CH498204A - Verfahren zur stromlosen Herstellung eines Kupferüberzuges auf Eisen und Eisenlegierungen - Google Patents
Verfahren zur stromlosen Herstellung eines Kupferüberzuges auf Eisen und EisenlegierungenInfo
- Publication number
- CH498204A CH498204A CH1149768A CH1149768A CH498204A CH 498204 A CH498204 A CH 498204A CH 1149768 A CH1149768 A CH 1149768A CH 1149768 A CH1149768 A CH 1149768A CH 498204 A CH498204 A CH 498204A
- Authority
- CH
- Switzerland
- Prior art keywords
- iron
- copper coating
- alloys
- electroless
- production
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEM0075054 | 1967-08-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH498204A true CH498204A (de) | 1970-10-31 |
Family
ID=7316106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1149768A CH498204A (de) | 1967-08-05 | 1968-07-31 | Verfahren zur stromlosen Herstellung eines Kupferüberzuges auf Eisen und Eisenlegierungen |
Country Status (10)
Country | Link |
---|---|
AT (1) | AT277700B (xx) |
BE (1) | BE716092A (xx) |
CH (1) | CH498204A (xx) |
DE (1) | DE1621291B2 (xx) |
ES (1) | ES356925A1 (xx) |
FR (1) | FR1573213A (xx) |
GB (1) | GB1161550A (xx) |
IL (1) | IL30389A (xx) |
NL (1) | NL6811057A (xx) |
SE (1) | SE325185B (xx) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE793769A (fr) * | 1972-01-17 | 1973-05-02 | Parker Ste Continentale | Solution et procede pour former un depot de cuivre et d'etain sans utilisation de courant electrique |
EP0132594B1 (en) * | 1983-07-25 | 1988-09-07 | Hitachi, Ltd. | Electroless copper plating solution |
DE4440299A1 (de) | 1994-11-11 | 1996-05-15 | Metallgesellschaft Ag | Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen |
US20180111354A1 (en) * | 2015-04-21 | 2018-04-26 | Mitsui Chemicals, Inc. | Manufacturing method of metal/resin composite structure and manufacturing method of surface-roughened steel member |
-
1967
- 1967-08-05 DE DE19671621291 patent/DE1621291B2/de active Pending
-
1968
- 1968-04-22 FR FR1573213D patent/FR1573213A/fr not_active Expired
- 1968-06-04 BE BE716092D patent/BE716092A/xx unknown
- 1968-07-08 AT AT653168A patent/AT277700B/de not_active IP Right Cessation
- 1968-07-18 IL IL30389A patent/IL30389A/en unknown
- 1968-07-24 GB GB35376/68A patent/GB1161550A/en not_active Expired
- 1968-07-31 CH CH1149768A patent/CH498204A/de not_active IP Right Cessation
- 1968-08-02 SE SE10506/68A patent/SE325185B/xx unknown
- 1968-08-02 NL NL6811057A patent/NL6811057A/xx unknown
- 1968-08-05 ES ES356925A patent/ES356925A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1161550A (en) | 1969-08-13 |
IL30389A (en) | 1972-05-30 |
DE1621291A1 (xx) | 1971-02-11 |
BE716092A (xx) | 1968-11-04 |
FR1573213A (xx) | 1969-07-04 |
DE1621291B2 (de) | 1971-02-11 |
AT277700B (de) | 1970-01-12 |
ES356925A1 (es) | 1970-02-16 |
IL30389A0 (en) | 1968-09-26 |
SE325185B (xx) | 1970-06-22 |
NL6811057A (xx) | 1969-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |