CH405868A - Process for plating gold by chemical means and plating composition for the implementation of this process - Google Patents
Process for plating gold by chemical means and plating composition for the implementation of this processInfo
- Publication number
- CH405868A CH405868A CH940562A CH940562A CH405868A CH 405868 A CH405868 A CH 405868A CH 940562 A CH940562 A CH 940562A CH 940562 A CH940562 A CH 940562A CH 405868 A CH405868 A CH 405868A
- Authority
- CH
- Switzerland
- Prior art keywords
- plating
- implementation
- chemical means
- gold
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US134106A US3396042A (en) | 1961-08-28 | 1961-08-28 | Chemical gold plating composition |
Publications (1)
Publication Number | Publication Date |
---|---|
CH405868A true CH405868A (en) | 1966-01-15 |
Family
ID=22461795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH940562A CH405868A (en) | 1961-08-28 | 1962-08-07 | Process for plating gold by chemical means and plating composition for the implementation of this process |
Country Status (4)
Country | Link |
---|---|
US (1) | US3396042A (en) |
CH (1) | CH405868A (en) |
DE (1) | DE1446259B2 (en) |
GB (1) | GB956922A (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3468676A (en) * | 1963-09-09 | 1969-09-23 | Photocircuits Corp | Electroless gold plating |
US3607352A (en) * | 1968-11-29 | 1971-09-21 | Enthone | Electroless metal plating |
US3993808A (en) * | 1971-08-13 | 1976-11-23 | Hitachi, Ltd. | Method for electroless plating gold directly on tungsten or molybdenum |
US3862850A (en) * | 1973-06-08 | 1975-01-28 | Ceramic Systems | Electroless gold plating on refractory metals |
US4091128A (en) * | 1976-10-08 | 1978-05-23 | Ppg Industries, Inc. | Electroless gold plating bath |
US4340451A (en) * | 1979-12-17 | 1982-07-20 | Bell Telephone Laboratories, Incorporated | Method of replenishing gold/in plating baths |
US4550036A (en) * | 1984-10-18 | 1985-10-29 | Hughes Aircraft Company | Electroless silver plating process and system |
US5178918A (en) * | 1986-07-14 | 1993-01-12 | Robert Duva | Electroless plating process |
US4863766A (en) * | 1986-09-02 | 1989-09-05 | General Electric Company | Electroless gold plating composition and method for plating |
US4832743A (en) * | 1986-12-19 | 1989-05-23 | Lamerie, N.V. | Gold plating solutions, creams and baths |
US6086946A (en) * | 1996-08-08 | 2000-07-11 | International Business Machines Corporation | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2719821A (en) * | 1951-07-19 | 1955-10-04 | Charles R Campana | Gold alloy plating bath |
-
1961
- 1961-08-28 US US134106A patent/US3396042A/en not_active Expired - Lifetime
-
1962
- 1962-08-01 GB GB29612/62A patent/GB956922A/en not_active Expired
- 1962-08-07 CH CH940562A patent/CH405868A/en unknown
- 1962-08-28 DE DE19621446259 patent/DE1446259B2/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1446259A1 (en) | 1968-11-14 |
DE1446259B2 (en) | 1970-12-17 |
GB956922A (en) | 1964-04-29 |
US3396042A (en) | 1968-08-06 |
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