CH255827A - Method and device for electroforming plate-shaped semiconductor elements. - Google Patents
Method and device for electroforming plate-shaped semiconductor elements.Info
- Publication number
- CH255827A CH255827A CH255827DA CH255827A CH 255827 A CH255827 A CH 255827A CH 255827D A CH255827D A CH 255827DA CH 255827 A CH255827 A CH 255827A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor elements
- shaped semiconductor
- electroforming plate
- electroforming
- plate
- Prior art date
Links
- 238000005323 electroforming Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
- H01L21/14—Treatment of the complete device, e.g. by electroforming to form a barrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US255827XA | 1945-11-24 | 1945-11-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH255827A true CH255827A (en) | 1948-07-15 |
Family
ID=21826893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH255827D CH255827A (en) | 1945-11-24 | 1946-10-31 | Method and device for electroforming plate-shaped semiconductor elements. |
Country Status (3)
Country | Link |
---|---|
BE (1) | BE469231A (en) |
CH (1) | CH255827A (en) |
FR (1) | FR935523A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1049009B (en) * | 1954-04-30 | 1959-01-22 | Siemens Ag | Dry rectifier arrangement with perforated rectifier elements |
-
0
- BE BE469231D patent/BE469231A/xx unknown
-
1946
- 1946-10-31 CH CH255827D patent/CH255827A/en unknown
- 1946-10-31 FR FR935523D patent/FR935523A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR935523A (en) | 1948-06-22 |
BE469231A (en) |
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