CH595200A5 - - Google Patents

Info

Publication number
CH595200A5
CH595200A5 CH648175A CH648175A CH595200A5 CH 595200 A5 CH595200 A5 CH 595200A5 CH 648175 A CH648175 A CH 648175A CH 648175 A CH648175 A CH 648175A CH 595200 A5 CH595200 A5 CH 595200A5
Authority
CH
Switzerland
Application number
CH648175A
Inventor
Walter Dubs
Georg Preiss
Original Assignee
Kistler Instrumente Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kistler Instrumente Ag filed Critical Kistler Instrumente Ag
Priority to CH648175A priority Critical patent/CH595200A5/xx
Priority to DE2618399A priority patent/DE2618399C3/de
Priority to GB17558/76A priority patent/GB1535864A/en
Priority to US05/687,106 priority patent/US4165402A/en
Publication of CH595200A5 publication Critical patent/CH595200A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/26—Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T407/00—Cutters, for shaping
    • Y10T407/27—Cutters, for shaping comprising tool of specific chemical composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/303752—Process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T82/00—Turning
    • Y10T82/10—Process of turning

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
CH648175A 1975-05-16 1975-05-16 CH595200A5 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH648175A CH595200A5 (zh) 1975-05-16 1975-05-16
DE2618399A DE2618399C3 (de) 1975-05-16 1976-04-27 Verfahren zum Herstellen von Halbleiterkristall-Fonnstücken, Bearbeitungswerkzeug hierzu sowie entsprechend hergestelltes Formstück
GB17558/76A GB1535864A (en) 1975-05-16 1976-04-29 Method for producing a transducer element and a transducer manufactured in accordance with the said method
US05/687,106 US4165402A (en) 1975-05-16 1976-05-17 Chip-removing machining method and apparatus for semiconducting crystals, specifically suited for the production of force and pressure measuring cells

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH648175A CH595200A5 (zh) 1975-05-16 1975-05-16

Publications (1)

Publication Number Publication Date
CH595200A5 true CH595200A5 (zh) 1978-02-15

Family

ID=4310332

Family Applications (1)

Application Number Title Priority Date Filing Date
CH648175A CH595200A5 (zh) 1975-05-16 1975-05-16

Country Status (4)

Country Link
US (1) US4165402A (zh)
CH (1) CH595200A5 (zh)
DE (1) DE2618399C3 (zh)
GB (1) GB1535864A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828876A (ja) * 1981-08-12 1983-02-19 Mitsubishi Electric Corp 半導体圧力センサ装置
GB2130435B (en) * 1982-10-27 1986-10-15 Tokyo Shibaura Electric Co Semiconductor strain sensor and method for manufacturing the same
JP3378575B2 (ja) * 2000-10-27 2003-02-17 住友電気工業株式会社 フライスカッタ
JP4511844B2 (ja) * 2004-02-05 2010-07-28 横河電機株式会社 圧力センサ及び圧力センサの製造方法
US20060186874A1 (en) * 2004-12-02 2006-08-24 The Board Of Trustees Of The University Of Illinois System and method for mechanical testing of freestanding microscale to nanoscale thin films
DE102007053859A1 (de) 2007-11-09 2009-05-14 Endress + Hauser Gmbh + Co. Kg Druck-Messeinrichtung
US8704538B2 (en) * 2010-07-01 2014-04-22 Mks Instruments, Inc. Capacitance sensors
DE102015204672A1 (de) * 2015-03-16 2016-09-22 Robert Bosch Gmbh Messvorrichtung zum Erfassen von Deformationen
JP6864682B2 (ja) 2015-12-07 2021-04-28 オー ユール アイラーセン，ニールス ロードセル
US11692895B2 (en) 2021-03-30 2023-07-04 Rosemount Aerospace Inc. Differential pressure sensor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB453292A (en) * 1935-06-17 1936-09-09 Frederick Charles Jearum Improvements in diamond tipped cutting tools
US2967344A (en) * 1958-02-14 1961-01-10 Rca Corp Semiconductor devices
US3025738A (en) * 1959-10-29 1962-03-20 Clevite Corp Cutting apparatus
US3270554A (en) * 1961-01-04 1966-09-06 Bell Telephone Labor Inc Diffused layer transducers
US3292128A (en) * 1961-12-26 1966-12-13 Gen Electric Semiconductor strain sensitive devices
US3365794A (en) * 1964-05-15 1968-01-30 Transitron Electronic Corp Semiconducting device
US3312879A (en) * 1964-07-29 1967-04-04 North American Aviation Inc Semiconductor structure including opposite conductivity segments
US3399442A (en) * 1966-09-08 1968-09-03 Kennametal Inc Cutting insert
US3555937A (en) * 1968-05-17 1971-01-19 Kennametal Inc Diamond drill

Also Published As

Publication number Publication date
US4165402A (en) 1979-08-21
DE2618399B2 (de) 1978-08-17
DE2618399A1 (de) 1976-11-25
DE2618399C3 (de) 1979-04-12
GB1535864A (en) 1978-12-13

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Legal Events

Date Code Title Description
PL Patent ceased