CH284905A - Verfahren zur Herstellung eines einen Stromkreis enthaltenden geschichteten Gebildes. - Google Patents

Verfahren zur Herstellung eines einen Stromkreis enthaltenden geschichteten Gebildes.

Info

Publication number
CH284905A
CH284905A CH284905DA CH284905A CH 284905 A CH284905 A CH 284905A CH 284905D A CH284905D A CH 284905DA CH 284905 A CH284905 A CH 284905A
Authority
CH
Switzerland
Prior art keywords
making
circuit
layered structure
structure containing
layered
Prior art date
Application number
Other languages
German (de)
English (en)
Inventor
Ag Standard Telephon Und Radio
Original Assignee
Standard Telephon & Radio Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephon & Radio Ag filed Critical Standard Telephon & Radio Ag
Publication of CH284905A publication Critical patent/CH284905A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CH284905D 1947-06-25 1948-06-21 Verfahren zur Herstellung eines einen Stromkreis enthaltenden geschichteten Gebildes. CH284905A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB284905X 1947-06-25

Publications (1)

Publication Number Publication Date
CH284905A true CH284905A (de) 1952-08-15

Family

ID=10276468

Family Applications (1)

Application Number Title Priority Date Filing Date
CH284905D CH284905A (de) 1947-06-25 1948-06-21 Verfahren zur Herstellung eines einen Stromkreis enthaltenden geschichteten Gebildes.

Country Status (4)

Country Link
US (1) US2547022A (en:Method)
BE (1) BE483459A (en:Method)
CH (1) CH284905A (en:Method)
FR (1) FR968196A (en:Method)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2641672A (en) * 1950-05-08 1953-06-09 Northrop Aircraft Inc Electrical conductor
US2736677A (en) * 1950-12-01 1956-02-28 Technograph Printed Circuits L Metallized insulators
BE514138A (en:Method) * 1951-09-14
US2862992A (en) * 1954-05-03 1958-12-02 Bell Telephone Labor Inc Electrical network assembly
US2913632A (en) * 1955-08-08 1959-11-17 Austin N Stanton Micro-circuits, electric devices there-for, and methods for making same
DE1069235B (en:Method) * 1955-09-28 1959-11-19
US2876393A (en) * 1956-05-15 1959-03-03 Sanders Associates Inc Printed circuit baseboard
BE562405A (en:Method) * 1956-11-15
US2926326A (en) * 1957-03-05 1960-02-23 Engelhard Ind Inc Collector ring assembly
US2921263A (en) * 1957-11-26 1960-01-12 Polarad Electronics Corp Card-type thermistor mount
US2954540A (en) * 1957-12-12 1960-09-27 Gen Precision Inc Brush block
US3219749A (en) * 1961-04-21 1965-11-23 Litton Systems Inc Multilayer printed circuit board with solder access apertures
US3316619A (en) * 1963-12-09 1967-05-02 Rca Corp Method of making connections to stacked printed circuit boards
US3289045A (en) * 1964-03-02 1966-11-29 Intellux Inc Circuit module
DE1265256B (de) * 1965-11-04 1968-04-04 Siemens Ag Verfahren zur Herstellung einer Duennschichtbaugruppe der Elektronik
US3424854A (en) * 1967-07-20 1969-01-28 Motorola Inc Multilayer printed circuit with soldered eyelets forming the sole means joining the same
JPS5278069A (en) * 1975-12-24 1977-07-01 Fuji Kinzoku Kakou Kk Printed circuit board
NL8202285A (nl) * 1982-06-07 1984-01-02 Philips Nv Inrichting met een electrische schakeling op een printplaat.
DE102007022337A1 (de) * 2007-05-12 2008-11-20 Semikron Elektronik Gmbh & Co. Kg Gesintertes Leistungshalbleitersubstrat sowie Herstellungsverfahren hierzu
DE102012025409A1 (de) * 2012-12-20 2014-06-26 Thomas Hofmann Leiterplatte mit echtholzlagenverbundwerkstoff

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1647474A (en) * 1923-10-25 1927-11-01 Frederick W Seymour Variable pathway
US2066876A (en) * 1934-07-02 1937-01-05 Rca Corp Wiring system for electrical apparatus

Also Published As

Publication number Publication date
BE483459A (en:Method)
FR968196A (fr) 1950-11-21
US2547022A (en) 1951-04-03

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