CH438700A - Copper-clad laminate board - Google Patents

Copper-clad laminate board

Info

Publication number
CH438700A
CH438700A CH872763A CH872763A CH438700A CH 438700 A CH438700 A CH 438700A CH 872763 A CH872763 A CH 872763A CH 872763 A CH872763 A CH 872763A CH 438700 A CH438700 A CH 438700A
Authority
CH
Switzerland
Prior art keywords
copper
clad laminate
laminate board
board
clad
Prior art date
Application number
CH872763A
Other languages
German (de)
Inventor
Werner Dr Hagenbuch
Original Assignee
Sandoz Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sandoz Ag filed Critical Sandoz Ag
Priority to CH872763A priority Critical patent/CH438700A/en
Priority to BE649938A priority patent/BE649938A/xx
Priority to NL6407658A priority patent/NL6407658A/xx
Priority to GB28091/64A priority patent/GB999035A/en
Priority to FR981508A priority patent/FR1403288A/en
Publication of CH438700A publication Critical patent/CH438700A/en

Links

Classifications

    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00—Coated paper; Coating material
    • D21H19/02—Metal coatings
    • D21H19/04—Metal coatings applied as foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
CH872763A 1963-07-12 1963-07-12 Copper-clad laminate board CH438700A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH872763A CH438700A (en) 1963-07-12 1963-07-12 Copper-clad laminate board
BE649938A BE649938A (en) 1963-07-12 1964-06-30
NL6407658A NL6407658A (en) 1963-07-12 1964-07-06
GB28091/64A GB999035A (en) 1963-07-12 1964-07-08 Copper faced laminated fibrous sheets
FR981508A FR1403288A (en) 1963-07-12 1964-07-10 Copper Coated Pressed Laminate Plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH872763A CH438700A (en) 1963-07-12 1963-07-12 Copper-clad laminate board

Publications (1)

Publication Number Publication Date
CH438700A true CH438700A (en) 1967-06-30

Family

ID=4344025

Family Applications (1)

Application Number Title Priority Date Filing Date
CH872763A CH438700A (en) 1963-07-12 1963-07-12 Copper-clad laminate board

Country Status (5)

Country Link
BE (1) BE649938A (en)
CH (1) CH438700A (en)
FR (1) FR1403288A (en)
GB (1) GB999035A (en)
NL (1) NL6407658A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2439152A1 (en) * 1973-08-15 1975-02-27 Westinghouse Electric Corp HIGH PRESSURE LAMINATE
EP0158343A2 (en) * 1984-04-11 1985-10-16 Isola Werke Ag Process for preparing pressed multilayer composites, and product so obtained

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2439152A1 (en) * 1973-08-15 1975-02-27 Westinghouse Electric Corp HIGH PRESSURE LAMINATE
EP0158343A2 (en) * 1984-04-11 1985-10-16 Isola Werke Ag Process for preparing pressed multilayer composites, and product so obtained
EP0158343B1 (en) * 1984-04-11 1991-07-10 Isola Werke Ag Process for preparing pressed multilayer composites, and product so obtained

Also Published As

Publication number Publication date
GB999035A (en) 1965-07-21
BE649938A (en) 1964-10-16
NL6407658A (en) 1965-01-13
FR1403288A (en) 1965-06-18

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