CH523971A - Process to improve the solderability of printed circuit boards - Google Patents

Process to improve the solderability of printed circuit boards

Info

Publication number
CH523971A
CH523971A CH1512868A CH1512868A CH523971A CH 523971 A CH523971 A CH 523971A CH 1512868 A CH1512868 A CH 1512868A CH 1512868 A CH1512868 A CH 1512868A CH 523971 A CH523971 A CH 523971A
Authority
CH
Switzerland
Prior art keywords
solderability
improve
printed circuit
circuit boards
boards
Prior art date
Application number
CH1512868A
Other languages
German (de)
Inventor
Josef Dr Strohmayer
Merkenschlager Hans-Hermann
Stumbaum August
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH523971A publication Critical patent/CH523971A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH1512868A 1967-10-11 1968-10-10 Process to improve the solderability of printed circuit boards CH523971A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1621516 1967-10-11
DES0112343 1967-10-11

Publications (1)

Publication Number Publication Date
CH523971A true CH523971A (en) 1972-06-15

Family

ID=25753799

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1512868A CH523971A (en) 1967-10-11 1968-10-10 Process to improve the solderability of printed circuit boards

Country Status (4)

Country Link
CH (1) CH523971A (en)
DE (1) DE1621516B1 (en)
FR (1) FR1586321A (en)
NL (1) NL6814611A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2923524B2 (en) * 1995-08-01 1999-07-26 メック株式会社 Copper and copper alloy microetching agent and microetching method
US6746547B2 (en) * 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper

Also Published As

Publication number Publication date
FR1586321A (en) 1970-02-13
DE1621516B1 (en) 1971-10-07
NL6814611A (en) 1969-04-15

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Legal Events

Date Code Title Description
PL Patent ceased