CA674883A - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
CA674883A
CA674883A CA674883A CA674883DA CA674883A CA 674883 A CA674883 A CA 674883A CA 674883 A CA674883 A CA 674883A CA 674883D A CA674883D A CA 674883DA CA 674883 A CA674883 A CA 674883A
Authority
CA
Canada
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA674883A
Inventor
M. Luce Betty
Paul Makowski M.
L. Selker Milton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Clevite Corp
Original Assignee
Clevite Corp
Publication date
Application granted granted Critical
Publication of CA674883A publication Critical patent/CA674883A/en
Expired legal-status Critical Current

Links

CA674883A Electroless copper plating Expired CA674883A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA674883T

Publications (1)

Publication Number Publication Date
CA674883A true CA674883A (en) 1963-11-26

Family

ID=35975242

Family Applications (1)

Application Number Title Priority Date Filing Date
CA674883A Expired CA674883A (en) Electroless copper plating

Country Status (1)

Country Link
CA (1) CA674883A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3318711A (en) * 1964-04-02 1967-05-09 Sel Rex Corp Immersion plating process for the deposition of copper
US3454407A (en) * 1965-09-09 1969-07-08 Collardin Gmbh Gerhard Process for the deposition of copper-tin layers in the absence of current
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3318711A (en) * 1964-04-02 1967-05-09 Sel Rex Corp Immersion plating process for the deposition of copper
US3454407A (en) * 1965-09-09 1969-07-08 Collardin Gmbh Gerhard Process for the deposition of copper-tin layers in the absence of current
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating

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