CH638947B - Circuit pour piece d'horlogerie electronique, notamment pour montre-bracelet electronique. - Google Patents

Circuit pour piece d'horlogerie electronique, notamment pour montre-bracelet electronique.

Info

Publication number
CH638947B
CH638947B CH688678A CH688678A CH638947B CH 638947 B CH638947 B CH 638947B CH 688678 A CH688678 A CH 688678A CH 688678 A CH688678 A CH 688678A CH 638947 B CH638947 B CH 638947B
Authority
CH
Switzerland
Prior art keywords
circuit
electronic
printed
configuration
conductors
Prior art date
Application number
CH688678A
Other languages
English (en)
Other versions
CH638947GA3 (en
Inventor
Kazuo Kawasumi
Original Assignee
Suwa Seikosha Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication of CH638947B publication Critical patent/CH638947B/fr
Application filed by Suwa Seikosha Kk filed Critical Suwa Seikosha Kk
Publication of CH638947GA3 publication Critical patent/CH638947GA3/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electromechanical Clocks (AREA)
CH688678A 1977-06-23 1978-06-23 Circuit for electronic timepiece, especially for an electronic wristwatch CH638947GA3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7472977A JPS548871A (en) 1977-06-23 1977-06-23 Semiconductor device

Publications (2)

Publication Number Publication Date
CH638947B true CH638947B (fr)
CH638947GA3 CH638947GA3 (en) 1983-10-31

Family

ID=13555592

Family Applications (1)

Application Number Title Priority Date Filing Date
CH688678A CH638947GA3 (en) 1977-06-23 1978-06-23 Circuit for electronic timepiece, especially for an electronic wristwatch

Country Status (2)

Country Link
JP (1) JPS548871A (fr)
CH (1) CH638947GA3 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608440A (ja) * 1983-06-29 1985-01-17 Toyota Motor Corp アイドル回転速度制御装置の制御方法
FR2548857B1 (fr) * 1983-07-04 1987-11-27 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
JPS60116191A (ja) * 1983-11-29 1985-06-22 イビデン株式会社 電子部品搭載用基板の製造方法
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
DE29714186U1 (de) * 1997-08-08 1998-12-10 Gebrüder Junghans GmbH, 78713 Schramberg Funkuhrwerk
JP2003347741A (ja) 2002-05-30 2003-12-05 Taiyo Yuden Co Ltd 複合多層基板およびそれを用いたモジュール
JP4776595B2 (ja) * 2007-07-25 2011-09-21 シャープ株式会社 加湿装置及びフィルタ
CN102628604B (zh) 2007-07-18 2014-12-10 夏普株式会社 加湿装置和转动驱动结构
JP4840414B2 (ja) * 2008-07-15 2011-12-21 ダイキン工業株式会社 加湿装置
DE112017000497T5 (de) * 2016-03-29 2018-11-15 Sekisui Polymatech Co., Ltd. Flexible Leiterplatte und Verfahren zur Herstellung einer flexiblen Leiterplatte

Also Published As

Publication number Publication date
JPS548871A (en) 1979-01-23
CH638947GA3 (en) 1983-10-31

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Legal Events

Date Code Title Description
PL Patent ceased