CH524424A - Method for controlling the movement of a workpiece relative to a beam of a material processing machine operating by means of controllable radiant energy - Google Patents

Method for controlling the movement of a workpiece relative to a beam of a material processing machine operating by means of controllable radiant energy

Info

Publication number
CH524424A
CH524424A CH431171A CH431171A CH524424A CH 524424 A CH524424 A CH 524424A CH 431171 A CH431171 A CH 431171A CH 431171 A CH431171 A CH 431171A CH 524424 A CH524424 A CH 524424A
Authority
CH
Switzerland
Prior art keywords
controlling
movement
processing machine
radiant energy
material processing
Prior art date
Application number
CH431171A
Other languages
German (de)
Inventor
Walter Alfred Von
Original Assignee
Steigerwald Strahltech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2015078A external-priority patent/DE2015078C3/en
Application filed by Steigerwald Strahltech filed Critical Steigerwald Strahltech
Publication of CH524424A publication Critical patent/CH524424A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/0013—Positioning or observing workpieces, e.g. with respect to the impact; Aligning, aiming or focusing electronbeams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/002—Devices involving relative movement between electronbeam and workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/188—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by special applications and not provided for in the relevant subclasses, (e.g. making dies, filament winding)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/42—Servomotor, servo controller kind till VSS
    • G05B2219/42251—Control position of beam in coordination with xy slide
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/43—Speed, acceleration, deceleration control ADC
    • G05B2219/43147—Control power of tool as function of speed, velocity of movement

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
CH431171A 1970-03-28 1971-03-24 Method for controlling the movement of a workpiece relative to a beam of a material processing machine operating by means of controllable radiant energy CH524424A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2015078A DE2015078C3 (en) 1970-03-28 1970-03-28 Method for material processing by means of a controllable or deflectable energy beam

Publications (1)

Publication Number Publication Date
CH524424A true CH524424A (en) 1972-06-30

Family

ID=5766612

Family Applications (1)

Application Number Title Priority Date Filing Date
CH431171A CH524424A (en) 1970-03-28 1971-03-24 Method for controlling the movement of a workpiece relative to a beam of a material processing machine operating by means of controllable radiant energy

Country Status (4)

Country Link
JP (1) JPS558275B1 (en)
CH (1) CH524424A (en)
FR (1) FR2083638B1 (en)
GB (1) GB1325824A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2476524A1 (en) * 1980-02-27 1981-08-28 Sumitomo Metal Ind PROCESS FOR WORKING THE SURFACE OF A COLD ROLLING ROLLER
DE3640987C1 (en) * 1986-12-01 1993-04-29 Agie Ag Ind Elektronik Numerical control system for highly dynamic processes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1365865A (en) * 1962-08-15 1964-07-03 United Aircraft Corp Control device for electron beam machines
GB1179161A (en) * 1967-01-20 1970-01-28 Vickers Ltd Electron-Beam Welding.

Also Published As

Publication number Publication date
FR2083638B1 (en) 1977-06-03
JPS558275B1 (en) 1980-03-03
FR2083638A1 (en) 1971-12-17
GB1325824A (en) 1973-08-08

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Legal Events

Date Code Title Description
PUE Assignment

Owner name: MESSER GRIESHEIM GMBH

PL Patent ceased