CH586995A5 - - Google Patents
Info
- Publication number
- CH586995A5 CH586995A5 CH1692973A CH1692973A CH586995A5 CH 586995 A5 CH586995 A5 CH 586995A5 CH 1692973 A CH1692973 A CH 1692973A CH 1692973 A CH1692973 A CH 1692973A CH 586995 A5 CH586995 A5 CH 586995A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating With Molten Metal (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7244870A FR2210880B1 (fr) | 1972-12-15 | 1972-12-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH586995A5 true CH586995A5 (fr) | 1977-04-15 |
Family
ID=9108808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1692973A CH586995A5 (fr) | 1972-12-15 | 1973-12-04 |
Country Status (9)
Country | Link |
---|---|
US (1) | US3959876A (fr) |
BE (1) | BE808412A (fr) |
CH (1) | CH586995A5 (fr) |
DE (1) | DE2361640A1 (fr) |
FR (1) | FR2210880B1 (fr) |
GB (1) | GB1442361A (fr) |
IT (1) | IT1006650B (fr) |
NL (1) | NL7317119A (fr) |
SE (1) | SE404748B (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217785A (en) * | 1979-01-08 | 1980-08-19 | Bofors America, Inc. | Erasable-foil-resistance compensation of strain gage transducers |
DE3211408A1 (de) * | 1982-03-27 | 1983-09-29 | Vdo Adolf Schindling Ag, 6000 Frankfurt | Substrat |
CN102469695B (zh) * | 2010-10-29 | 2016-09-21 | 海尔集团公司 | 印刷电路板及其挂锡线路和挂锡方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2985709A (en) * | 1957-08-06 | 1961-05-23 | Joseph P Mammola | Means and method of mounting electronic components |
US3033914A (en) * | 1960-04-20 | 1962-05-08 | Gen Electric | Printed circuit boards |
US3531579A (en) * | 1968-10-31 | 1970-09-29 | Astro Dynamics Inc | Printed circuit board with augmented conductive heat-dissipating areas |
US3833838A (en) * | 1972-11-13 | 1974-09-03 | A Christiansen | Electronic component mounting wafers for repeated connection in a variety of circuit designs |
-
1972
- 1972-12-15 FR FR7244870A patent/FR2210880B1/fr not_active Expired
-
1973
- 1973-11-22 IT IT31688/73A patent/IT1006650B/it active
- 1973-12-04 CH CH1692973A patent/CH586995A5/xx not_active IP Right Cessation
- 1973-12-10 BE BE1005572A patent/BE808412A/fr unknown
- 1973-12-10 SE SE7316636A patent/SE404748B/xx unknown
- 1973-12-11 DE DE2361640A patent/DE2361640A1/de not_active Withdrawn
- 1973-12-13 NL NL7317119A patent/NL7317119A/xx not_active Application Discontinuation
- 1973-12-14 GB GB5810373A patent/GB1442361A/en not_active Expired
-
1975
- 1975-07-14 US US05/595,360 patent/US3959876A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SE404748B (sv) | 1978-10-23 |
NL7317119A (fr) | 1974-06-18 |
US3959876A (en) | 1976-06-01 |
IT1006650B (it) | 1976-10-20 |
BE808412A (fr) | 1974-06-10 |
GB1442361A (en) | 1976-07-14 |
FR2210880A1 (fr) | 1974-07-12 |
DE2361640A1 (de) | 1974-06-20 |
FR2210880B1 (fr) | 1976-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |