CH619103B - - Google Patents

Info

Publication number
CH619103B
CH619103B CH1239376A CH1239376A CH619103B CH 619103 B CH619103 B CH 619103B CH 1239376 A CH1239376 A CH 1239376A CH 1239376 A CH1239376 A CH 1239376A CH 619103 B CH619103 B CH 619103B
Authority
CH
Switzerland
Application number
CH1239376A
Other languages
French (fr)
Other versions
CH619103GA3 (OSRAM
Inventor
Hiroo Kishimoto
Original Assignee
Seiko Instr & Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication of CH619103B publication Critical patent/CH619103B/fr
Application filed by Seiko Instr & Electronics filed Critical Seiko Instr & Electronics
Publication of CH619103GA3 publication Critical patent/CH619103GA3/xx

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
CH1239376A 1975-09-30 1976-09-30 CH619103GA3 (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11850575A JPS5242765A (en) 1975-09-30 1975-09-30 Electronic watch

Publications (2)

Publication Number Publication Date
CH619103B true CH619103B (OSRAM)
CH619103GA3 CH619103GA3 (OSRAM) 1980-09-15

Family

ID=14738310

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1239376A CH619103GA3 (OSRAM) 1975-09-30 1976-09-30

Country Status (8)

Country Link
US (1) US4086752A (OSRAM)
JP (1) JPS5242765A (OSRAM)
CA (1) CA1068911A (OSRAM)
CH (1) CH619103GA3 (OSRAM)
DE (1) DE2643973A1 (OSRAM)
FR (1) FR2326730A1 (OSRAM)
GB (1) GB1505607A (OSRAM)
HK (1) HK84879A (OSRAM)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4232512A (en) * 1976-12-27 1980-11-11 Citizen Watch Co., Ltd. Solid state watch module construction
US4196577A (en) * 1976-12-27 1980-04-08 Citizen Watch Co., Ltd. Electronic timepiece
JPS5381264A (en) * 1976-12-27 1978-07-18 Toshiba Corp Designing system for electronic watch
US4348751A (en) * 1977-06-20 1982-09-07 Hitachi, Ltd. Electronic device and method of fabricating the same
US4407590A (en) * 1977-12-10 1983-10-04 Citizen Watch Co., Ltd. Battery unit for an electric timepiece
US4391531A (en) * 1980-12-19 1983-07-05 Timex Corporation Electrooptical display/lead frame subassembly and timepiece module including same
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
JPH0652831B2 (ja) * 1987-09-30 1994-07-06 株式会社日立製作所 自動車用電子回路装置の密封構造
WO1990014626A1 (en) * 1989-05-15 1990-11-29 Dallas Semiconductor Corporation Systems with data-token/one-wire-bus
US5210846B1 (en) * 1989-05-15 1999-06-29 Dallas Semiconductor One-wire bus architecture
US5091771A (en) * 1989-05-15 1992-02-25 Dallas Semiconductor Corporation Compact package for electronic module
US5229641A (en) * 1989-11-25 1993-07-20 Hitachi Maxell, Ltd. Semiconductor card and manufacturing method therefor
US5619066A (en) * 1990-05-15 1997-04-08 Dallas Semiconductor Corporation Memory for an electronic token
US5994770A (en) * 1991-07-09 1999-11-30 Dallas Semiconductor Corporation Portable electronic data carrier
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5848541A (en) * 1994-03-30 1998-12-15 Dallas Semiconductor Corporation Electrical/mechanical access control systems
US5831827A (en) * 1994-04-28 1998-11-03 Dallas Semiconductor Corporation Token shaped module for housing an electronic circuit
US5604343A (en) * 1994-05-24 1997-02-18 Dallas Semiconductor Corporation Secure storage of monetary equivalent data systems and processes
US5679944A (en) * 1994-06-15 1997-10-21 Dallas Semiconductor Corporation Portable electronic module having EPROM memory, systems and processes
US5615130A (en) * 1994-12-14 1997-03-25 Dallas Semiconductor Corp. Systems and methods to gather, store and transfer information from electro/mechanical tools and instruments
US6322246B1 (en) * 1999-09-07 2001-11-27 Wing Root Limited Water-resistant movement holder for a pocket watch
EP1881379A1 (fr) * 2006-07-19 2008-01-23 ETA SA Manufacture Horlogère Suisse Pièce d'horlogerie électronique comportant une cloison rapportée et procédé d'assemblage associé

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784725A (en) * 1972-07-24 1974-01-08 Solitron Devices Electronic hybrid package
US3959964A (en) * 1972-08-03 1976-06-01 Kabushiki Kaisha Suwa Seikosha Mounting arrangement for timepiece components
US3905666A (en) * 1973-03-22 1975-09-16 Ebauches Sa Device for the electric connection between a display device of an electronic timepiece and the circuit controlling the said display device
US4042861A (en) * 1973-11-08 1977-08-16 Citizen Watch Company Limited Mounting arrangement for an integrated circuit unit in an electronic digital watch
US3975899A (en) * 1975-05-05 1976-08-24 Haber Terry M Multi-function watch casing
US4015422A (en) * 1975-06-02 1977-04-05 Bulova Watch Company, Inc. Solid-state electronic watch assembly

Also Published As

Publication number Publication date
GB1505607A (en) 1978-03-30
US4086752A (en) 1978-05-02
JPS5242765A (en) 1977-04-02
CH619103GA3 (OSRAM) 1980-09-15
CA1068911A (en) 1980-01-01
FR2326730A1 (fr) 1977-04-29
DE2643973A1 (de) 1977-04-07
HK84879A (en) 1979-12-21

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Legal Events

Date Code Title Description
PL Patent ceased