CH638947B - Circuit pour piece d'horlogerie electronique, notamment pour montre-bracelet electronique. - Google Patents

Circuit pour piece d'horlogerie electronique, notamment pour montre-bracelet electronique.

Info

Publication number
CH638947B
CH638947B CH688678A CH688678A CH638947B CH 638947 B CH638947 B CH 638947B CH 688678 A CH688678 A CH 688678A CH 688678 A CH688678 A CH 688678A CH 638947 B CH638947 B CH 638947B
Authority
CH
Switzerland
Prior art keywords
circuit
electronic
printed
configuration
conductors
Prior art date
Application number
CH688678A
Other languages
English (en)
Other versions
CH638947GA3 (en
Inventor
Kazuo Kawasumi
Original Assignee
Suwa Seikosha Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication of CH638947B publication Critical patent/CH638947B/fr
Application filed by Suwa Seikosha Kk filed Critical Suwa Seikosha Kk
Publication of CH638947GA3 publication Critical patent/CH638947GA3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Electromechanical Clocks (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CH688678A 1977-06-23 1978-06-23 Circuit for electronic timepiece, especially for an electronic wristwatch CH638947GA3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7472977A JPS548871A (en) 1977-06-23 1977-06-23 Semiconductor device

Publications (2)

Publication Number Publication Date
CH638947B true CH638947B (fr)
CH638947GA3 CH638947GA3 (en) 1983-10-31

Family

ID=13555592

Family Applications (1)

Application Number Title Priority Date Filing Date
CH688678A CH638947GA3 (en) 1977-06-23 1978-06-23 Circuit for electronic timepiece, especially for an electronic wristwatch

Country Status (2)

Country Link
JP (1) JPS548871A (fr)
CH (1) CH638947GA3 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608440A (ja) * 1983-06-29 1985-01-17 Toyota Motor Corp アイドル回転速度制御装置の制御方法
DE29714186U1 (de) * 1997-08-08 1998-12-10 Gebrüder Junghans GmbH, 78713 Schramberg Funkuhrwerk
JP2003347741A (ja) 2002-05-30 2003-12-05 Taiyo Yuden Co Ltd 複合多層基板およびそれを用いたモジュール
WO2009011339A1 (fr) 2007-07-18 2009-01-22 Sharp Kabushiki Kaisha Humidificateur, filtre, et structure d'entraînement en rotation
JP4776595B2 (ja) * 2007-07-25 2011-09-21 シャープ株式会社 加湿装置及びフィルタ
JP4840414B2 (ja) * 2008-07-15 2011-12-21 ダイキン工業株式会社 加湿装置
JP6953018B2 (ja) * 2016-03-29 2021-10-27 積水ポリマテック株式会社 フレキシブル回路基板及びフレキシブル回路基板の製造方法

Also Published As

Publication number Publication date
JPS548871A (en) 1979-01-23
CH638947GA3 (en) 1983-10-31

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