CA885689A - Encapsulated beam lead construction for semiconductor device and assembly and method - Google Patents

Encapsulated beam lead construction for semiconductor device and assembly and method

Info

Publication number
CA885689A
CA885689A CA885689A CA885689DA CA885689A CA 885689 A CA885689 A CA 885689A CA 885689 A CA885689 A CA 885689A CA 885689D A CA885689D A CA 885689DA CA 885689 A CA885689 A CA 885689A
Authority
CA
Canada
Prior art keywords
assembly
semiconductor device
beam lead
lead construction
encapsulated beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA885689A
Inventor
P. Youmans Albert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signetics Corp
Original Assignee
Signetics Corp
Publication date
Application granted granted Critical
Publication of CA885689A publication Critical patent/CA885689A/en
Expired legal-status Critical Current

Links

CA885689A Encapsulated beam lead construction for semiconductor device and assembly and method Expired CA885689A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA885689T

Publications (1)

Publication Number Publication Date
CA885689A true CA885689A (en) 1971-11-09

Family

ID=36391984

Family Applications (1)

Application Number Title Priority Date Filing Date
CA885689A Expired CA885689A (en) Encapsulated beam lead construction for semiconductor device and assembly and method

Country Status (1)

Country Link
CA (1) CA885689A (en)

Similar Documents

Publication Publication Date Title
CA920721A (en) Method of making thermo-compression-bonded semiconductor device
CA963173A (en) Semiconductor device and method of manufacturing the semiconductor device
AU466690B2 (en) Semiconductor device and method of manufacturing the same
CA963172A (en) Semiconductor device and method of manufacturing the device
AU473855B2 (en) Semiconductor device and method of manufacturing the device
CA982279A (en) Semiconductor chip bonding tape and method
CA885689A (en) Encapsulated beam lead construction for semiconductor device and assembly and method
CA918300A (en) Semiconductor device and method of manufacturing the device
CA964382A (en) Semiconductor device assembly
KR780000422B1 (en) Encapsulated beam lead construction for semiconductor device and assembly and method
CA934481A (en) Method of fabricating semiconductor devices
CA845884A (en) Semiconductor device and a method of manufacturing the same
CA844792A (en) Method of and means for encapsulating semiconductor devices
CA874138A (en) Semiconductor package and method for making
CA845347A (en) Semiconductor device and fabrication method therefor
CA838336A (en) Lead frame package for semiconductor devices and method for making same
CA862946A (en) Semiconductor device and method
CA912172A (en) Method of encapsulating beam lead semiconductor devices
CA840645A (en) Epoxy encapsulated semiconductor device
CA836794A (en) Epoxy encapsulated semiconductor device
CA850298A (en) Encapsulated semiconductor device
CA858738A (en) Semiconductor device and method of manufacturing the same
CA849192A (en) Semi-conductor device and its manufacturing method
CA859942A (en) Semiconductor device and method of making the same
CA910488A (en) Lead frame for semiconductor devices and method for making same