CH320965A - Method for soldering a printed circuit to a group of switching elements and an assembly produced thereafter - Google Patents

Method for soldering a printed circuit to a group of switching elements and an assembly produced thereafter

Info

Publication number
CH320965A
CH320965A CH320965DA CH320965A CH 320965 A CH320965 A CH 320965A CH 320965D A CH320965D A CH 320965DA CH 320965 A CH320965 A CH 320965A
Authority
CH
Switzerland
Prior art keywords
soldering
group
printed circuit
switching elements
assembly produced
Prior art date
Application number
Other languages
German (de)
Inventor
Pessel Leopold
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of CH320965A publication Critical patent/CH320965A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J9/00—Hammer-impression mechanisms
    • B41J9/02—Hammers; Arrangements thereof
    • B41J9/04—Hammers; Arrangements thereof of single hammers, e.g. travelling along printing line
    • B41J9/06—Hammers; Arrangements thereof of single hammers, e.g. travelling along printing line of stationary hammers, e.g. engaging a single type-carrier
    • B41J9/08—Hammers; Arrangements thereof of single hammers, e.g. travelling along printing line of stationary hammers, e.g. engaging a single type-carrier engaging more than one type-carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0684—Solder baths with dipping means with means for oscillating the workpiece
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
CH320965D 1952-05-24 1953-05-23 Method for soldering a printed circuit to a group of switching elements and an assembly produced thereafter CH320965A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US320965XA 1952-05-24 1952-05-24

Publications (1)

Publication Number Publication Date
CH320965A true CH320965A (en) 1957-04-15

Family

ID=21863082

Family Applications (1)

Application Number Title Priority Date Filing Date
CH320965D CH320965A (en) 1952-05-24 1953-05-23 Method for soldering a printed circuit to a group of switching elements and an assembly produced thereafter

Country Status (3)

Country Link
CH (1) CH320965A (en)
FR (1) FR1077695A (en)
GB (1) GB783874A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1276766B (en) * 1962-07-03 1968-09-05 Siemens Ag Assembly unit for a system of electrical communications engineering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1276766B (en) * 1962-07-03 1968-09-05 Siemens Ag Assembly unit for a system of electrical communications engineering
DE1276766C2 (en) * 1962-07-03 1973-10-18 Siemens Ag Assembly unit for a system of electrical communications engineering

Also Published As

Publication number Publication date
GB783874A (en) 1957-10-02
FR1077695A (en) 1954-11-10

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