CH392705A - Arrangement for cooling power semiconductor elements with a cooling plate - Google Patents

Arrangement for cooling power semiconductor elements with a cooling plate

Info

Publication number
CH392705A
CH392705A CH375662A CH375662A CH392705A CH 392705 A CH392705 A CH 392705A CH 375662 A CH375662 A CH 375662A CH 375662 A CH375662 A CH 375662A CH 392705 A CH392705 A CH 392705A
Authority
CH
Switzerland
Prior art keywords
cooling
arrangement
power semiconductor
semiconductor elements
cooling plate
Prior art date
Application number
CH375662A
Other languages
German (de)
Inventor
Tschannen Gottfried
Original Assignee
Siemens Ag Albis
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag Albis filed Critical Siemens Ag Albis
Priority to CH375662A priority Critical patent/CH392705A/en
Priority to DE1962A0041648 priority patent/DE1264614B/en
Publication of CH392705A publication Critical patent/CH392705A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH375662A 1962-03-29 1962-03-29 Arrangement for cooling power semiconductor elements with a cooling plate CH392705A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH375662A CH392705A (en) 1962-03-29 1962-03-29 Arrangement for cooling power semiconductor elements with a cooling plate
DE1962A0041648 DE1264614B (en) 1962-03-29 1962-11-16 Arrangement for cooling power semiconductor components with a cooling plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH375662A CH392705A (en) 1962-03-29 1962-03-29 Arrangement for cooling power semiconductor elements with a cooling plate

Publications (1)

Publication Number Publication Date
CH392705A true CH392705A (en) 1965-05-31

Family

ID=4262807

Family Applications (1)

Application Number Title Priority Date Filing Date
CH375662A CH392705A (en) 1962-03-29 1962-03-29 Arrangement for cooling power semiconductor elements with a cooling plate

Country Status (2)

Country Link
CH (1) CH392705A (en)
DE (1) DE1264614B (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE25853E (en) * 1959-03-11 1965-09-07 Transistor heat sink

Also Published As

Publication number Publication date
DE1264614B (en) 1968-03-28

Similar Documents

Publication Publication Date Title
CH416698A (en) Gas-cooled heat exchanger for cooling liquids
CH357471A (en) Rectifier unit with air-cooled semiconductor rectifier elements
CH462336A (en) Nuclear power plant with CO2 cooling
FR1396998A (en) Advanced power plan transistron
AT260960B (en) Indexing device
CH401179A (en) Arrangement with a fuel element
CH404012A (en) Arrangement for power supply in a furnace for the melt-electrolytic production of aluminum
AT281166B (en) Arrangement for fastening electrical devices
CH392705A (en) Arrangement for cooling power semiconductor elements with a cooling plate
AT253967B (en) Clamping plate
CH412090A (en) Rectifier circuit with several semiconductor rectifier elements
AT269994B (en) Power converters with thyristors
CH445662A (en) Gas-cooled nuclear reactor with a device for driving cooling gas fans
AT238897B (en) Cover plate
CH530092A (en) Device for cooling power semiconductor components
CH371148A (en) Circuit arrangement with a transistor operated in a collector circuit
FR1340727A (en) Advanced forklift
AT249586B (en) Device for conveying plates
CH480891A (en) Device for cooling molds
FR1417766A (en) advanced handling equipment
CH395301A (en) Rectifier arrangement with semiconductor elements
AT239922B (en) Arrangement with parallel-connected semiconductor valves
FR1384727A (en) Improvements to electrical modules
CH396148A (en) Set up on an electrical switch with multiple interruptions
FR1349358A (en) Advanced screwdriver