) of the printed circuit board (1) a predetermined breaking point (24) has for the common separation of the printed circuit board and the grounding plate by breaking off. 3. Printplatte nach Anspruch 2, dadurch gekennzeichnet, dass die metallische Erdungsplatte (21) als Mehrfach-Modul ausgebildet ist und nebeneinander angeordnet eine Mehrzahl, zum lösbaren Umschliessen eines abgemantelten Leiterbereiches eines abgeschirmten Leiters bestimmte Feder-Klam-mern (22) aufweist, wobei sich jeweils zwischen zwei benachbarten Feder-Klammern eine Sollbruchstelle (24) erstreckt.3. Printed circuit board according to claim 2, characterized in that the metallic grounding plate (21) is designed as a multiple module and arranged side by side has a plurality of spring clips (22) for detachably enclosing a stripped conductor area of a shielded conductor, wherein a predetermined breaking point (24) extends in each case between two adjacent spring clips. 55 1010th 1515 2020th 2525th 3030th 3535 4040 4545 5050 5555 6060 6565 22nd
CH240692A 1992-07-30 1992-07-30 Assembly module for PCB for connection of screened conductors CH683759A5 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CH240692A CH683759A5 (en) 1992-07-30 1992-07-30 Assembly module for PCB for connection of screened conductors
EP93111518A EP0586841A1 (en) 1992-07-30 1993-07-19 Printed circuit board and mounting module for connection of a shielded cable and distribution system for low-voltage installation construction
US08/093,673 US5402315A (en) 1992-07-30 1993-07-20 Printed circuit board and assembly module for connection of screened conductors for distribution boards and distribution systems in light-current systems engineering
CA002101038A CA2101038A1 (en) 1992-07-30 1993-07-21 Printed circuit board and assembly module for connection of screened conductors for distribution boards and distribution systems in light-current systems engineering
TW082105964A TW255090B (en) 1992-07-30 1993-07-27
KR1019930014510A KR940006440A (en) 1992-07-30 1993-07-29 Printed Circuit Boards and Assembly Modules for the Connection of Shielding Conductors for Distribution Boards and Distribution Systems in Photocurrent Systems Engineering
CN93109190A CN1086948A (en) 1992-07-30 1993-07-30 Printed circuit board (PCB) and assembling module
AU44331/93A AU4433193A (en) 1992-07-30 1993-07-30 Printed circuit board and assembly module for connection of screened conductors for distribution boards and distribution systems in light-current systems engineering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH240692A CH683759A5 (en) 1992-07-30 1992-07-30 Assembly module for PCB for connection of screened conductors

Publications (1)

Publication Number Publication Date
CH683759A5 true CH683759A5 (en) 1994-05-13

Family

ID=4233054

Family Applications (1)

Application Number Title Priority Date Filing Date
CH240692A CH683759A5 (en) 1992-07-30 1992-07-30 Assembly module for PCB for connection of screened conductors

Country Status (1)

Country Link
CH (1) CH683759A5 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19534515A1 (en) * 1995-09-16 1997-03-20 Braun Ag Identification of faulty parts in a complete layout of components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19534515A1 (en) * 1995-09-16 1997-03-20 Braun Ag Identification of faulty parts in a complete layout of components

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