CH425239A - Legierungsform und Verfahren zu ihrem Betrieb - Google Patents

Legierungsform und Verfahren zu ihrem Betrieb

Info

Publication number
CH425239A
CH425239A CH1294062A CH1294062A CH425239A CH 425239 A CH425239 A CH 425239A CH 1294062 A CH1294062 A CH 1294062A CH 1294062 A CH1294062 A CH 1294062A CH 425239 A CH425239 A CH 425239A
Authority
CH
Switzerland
Prior art keywords
alloy form
alloy
Prior art date
Application number
CH1294062A
Other languages
English (en)
Inventor
F Gates Harlan
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH425239A publication Critical patent/CH425239A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
CH1294062A 1961-11-15 1962-11-06 Legierungsform und Verfahren zu ihrem Betrieb CH425239A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US152390A US3155064A (en) 1961-11-15 1961-11-15 Fusion mold fixture assembly

Publications (1)

Publication Number Publication Date
CH425239A true CH425239A (de) 1966-11-30

Family

ID=22542718

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1294062A CH425239A (de) 1961-11-15 1962-11-06 Legierungsform und Verfahren zu ihrem Betrieb

Country Status (2)

Country Link
US (1) US3155064A (de)
CH (1) CH425239A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3682467A (en) * 1970-07-23 1972-08-08 Casper W Heinrich Miter clamp
US4540423A (en) * 1981-09-03 1985-09-10 Burroughs Corporation Methods of fashioning glass bonded device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE738027C (de) * 1939-07-26 1943-07-31 Philips Patentverwaltung Verfahren zum Zusammenfuegen eines elektrodynamischen Magnetsystems fuer akustische Geraete
US2310841A (en) * 1940-08-17 1943-02-09 Curtis Pump Co Device for fabricating pump impellers
US2527150A (en) * 1946-12-24 1950-10-24 Western Electric Co Aligning and gauging fixture
US2614516A (en) * 1948-10-20 1952-10-21 Western Electric Co Article holding apparatus
US2960419A (en) * 1956-02-08 1960-11-15 Siemens Ag Method and device for producing electric semiconductor devices
US2945285A (en) * 1957-06-03 1960-07-19 Sperry Rand Corp Bonding of semiconductor contact electrodes
NL235479A (de) * 1958-02-04 1900-01-01

Also Published As

Publication number Publication date
US3155064A (en) 1964-11-03

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