CH570045A5 - - Google Patents

Info

Publication number
CH570045A5
CH570045A5 CH299574A CH299574A CH570045A5 CH 570045 A5 CH570045 A5 CH 570045A5 CH 299574 A CH299574 A CH 299574A CH 299574 A CH299574 A CH 299574A CH 570045 A5 CH570045 A5 CH 570045A5
Authority
CH
Switzerland
Application number
CH299574A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH299574A priority Critical patent/CH570045A5/xx
Priority to DE2414163A priority patent/DE2414163A1/de
Priority to DE19757540835U priority patent/DE7540835U/de
Priority to FR7506520A priority patent/FR2263603A1/fr
Publication of CH570045A5 publication Critical patent/CH570045A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CH299574A 1974-03-04 1974-03-04 CH570045A5 (cs)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH299574A CH570045A5 (cs) 1974-03-04 1974-03-04
DE2414163A DE2414163A1 (de) 1974-03-04 1974-03-23 Verfahren zur herstellung von halbleiterbauelementen
DE19757540835U DE7540835U (de) 1974-03-04 1974-03-23 Halbleiterbauelement
FR7506520A FR2263603A1 (en) 1974-03-04 1975-03-03 Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH299574A CH570045A5 (cs) 1974-03-04 1974-03-04

Publications (1)

Publication Number Publication Date
CH570045A5 true CH570045A5 (cs) 1975-11-28

Family

ID=4246277

Family Applications (1)

Application Number Title Priority Date Filing Date
CH299574A CH570045A5 (cs) 1974-03-04 1974-03-04

Country Status (3)

Country Link
CH (1) CH570045A5 (cs)
DE (2) DE2414163A1 (cs)
FR (1) FR2263603A1 (cs)

Also Published As

Publication number Publication date
DE7540835U (de) 1976-04-22
FR2263603B1 (cs) 1980-11-07
FR2263603A1 (en) 1975-10-03
DE2414163A1 (de) 1975-09-11

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Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased