CH592960A5 - - Google Patents

Info

Publication number
CH592960A5
CH592960A5 CH19576A CH19576A CH592960A5 CH 592960 A5 CH592960 A5 CH 592960A5 CH 19576 A CH19576 A CH 19576A CH 19576 A CH19576 A CH 19576A CH 592960 A5 CH592960 A5 CH 592960A5
Authority
CH
Switzerland
Application number
CH19576A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH19576A priority Critical patent/CH592960A5/xx
Priority to IT4756976A priority patent/IT1053295B/en
Priority to DE19767602776U priority patent/DE7602776U1/en
Priority to DE19762603812 priority patent/DE2603812A1/en
Priority to CA268,221A priority patent/CA1039951A/en
Publication of CH592960A5 publication Critical patent/CH592960A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
CH19576A 1975-01-20 1976-01-09 CH592960A5 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH19576A CH592960A5 (en) 1976-01-09 1976-01-09
IT4756976A IT1053295B (en) 1976-01-09 1976-01-09 CONTINUOUS CYCLE PRODUCTION PLANT OF CONCRETE ELEMENTS OF PLASTER AND MANUFACTURING METHOD FOR ITS USE
DE19767602776U DE7602776U1 (en) 1976-01-09 1976-02-02 CYLINDRICAL HOUSING FOR A POWER SEMICONDUCTOR COMPONENT
DE19762603812 DE2603812A1 (en) 1976-01-09 1976-02-02 Cylindrical case for power semiconductor component - has ceramic outer wall and central metal plates
CA268,221A CA1039951A (en) 1975-01-20 1976-12-20 Wear protective liner assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH19576A CH592960A5 (en) 1976-01-09 1976-01-09

Publications (1)

Publication Number Publication Date
CH592960A5 true CH592960A5 (en) 1977-11-15

Family

ID=4181417

Family Applications (1)

Application Number Title Priority Date Filing Date
CH19576A CH592960A5 (en) 1975-01-20 1976-01-09

Country Status (3)

Country Link
CH (1) CH592960A5 (en)
DE (2) DE7602776U1 (en)
IT (1) IT1053295B (en)

Also Published As

Publication number Publication date
IT1053295B (en) 1981-08-31
DE2603812A1 (en) 1977-07-14
DE7602776U1 (en) 1977-11-17

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Legal Events

Date Code Title Description
PL Patent ceased