CA896186A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
CA896186A
CA896186A CA896186A CA896186DA CA896186A CA 896186 A CA896186 A CA 896186A CA 896186 A CA896186 A CA 896186A CA 896186D A CA896186D A CA 896186DA CA 896186 A CA896186 A CA 896186A
Authority
CA
Canada
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA896186A
Inventor
Van Steensel Kees
J. H. Gelsing Richardus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Publication date
Application granted granted Critical
Publication of CA896186A publication Critical patent/CA896186A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
CA896186A Semiconductor device Expired CA896186A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA896186T

Publications (1)

Publication Number Publication Date
CA896186A true CA896186A (en) 1972-03-21

Family

ID=36402152

Family Applications (1)

Application Number Title Priority Date Filing Date
CA896186A Expired CA896186A (en) Semiconductor device

Country Status (1)

Country Link
CA (1) CA896186A (en)

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