CA736135A - Method of separating into pieces thin wafer-shaped plates of brittle material - Google Patents

Method of separating into pieces thin wafer-shaped plates of brittle material

Info

Publication number
CA736135A
CA736135A CA736135A CA736135DA CA736135A CA 736135 A CA736135 A CA 736135A CA 736135 A CA736135 A CA 736135A CA 736135D A CA736135D A CA 736135DA CA 736135 A CA736135 A CA 736135A
Authority
CA
Canada
Prior art keywords
separating
shaped plates
brittle material
thin wafer
pieces thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA736135A
Inventor
R. Jefferies Gordon
R. Moran Eric
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Publication date
Application granted granted Critical
Publication of CA736135A publication Critical patent/CA736135A/en
Expired legal-status Critical Current

Links

CA736135A Method of separating into pieces thin wafer-shaped plates of brittle material Expired CA736135A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA736135T

Publications (1)

Publication Number Publication Date
CA736135A true CA736135A (en) 1966-06-07

Family

ID=36134289

Family Applications (1)

Application Number Title Priority Date Filing Date
CA736135A Expired CA736135A (en) Method of separating into pieces thin wafer-shaped plates of brittle material

Country Status (1)

Country Link
CA (1) CA736135A (en)

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