CH595884A5 - - Google Patents

Info

Publication number
CH595884A5
CH595884A5 CH1345475A CH1345475A CH595884A5 CH 595884 A5 CH595884 A5 CH 595884A5 CH 1345475 A CH1345475 A CH 1345475A CH 1345475 A CH1345475 A CH 1345475A CH 595884 A5 CH595884 A5 CH 595884A5
Authority
CH
Switzerland
Application number
CH1345475A
Inventor
Karl Nicklaus
Original Assignee
Esec Sales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales Sa filed Critical Esec Sales Sa
Priority to CH1345475A priority Critical patent/CH595884A5/xx
Priority to DE19762638090 priority patent/DE2638090A1/de
Priority to GB36796/76A priority patent/GB1552472A/en
Priority to FR7628233A priority patent/FR2328287A1/fr
Priority to IL50621A priority patent/IL50621A/xx
Priority to US05/732,103 priority patent/US4058246A/en
Publication of CH595884A5 publication Critical patent/CH595884A5/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
CH1345475A 1975-10-16 1975-10-16 CH595884A5 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1345475A CH595884A5 (de) 1975-10-16 1975-10-16
DE19762638090 DE2638090A1 (de) 1975-10-16 1976-08-24 Verfahren zur herstellung einer saugpipette zum aufnehmen eines halbleiterkristallplaettchens
GB36796/76A GB1552472A (en) 1975-10-16 1976-09-06 Suction pippettes
FR7628233A FR2328287A1 (fr) 1975-10-16 1976-09-20 Procede de realisation d'une pipette de prelevement d'une plaquette de cristal semi-conducteur
IL50621A IL50621A (en) 1975-10-16 1976-10-06 Method of manufacturing a suction pipette intendend to receive a semiconductor crystal chip
US05/732,103 US4058246A (en) 1975-10-16 1976-10-13 Suction pipette and method of manufacture for receiving of semiconductor crystal plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1345475A CH595884A5 (de) 1975-10-16 1975-10-16

Publications (1)

Publication Number Publication Date
CH595884A5 true CH595884A5 (de) 1978-02-28

Family

ID=4392596

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1345475A CH595884A5 (de) 1975-10-16 1975-10-16

Country Status (6)

Country Link
US (1) US4058246A (de)
CH (1) CH595884A5 (de)
DE (1) DE2638090A1 (de)
FR (1) FR2328287A1 (de)
GB (1) GB1552472A (de)
IL (1) IL50621A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4324356A (en) * 1979-03-29 1982-04-13 Ford Motor Company Process for joining silicon nitride based ceramic bodies
US5213248A (en) * 1992-01-10 1993-05-25 Norton Company Bonding tool and its fabrication

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429700A (en) * 1966-09-20 1969-02-25 Teleflex Inc Method of producing composite metal articles by uniting two identical shapes
US3479716A (en) * 1966-12-05 1969-11-25 Kulicke & Soffa Ind Inc Automatic dice dispenser for semiconductor bonding
US3551991A (en) * 1969-04-16 1971-01-05 Gen Electric Infiltrated cemented carbides
US3591915A (en) * 1969-05-12 1971-07-13 Brunswick Corp Method of making orifice structure
US3695502A (en) * 1970-09-14 1972-10-03 Floyd E Gaiser Bonding tool

Also Published As

Publication number Publication date
GB1552472A (en) 1979-09-12
US4058246A (en) 1977-11-15
IL50621A (en) 1979-03-12
DE2638090A1 (de) 1977-04-21
IL50621A0 (en) 1976-12-31
FR2328287B3 (de) 1979-07-06
FR2328287A1 (fr) 1977-05-13

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Legal Events

Date Code Title Description
PL Patent ceased