CA788414A - Metallizing flexible substrata - Google Patents

Metallizing flexible substrata

Info

Publication number
CA788414A
CA788414A CA788414DA CA788414A CA 788414 A CA788414 A CA 788414A CA 788414D A CA788414D A CA 788414DA CA 788414 A CA788414 A CA 788414A
Authority
CA
Canada
Prior art keywords
metallizing
substrata
flexible
flexible substrata
metallizing flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Inventor
Frederick W. Schneble, Jr.
Polichette Joseph
J. Leech Edward
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Publication date
Application granted granted Critical
Publication of CA788414A publication Critical patent/CA788414A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
CA788414D Metallizing flexible substrata Expired CA788414A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA788414T

Publications (1)

Publication Number Publication Date
CA788414A true CA788414A (en) 1968-06-25

Family

ID=36252359

Family Applications (1)

Application Number Title Priority Date Filing Date
CA788414D Expired CA788414A (en) Metallizing flexible substrata

Country Status (1)

Country Link
CA (1) CA788414A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105732542A (en) * 2014-12-30 2016-07-06 罗门哈斯电子材料有限责任公司 Sulfonamide based polymers for copper electroplating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105732542A (en) * 2014-12-30 2016-07-06 罗门哈斯电子材料有限责任公司 Sulfonamide based polymers for copper electroplating
EP3048190A1 (en) * 2014-12-30 2016-07-27 Rohm and Haas Electronic Materials LLC Sulfonamide based polymers for copper electroplating
CN105732542B (en) * 2014-12-30 2020-02-14 罗门哈斯电子材料有限责任公司 Sulfonamide-based polymers for copper electroplating

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