CH586995A5 - - Google Patents

Info

Publication number
CH586995A5
CH586995A5 CH1692973A CH1692973A CH586995A5 CH 586995 A5 CH586995 A5 CH 586995A5 CH 1692973 A CH1692973 A CH 1692973A CH 1692973 A CH1692973 A CH 1692973A CH 586995 A5 CH586995 A5 CH 586995A5
Authority
CH
Switzerland
Application number
CH1692973A
Original Assignee
Cit Alcatel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cit Alcatel filed Critical Cit Alcatel
Publication of CH586995A5 publication Critical patent/CH586995A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Coating With Molten Metal (AREA)
CH1692973A 1972-12-15 1973-12-04 CH586995A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7244870A FR2210880B1 (de) 1972-12-15 1972-12-15

Publications (1)

Publication Number Publication Date
CH586995A5 true CH586995A5 (de) 1977-04-15

Family

ID=9108808

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1692973A CH586995A5 (de) 1972-12-15 1973-12-04

Country Status (9)

Country Link
US (1) US3959876A (de)
BE (1) BE808412A (de)
CH (1) CH586995A5 (de)
DE (1) DE2361640A1 (de)
FR (1) FR2210880B1 (de)
GB (1) GB1442361A (de)
IT (1) IT1006650B (de)
NL (1) NL7317119A (de)
SE (1) SE404748B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217785A (en) * 1979-01-08 1980-08-19 Bofors America, Inc. Erasable-foil-resistance compensation of strain gage transducers
DE3211408A1 (de) * 1982-03-27 1983-09-29 Vdo Adolf Schindling Ag, 6000 Frankfurt Substrat
CN102469695B (zh) * 2010-10-29 2016-09-21 海尔集团公司 印刷电路板及其挂锡线路和挂锡方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2985709A (en) * 1957-08-06 1961-05-23 Joseph P Mammola Means and method of mounting electronic components
US3033914A (en) * 1960-04-20 1962-05-08 Gen Electric Printed circuit boards
US3531579A (en) * 1968-10-31 1970-09-29 Astro Dynamics Inc Printed circuit board with augmented conductive heat-dissipating areas
US3833838A (en) * 1972-11-13 1974-09-03 A Christiansen Electronic component mounting wafers for repeated connection in a variety of circuit designs

Also Published As

Publication number Publication date
US3959876A (en) 1976-06-01
IT1006650B (it) 1976-10-20
DE2361640A1 (de) 1974-06-20
FR2210880A1 (de) 1974-07-12
SE404748B (sv) 1978-10-23
FR2210880B1 (de) 1976-10-29
GB1442361A (en) 1976-07-14
BE808412A (fr) 1974-06-10
NL7317119A (de) 1974-06-18

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Legal Events

Date Code Title Description
PL Patent ceased