CH502748A - Process for making a printed circuit board - Google Patents
Process for making a printed circuit boardInfo
- Publication number
- CH502748A CH502748A CH418470A CH418470A CH502748A CH 502748 A CH502748 A CH 502748A CH 418470 A CH418470 A CH 418470A CH 418470 A CH418470 A CH 418470A CH 502748 A CH502748 A CH 502748A
- Authority
- CH
- Switzerland
- Prior art keywords
- making
- circuit board
- printed circuit
- printed
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US00811142A US3799802A (en) | 1966-06-28 | 1969-03-27 | Plated through hole printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
CH502748A true CH502748A (en) | 1971-01-31 |
Family
ID=25205692
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH418470A CH502748A (en) | 1969-03-27 | 1970-03-19 | Process for making a printed circuit board |
CH418370A CH504147A (en) | 1969-03-27 | 1970-03-19 | Process for making a printed circuit board |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH418370A CH504147A (en) | 1969-03-27 | 1970-03-19 | Process for making a printed circuit board |
Country Status (7)
Country | Link |
---|---|
AT (2) | AT312730B (en) |
CA (1) | CA939831A (en) |
CH (2) | CH502748A (en) |
DE (2) | DE2014138C3 (en) |
FR (1) | FR2040016A5 (en) |
NL (1) | NL173700C (en) |
SE (1) | SE369027B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2809013C2 (en) * | 1978-02-28 | 1985-08-01 | Ruwel-Werke Spezialfabrik für Hochfrequenzbauteile GmbH, 4170 Geldern | Method of manufacturing a printed circuit board loaded with components |
DE3427015A1 (en) * | 1984-07-21 | 1986-01-30 | Nippon Mektron, Ltd., Tokio/Tokyo | METHOD FOR PRODUCING VIA CONTACTS IN PRINTED CIRCUITS |
CA1267350A (en) * | 1985-08-22 | 1990-04-03 | Union Carbide Corporation | Treatment of drilled copper clad thermoplastic laminates using concentrated sulfuric acid |
IL141826A0 (en) * | 1998-09-10 | 2002-03-10 | Viasystems Group Inc | Non-circular micro-via |
US9922951B1 (en) * | 2016-11-12 | 2018-03-20 | Sierra Circuits, Inc. | Integrated circuit wafer integration with catalytic laminate or adhesive |
-
1969
- 1969-09-30 CA CA063,648A patent/CA939831A/en not_active Expired
-
1970
- 1970-03-18 DE DE19702014138 patent/DE2014138C3/en not_active Expired
- 1970-03-18 DE DE19702014104 patent/DE2014104C3/en not_active Expired
- 1970-03-19 CH CH418470A patent/CH502748A/en not_active IP Right Cessation
- 1970-03-19 CH CH418370A patent/CH504147A/en not_active IP Right Cessation
- 1970-03-24 AT AT272470A patent/AT312730B/en not_active IP Right Cessation
- 1970-03-24 AT AT272570A patent/AT311460B/en not_active IP Right Cessation
- 1970-03-24 SE SE406770A patent/SE369027B/xx unknown
- 1970-03-26 NL NL7004485A patent/NL173700C/en not_active IP Right Cessation
- 1970-03-26 FR FR7010884A patent/FR2040016A5/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
AT311460B (en) | 1973-11-26 |
DE2014104C3 (en) | 1975-10-09 |
NL7004485A (en) | 1970-09-29 |
DE2014138B2 (en) | 1972-10-05 |
CA939831A (en) | 1974-01-08 |
FR2040016A5 (en) | 1971-01-15 |
DE2014104A1 (en) | 1970-10-29 |
DE2014138A1 (en) | 1970-11-05 |
NL173700B (en) | 1983-09-16 |
SE369027B (en) | 1974-07-29 |
DE2014138C3 (en) | 1979-06-28 |
NL173700C (en) | 1984-02-16 |
DE2014104B2 (en) | 1972-07-13 |
CH504147A (en) | 1971-02-28 |
AT312730B (en) | 1974-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |