CH638947B - Circuit pour piece d'horlogerie electronique, notamment pour montre-bracelet electronique. - Google Patents
Circuit pour piece d'horlogerie electronique, notamment pour montre-bracelet electronique.Info
- Publication number
- CH638947B CH638947B CH688678A CH688678A CH638947B CH 638947 B CH638947 B CH 638947B CH 688678 A CH688678 A CH 688678A CH 688678 A CH688678 A CH 688678A CH 638947 B CH638947 B CH 638947B
- Authority
- CH
- Switzerland
- Prior art keywords
- circuit
- electronic
- printed
- configuration
- conductors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
- Electromechanical Clocks (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7472977A JPS548871A (en) | 1977-06-23 | 1977-06-23 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
CH638947B true CH638947B (fr) | |
CH638947GA3 CH638947GA3 (en) | 1983-10-31 |
Family
ID=13555592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH688678A CH638947GA3 (en) | 1977-06-23 | 1978-06-23 | Circuit for electronic timepiece, especially for an electronic wristwatch |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS548871A (fr) |
CH (1) | CH638947GA3 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS608440A (ja) * | 1983-06-29 | 1985-01-17 | Toyota Motor Corp | アイドル回転速度制御装置の制御方法 |
DE29714186U1 (de) * | 1997-08-08 | 1998-12-10 | Gebrüder Junghans GmbH, 78713 Schramberg | Funkuhrwerk |
JP2003347741A (ja) | 2002-05-30 | 2003-12-05 | Taiyo Yuden Co Ltd | 複合多層基板およびそれを用いたモジュール |
WO2009011339A1 (fr) | 2007-07-18 | 2009-01-22 | Sharp Kabushiki Kaisha | Humidificateur, filtre, et structure d'entraînement en rotation |
JP4776595B2 (ja) * | 2007-07-25 | 2011-09-21 | シャープ株式会社 | 加湿装置及びフィルタ |
JP4840414B2 (ja) * | 2008-07-15 | 2011-12-21 | ダイキン工業株式会社 | 加湿装置 |
JP6953018B2 (ja) * | 2016-03-29 | 2021-10-27 | 積水ポリマテック株式会社 | フレキシブル回路基板及びフレキシブル回路基板の製造方法 |
-
1977
- 1977-06-23 JP JP7472977A patent/JPS548871A/ja active Pending
-
1978
- 1978-06-23 CH CH688678A patent/CH638947GA3/fr unknown
Also Published As
Publication number | Publication date |
---|---|
JPS548871A (en) | 1979-01-23 |
CH638947GA3 (en) | 1983-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CH638947B (fr) | Circuit pour piece d'horlogerie electronique, notamment pour montre-bracelet electronique. | |
CH638363GA3 (fr) | ||
FR2349164A1 (fr) | Circuit de reglage de montre electronique | |
JPS5292368A (en) | Electronic wrist watch substrate mounting structure | |
JPS54151071A (en) | Electronic timepiece circuit | |
FR2309911A1 (fr) | Circuit de commande de modes pour une horloge electronique | |
CH636744B (fr) | Montre electronique a affichage analogique. | |
JPS51146861A (en) | A structure of electronic timepieces. | |
JPS645894A (en) | Thin-type mounting type semiconductor device | |
CH642514B (fr) | Piece d'horlogerie electronique miniature, notamment montre-bracelet. | |
JPS52122161A (en) | Electronic watch | |
CH615313GA3 (en) | Method of manufacturing a constituent of an electronic timepiece, especially of a wristwatch, and electronic timepiece constituent resulting from this method | |
JPS5332382A (en) | Flexible printed substrate structure for electronic wrist watch | |
HK35380A (en) | Weekday determining circuit for an electronic timepiece | |
JPS5398878A (en) | Electronic watch | |
FR2484662B1 (fr) | Dispositif de commande des fonctions d'une montre electronique | |
JPS5558591A (en) | Structure for mounting electronic watch circuit | |
JPS5421715A (en) | Cabinet of electronic musical instruments | |
GB1519700A (en) | Circuit board assembly eg for use in an eletronic timepiece | |
CH625664B (fr) | Montre electronique. | |
JPS5425773A (en) | Integrated circuit for electronic watches | |
JPS5420765A (en) | Snoze mechanism of electronic alarm watches | |
JPS52128559A (en) | Circuit board for electronic wrist watch | |
JPS54140970A (en) | Circuit substrate for electronic watch | |
HK42579A (en) | An electronic digital clock or watch |