CA671383A - Soldering of aluminum - Google Patents

Soldering of aluminum

Info

Publication number
CA671383A
CA671383A CA671383A CA671383DA CA671383A CA 671383 A CA671383 A CA 671383A CA 671383 A CA671383 A CA 671383A CA 671383D A CA671383D A CA 671383DA CA 671383 A CA671383 A CA 671383A
Authority
CA
Canada
Prior art keywords
soldering
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA671383A
Inventor
M. Bouton George
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Publication date
Application granted granted Critical
Publication of CA671383A publication Critical patent/CA671383A/en
Expired legal-status Critical Current

Links

CA671383A Soldering of aluminum Expired CA671383A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA671383T

Publications (1)

Publication Number Publication Date
CA671383A true CA671383A (en) 1963-10-01

Family

ID=35971740

Family Applications (1)

Application Number Title Priority Date Filing Date
CA671383A Expired CA671383A (en) Soldering of aluminum

Country Status (1)

Country Link
CA (1) CA671383A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633266A (en) * 1969-06-05 1972-01-11 Reynolds Metals Co Method of soldering aluminous component
US3680196A (en) * 1970-05-08 1972-08-01 Us Navy Process for bonding chip devices to hybrid circuitry

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3633266A (en) * 1969-06-05 1972-01-11 Reynolds Metals Co Method of soldering aluminous component
US3680196A (en) * 1970-05-08 1972-08-01 Us Navy Process for bonding chip devices to hybrid circuitry

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