CH414777A - Verfahren zur Herstellung zusammengesetzter Körper, insbesondere von Teilen einer Umhüllung für Transistoren für hohe Leistungen - Google Patents

Verfahren zur Herstellung zusammengesetzter Körper, insbesondere von Teilen einer Umhüllung für Transistoren für hohe Leistungen

Info

Publication number
CH414777A
CH414777A CH1095462A CH1095462A CH414777A CH 414777 A CH414777 A CH 414777A CH 1095462 A CH1095462 A CH 1095462A CH 1095462 A CH1095462 A CH 1095462A CH 414777 A CH414777 A CH 414777A
Authority
CH
Switzerland
Prior art keywords
casing
production
high power
power transistors
particular parts
Prior art date
Application number
CH1095462A
Other languages
German (de)
English (en)
Inventor
Emanuel Dijkmeijer Henricus
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH414777A publication Critical patent/CH414777A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
    • B23K11/18—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded of non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033—Ni as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
CH1095462A 1961-09-19 1962-09-17 Verfahren zur Herstellung zusammengesetzter Körper, insbesondere von Teilen einer Umhüllung für Transistoren für hohe Leistungen CH414777A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL269393 1961-09-19

Publications (1)

Publication Number Publication Date
CH414777A true CH414777A (de) 1966-06-15

Family

ID=19753290

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1095462A CH414777A (de) 1961-09-19 1962-09-17 Verfahren zur Herstellung zusammengesetzter Körper, insbesondere von Teilen einer Umhüllung für Transistoren für hohe Leistungen

Country Status (7)

Country Link
US (1) US3140382A (US06312121-20011106-C00033.png)
BE (1) BE622539A (US06312121-20011106-C00033.png)
CH (1) CH414777A (US06312121-20011106-C00033.png)
DE (1) DE1220234B (US06312121-20011106-C00033.png)
DK (1) DK106343C (US06312121-20011106-C00033.png)
GB (1) GB954877A (US06312121-20011106-C00033.png)
NL (2) NL269393A (US06312121-20011106-C00033.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469062A (en) * 1968-01-03 1969-09-23 United Aircraft Corp Method of joining metals
DE2718609C2 (de) * 1977-04-27 1979-05-23 Danfoss A/S, Nordborg (Daenemark) Verfahren zur Herstellung einer eine Membran aufweisenden Vorrichtung und Vorrichtung zur Durchfuhrung dieses Verfahrens

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2151758A (en) * 1936-11-28 1939-03-28 Westinghouse Electric & Mfg Co Method of resistance welding
US2223312A (en) * 1938-03-22 1940-11-26 Thomson Gibb Electric Welding Brazed joint and method of producing the same
US2200742A (en) * 1938-11-21 1940-05-14 Hardy Metallurg Company Treatment of phosphorus
US2795040A (en) * 1953-08-20 1957-06-11 Westinghouse Electric Corp Joining metals having high temperature melting points
US2819381A (en) * 1955-04-14 1958-01-07 Cleveland Pneumatic Tool Co Method of welding
FR1242813A (fr) * 1956-07-25 1960-10-07 Electro Hydraulics Ltd Brasage à l'alliage nickel-phosphore

Also Published As

Publication number Publication date
NL269393A (US06312121-20011106-C00033.png)
BE622539A (US06312121-20011106-C00033.png)
GB954877A (en) 1964-04-08
US3140382A (en) 1964-07-07
DE1220234B (de) 1966-06-30
DK106343C (da) 1967-01-23
NL135879C (US06312121-20011106-C00033.png)

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