CH482301A - Semiconductor component with controllable recombination of electrons and defect electrons present in an intrinsic area - Google Patents

Semiconductor component with controllable recombination of electrons and defect electrons present in an intrinsic area

Info

Publication number
CH482301A
CH482301A CH899368A CH899368A CH482301A CH 482301 A CH482301 A CH 482301A CH 899368 A CH899368 A CH 899368A CH 899368 A CH899368 A CH 899368A CH 482301 A CH482301 A CH 482301A
Authority
CH
Switzerland
Prior art keywords
electrons
semiconductor component
defect
intrinsic area
present
Prior art date
Application number
CH899368A
Other languages
German (de)
Inventor
Jaentsch Ottomar Dr Dipl-Phys
Erich Dipl Ing Nitsche
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Priority to CH899368A priority Critical patent/CH482301A/en
Priority to DE19691916873 priority patent/DE1916873A1/en
Publication of CH482301A publication Critical patent/CH482301A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Hall/Mr Elements (AREA)
CH899368A 1968-06-17 1968-06-17 Semiconductor component with controllable recombination of electrons and defect electrons present in an intrinsic area CH482301A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH899368A CH482301A (en) 1968-06-17 1968-06-17 Semiconductor component with controllable recombination of electrons and defect electrons present in an intrinsic area
DE19691916873 DE1916873A1 (en) 1968-06-17 1969-04-02 Semiconductor component with control of the recombination of electrons and defect electrons present in an intrinsic area

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH899368A CH482301A (en) 1968-06-17 1968-06-17 Semiconductor component with controllable recombination of electrons and defect electrons present in an intrinsic area

Publications (1)

Publication Number Publication Date
CH482301A true CH482301A (en) 1969-11-30

Family

ID=4347142

Family Applications (1)

Application Number Title Priority Date Filing Date
CH899368A CH482301A (en) 1968-06-17 1968-06-17 Semiconductor component with controllable recombination of electrons and defect electrons present in an intrinsic area

Country Status (2)

Country Link
CH (1) CH482301A (en)
DE (1) DE1916873A1 (en)

Also Published As

Publication number Publication date
DE1916873A1 (en) 1969-12-18

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Legal Events

Date Code Title Description
PL Patent ceased