CA991521A - Method of joining two bodies - Google Patents

Method of joining two bodies

Info

Publication number
CA991521A
CA991521A CA183,617A CA183617A CA991521A CA 991521 A CA991521 A CA 991521A CA 183617 A CA183617 A CA 183617A CA 991521 A CA991521 A CA 991521A
Authority
CA
Canada
Prior art keywords
joining
bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA183,617A
Other languages
English (en)
Other versions
CA183617S (en
Inventor
Kent B. Connole
Wesley P. Townsend
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of CA991521A publication Critical patent/CA991521A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/06—Coating with compositions not containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
CA183,617A 1973-03-08 1973-10-17 Method of joining two bodies Expired CA991521A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US339459A US3861978A (en) 1973-03-08 1973-03-08 Method of joining two bodies after treatment with an inorganic colloid

Publications (1)

Publication Number Publication Date
CA991521A true CA991521A (en) 1976-06-22

Family

ID=23329084

Family Applications (1)

Application Number Title Priority Date Filing Date
CA183,617A Expired CA991521A (en) 1973-03-08 1973-10-17 Method of joining two bodies

Country Status (11)

Country Link
US (1) US3861978A (nl)
JP (1) JPS5222787B2 (nl)
BE (1) BE811990A (nl)
CA (1) CA991521A (nl)
CH (1) CH606373A5 (nl)
DE (1) DE2410858C2 (nl)
FR (1) FR2220705B1 (nl)
GB (1) GB1466333A (nl)
IT (1) IT1011553B (nl)
NL (1) NL158214B (nl)
SE (1) SE409039B (nl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968221A (en) * 1972-05-05 1976-07-06 Medi-Physics, Inc. 99M-Technetium labeled tin colloid radiopharmaceuticals
US3976274A (en) * 1975-05-27 1976-08-24 The United States Of America As Represented By The Secretary Of The Navy Permanent attachment for suction cups
JPS5456564A (en) * 1977-10-13 1979-05-07 Kondo Giken Yuugen Artificial hair
US4482418A (en) * 1983-08-17 1984-11-13 International Business Machines Corporation Bonding method for producing very thin bond lines
EP0267868B1 (en) * 1986-11-12 1992-08-05 United Technologies Corporation Pretreatment process for amorphous hydrated metal oxide primer for organic adhesively bonded joints
US4888079A (en) * 1987-10-21 1989-12-19 United Technologies Corporation Method for bonding joints with an organic adhesive using a water soluble amorphous hydrated metal oxide primer
US5742118A (en) * 1988-09-09 1998-04-21 Hitachi, Ltd. Ultrafine particle film, process for producing the same, transparent plate and image display plate
US5189337A (en) * 1988-09-09 1993-02-23 Hitachi, Ltd. Ultrafine particles for use in a cathode ray tube or an image display face plate
US4961971A (en) * 1988-12-19 1990-10-09 United Technologies Corporation Method of making oxidatively stable water soluble amorphous hydrated metal oxide sized fibers
US5112418A (en) * 1989-12-13 1992-05-12 United Technologies Corporation Method for bonding joints with an organic adhesive using a water soluble silane modified amorphous hydrated metal oxide primer
US6342434B1 (en) 1995-12-04 2002-01-29 Hitachi, Ltd. Methods of processing semiconductor wafer, and producing IC card, and carrier
DE19609033A1 (de) * 1996-03-08 1997-09-11 Beiersdorf Ag Klebfilm mit Haftvermittler

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB559075A (en) * 1942-04-09 1944-02-03 Meyer Hans Improvements in or relating to the production of compound fabrics
US3361589A (en) * 1964-10-05 1968-01-02 Du Pont Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
US3657003A (en) * 1970-02-02 1972-04-18 Western Electric Co Method of rendering a non-wettable surface wettable
US3767590A (en) * 1971-06-21 1973-10-23 Western Electric Co Method of producing nondetergent aqueous wetting solutions

Also Published As

Publication number Publication date
JPS508872A (nl) 1975-01-29
JPS5222787B2 (nl) 1977-06-20
BE811990A (fr) 1974-07-01
NL158214B (nl) 1978-10-16
FR2220705A1 (nl) 1974-10-04
CH606373A5 (nl) 1978-10-31
SE409039B (sv) 1979-07-23
IT1011553B (it) 1977-02-10
NL7403032A (nl) 1974-09-10
US3861978A (en) 1975-01-21
DE2410858A1 (de) 1974-10-03
DE2410858C2 (de) 1984-05-10
FR2220705B1 (nl) 1977-03-04
GB1466333A (en) 1977-03-09

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Legal Events

Date Code Title Description
MKEX Expiry

Effective date: 19930622