CH532313A - Einrichtung zur Kühlung einer druckkontaktierten Thyristor-Scheibenzelle - Google Patents

Einrichtung zur Kühlung einer druckkontaktierten Thyristor-Scheibenzelle

Info

Publication number
CH532313A
CH532313A CH201972A CH201972A CH532313A CH 532313 A CH532313 A CH 532313A CH 201972 A CH201972 A CH 201972A CH 201972 A CH201972 A CH 201972A CH 532313 A CH532313 A CH 532313A
Authority
CH
Switzerland
Prior art keywords
contacted
cooling
pressure
disk cell
thyristor
Prior art date
Application number
CH201972A
Other languages
English (en)
Inventor
Gregor Dipl Phys Gammel
Heidtmann Uwe
Elmar Dipl Ing Mueller
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712107008 external-priority patent/DE2107008A1/de
Priority claimed from DE19712107009 external-priority patent/DE2107009C3/de
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH532313A publication Critical patent/CH532313A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/20—Fastening; Joining with threaded elements
    • F28F2275/205—Fastening; Joining with threaded elements with of tie-rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH201972A 1971-02-13 1972-02-14 Einrichtung zur Kühlung einer druckkontaktierten Thyristor-Scheibenzelle CH532313A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19712107008 DE2107008A1 (de) 1971-02-13 1971-02-13 Einrichtung zur Kühlung einer druckkontaktierten Thyristor-Scheibenzelle
DE19712107009 DE2107009C3 (de) 1971-02-13 Druckkontaktierte Thyristor-Scheibenzelle

Publications (1)

Publication Number Publication Date
CH532313A true CH532313A (de) 1972-12-31

Family

ID=25760660

Family Applications (1)

Application Number Title Priority Date Filing Date
CH201972A CH532313A (de) 1971-02-13 1972-02-14 Einrichtung zur Kühlung einer druckkontaktierten Thyristor-Scheibenzelle

Country Status (5)

Country Link
US (1) US3834454A (de)
CH (1) CH532313A (de)
FR (1) FR2125380B1 (de)
GB (1) GB1346157A (de)
SE (1) SE382282B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS159563B1 (de) * 1972-12-28 1975-01-31
US3989095A (en) * 1972-12-28 1976-11-02 Ckd Praha, Oborovy Podnik Semi conductor cooling system
US3972063A (en) * 1973-10-19 1976-07-27 Mitsubishi Denki Kabushiki Kaisha Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope
JPS5512740B2 (de) * 1974-03-15 1980-04-03
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
JP2004125381A (ja) * 2002-08-02 2004-04-22 Mitsubishi Alum Co Ltd ヒートパイプユニット及びヒートパイプ冷却器
JP5489911B2 (ja) * 2010-08-18 2014-05-14 三菱電機株式会社 半導体パワーモジュール
EP2562808B1 (de) * 2011-08-25 2016-08-03 ABB Technology Oy Gekühlte elektrische Baugruppe
CN116263309A (zh) * 2021-12-15 2023-06-16 亚浩电子五金塑胶（惠州）有限公司 立体传热装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL96632C (de) * 1955-07-06
FR1406481A (fr) * 1964-01-16 1965-07-23 Materiel Electrique S W Le Dispositif de refroidissement d'au moins un boîtier contenant un élément semiconducteur
US3390717A (en) * 1966-08-02 1968-07-02 Trw Inc Heat transfer device
US3447118A (en) * 1966-08-16 1969-05-27 Westinghouse Electric Corp Stacking module for flat packaged electrical devices
US3405299A (en) * 1967-01-27 1968-10-08 Rca Corp Vaporizable medium type heat exchanger for electron tubes
US3602429A (en) * 1968-11-04 1971-08-31 Isotopes Inc Valved heat pipe
CH498488A (de) * 1969-04-30 1970-10-31 Bbc Brown Boveri & Cie Kühleinrichtung insbesondere für Halbleiterelemente und Elektronenröhren
SE354943B (de) * 1970-02-24 1973-03-26 Asea Ab

Also Published As

Publication number Publication date
SE382282B (sv) 1976-01-19
FR2125380B1 (de) 1977-09-02
US3834454A (en) 1974-09-10
GB1346157A (en) 1974-02-06
FR2125380A1 (de) 1972-09-29

Similar Documents

Publication Publication Date Title
SE405449B (sv) Finfordelningsanordning for vetskor
IT951373B (it) Apparato di riproduzione multifonico
SE396995B (sv) Kondensationsanordning for angturbinkraftverk
IT962687B (it) Dispositivo levafoglio
SE396650B (sv) Kondensationsanordning for angturbinkraftverk
AT320693B (de) Kühlturm
IT967996B (it) Dispositivo di ventilazione per unita a dischi magnetici
IT947244B (it) Dispositivo semiconduttore
CH532313A (de) Einrichtung zur Kühlung einer druckkontaktierten Thyristor-Scheibenzelle
AT337734B (de) Kuhlturm
IT975353B (it) Dispositivo semiconduttore
CH542516A (de) Thyristor
RO89568A (ro) Dispozitiv pentru presarea placilor aglomerate
IT959277B (it) Dispositivo semiconduttore
AT314656B (de) Thyristor
DK132912C (da) Plade til varmeudvekslere
AT316235B (de) Klemmeinrichtung
IT956991B (it) Dispositivo di raffreddamento per convertitore
IT963789B (it) Apparato di riproduzione multifonico
AU4801772A (en) Thin layer semiconductor device
AT314848B (de) Klemmvorrichtung
SE386507B (sv) Kylapparat
IT952873B (it) Dispositivo semiconduttore
CH539339A (de) Halbleiteranordnung mit einer Kühlvorrichtung
CH530308A (de) Etikettiereinrichtung

Legal Events

Date Code Title Description
PL Patent ceased