CH619103B - - Google Patents

Info

Publication number
CH619103B
CH619103B CH1239376A CH1239376A CH619103B CH 619103 B CH619103 B CH 619103B CH 1239376 A CH1239376 A CH 1239376A CH 1239376 A CH1239376 A CH 1239376A CH 619103 B CH619103 B CH 619103B
Authority
CH
Switzerland
Application number
CH1239376A
Other languages
French (fr)
Other versions
CH619103GA3 (en:Method
Inventor
Hiroo Kishimoto
Original Assignee
Seiko Instr & Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication of CH619103B publication Critical patent/CH619103B/fr
Application filed by Seiko Instr & Electronics filed Critical Seiko Instr & Electronics
Publication of CH619103GA3 publication Critical patent/CH619103GA3/xx

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
CH1239376A 1975-09-30 1976-09-30 CH619103GA3 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11850575A JPS5242765A (en) 1975-09-30 1975-09-30 Electronic watch

Publications (2)

Publication Number Publication Date
CH619103B true CH619103B (en:Method)
CH619103GA3 CH619103GA3 (en:Method) 1980-09-15

Family

ID=14738310

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1239376A CH619103GA3 (en:Method) 1975-09-30 1976-09-30

Country Status (8)

Country Link
US (1) US4086752A (en:Method)
JP (1) JPS5242765A (en:Method)
CA (1) CA1068911A (en:Method)
CH (1) CH619103GA3 (en:Method)
DE (1) DE2643973A1 (en:Method)
FR (1) FR2326730A1 (en:Method)
GB (1) GB1505607A (en:Method)
HK (1) HK84879A (en:Method)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4232512A (en) * 1976-12-27 1980-11-11 Citizen Watch Co., Ltd. Solid state watch module construction
US4196577A (en) * 1976-12-27 1980-04-08 Citizen Watch Co., Ltd. Electronic timepiece
JPS5381264A (en) * 1976-12-27 1978-07-18 Toshiba Corp Designing system for electronic watch
US4348751A (en) * 1977-06-20 1982-09-07 Hitachi, Ltd. Electronic device and method of fabricating the same
US4407590A (en) * 1977-12-10 1983-10-04 Citizen Watch Co., Ltd. Battery unit for an electric timepiece
US4391531A (en) * 1980-12-19 1983-07-05 Timex Corporation Electrooptical display/lead frame subassembly and timepiece module including same
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
JPH0652831B2 (ja) * 1987-09-30 1994-07-06 株式会社日立製作所 自動車用電子回路装置の密封構造
WO1990014626A1 (en) * 1989-05-15 1990-11-29 Dallas Semiconductor Corporation Systems with data-token/one-wire-bus
US5210846B1 (en) * 1989-05-15 1999-06-29 Dallas Semiconductor One-wire bus architecture
US5091771A (en) * 1989-05-15 1992-02-25 Dallas Semiconductor Corporation Compact package for electronic module
US5229641A (en) * 1989-11-25 1993-07-20 Hitachi Maxell, Ltd. Semiconductor card and manufacturing method therefor
US5619066A (en) * 1990-05-15 1997-04-08 Dallas Semiconductor Corporation Memory for an electronic token
US5994770A (en) * 1991-07-09 1999-11-30 Dallas Semiconductor Corporation Portable electronic data carrier
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5848541A (en) * 1994-03-30 1998-12-15 Dallas Semiconductor Corporation Electrical/mechanical access control systems
US5831827A (en) * 1994-04-28 1998-11-03 Dallas Semiconductor Corporation Token shaped module for housing an electronic circuit
US5604343A (en) * 1994-05-24 1997-02-18 Dallas Semiconductor Corporation Secure storage of monetary equivalent data systems and processes
US5679944A (en) * 1994-06-15 1997-10-21 Dallas Semiconductor Corporation Portable electronic module having EPROM memory, systems and processes
US5615130A (en) * 1994-12-14 1997-03-25 Dallas Semiconductor Corp. Systems and methods to gather, store and transfer information from electro/mechanical tools and instruments
US6322246B1 (en) * 1999-09-07 2001-11-27 Wing Root Limited Water-resistant movement holder for a pocket watch
EP1881379A1 (fr) * 2006-07-19 2008-01-23 ETA SA Manufacture Horlogère Suisse Pièce d'horlogerie électronique comportant une cloison rapportée et procédé d'assemblage associé

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784725A (en) * 1972-07-24 1974-01-08 Solitron Devices Electronic hybrid package
US3959964A (en) * 1972-08-03 1976-06-01 Kabushiki Kaisha Suwa Seikosha Mounting arrangement for timepiece components
US3905666A (en) * 1973-03-22 1975-09-16 Ebauches Sa Device for the electric connection between a display device of an electronic timepiece and the circuit controlling the said display device
US4042861A (en) * 1973-11-08 1977-08-16 Citizen Watch Company Limited Mounting arrangement for an integrated circuit unit in an electronic digital watch
US3975899A (en) * 1975-05-05 1976-08-24 Haber Terry M Multi-function watch casing
US4015422A (en) * 1975-06-02 1977-04-05 Bulova Watch Company, Inc. Solid-state electronic watch assembly

Also Published As

Publication number Publication date
GB1505607A (en) 1978-03-30
US4086752A (en) 1978-05-02
JPS5242765A (en) 1977-04-02
CH619103GA3 (en:Method) 1980-09-15
CA1068911A (en) 1980-01-01
FR2326730A1 (fr) 1977-04-29
DE2643973A1 (de) 1977-04-07
HK84879A (en) 1979-12-21

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Legal Events

Date Code Title Description
PL Patent ceased