CA735394A - Gold plating - Google Patents

Gold plating

Info

Publication number
CA735394A
CA735394A CA735394A CA735394DA CA735394A CA 735394 A CA735394 A CA 735394A CA 735394 A CA735394 A CA 735394A CA 735394D A CA735394D A CA 735394DA CA 735394 A CA735394 A CA 735394A
Authority
CA
Canada
Prior art keywords
gold plating
plating
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA735394A
Inventor
I. Edson Gwynne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Publication date
Application granted granted Critical
Publication of CA735394A publication Critical patent/CA735394A/en
Expired legal-status Critical Current

Links

CA735394A Gold plating Expired CA735394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA735394T

Publications (1)

Publication Number Publication Date
CA735394A true CA735394A (en) 1966-05-31

Family

ID=36133550

Family Applications (1)

Application Number Title Priority Date Filing Date
CA735394A Expired CA735394A (en) Gold plating

Country Status (1)

Country Link
CA (1) CA735394A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices

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