CH561782A5CH971871ACH971871ACH561782A5CH 561782 A5CH561782 A5CH 561782A5CH 971871 ACH971871 ACH 971871ACH 971871 ACH971871 ACH 971871ACH 561782 A5CH561782 A5CH 561782A5
Authority
CH
Switzerland
Application number
CH971871A
Original Assignee
Boehler & Co Ag Geb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19702034261external-prioritypatent/DE2034261C3/de
Application filed by Boehler & Co Ag GebfiledCriticalBoehler & Co Ag Geb
Publication of CH561782A5publicationCriticalpatent/CH561782A5/xx
C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
C23C18/54—Contact plating, i.e. electroless electrochemical plating